CN1091950C - 半导体器件及其装配方法 - Google Patents

半导体器件及其装配方法 Download PDF

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Publication number
CN1091950C
CN1091950C CN97111651A CN97111651A CN1091950C CN 1091950 C CN1091950 C CN 1091950C CN 97111651 A CN97111651 A CN 97111651A CN 97111651 A CN97111651 A CN 97111651A CN 1091950 C CN1091950 C CN 1091950C
Authority
CN
China
Prior art keywords
lead
semiconductor chip
adhesive
semiconductor device
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN97111651A
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English (en)
Chinese (zh)
Other versions
CN1165400A (zh
Inventor
大内伸仁
山田悦夫
白石靖
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Publication of CN1165400A publication Critical patent/CN1165400A/zh
Application granted granted Critical
Publication of CN1091950C publication Critical patent/CN1091950C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H10W74/01—
    • H10W70/415—
    • H10W72/0113—
    • H10W72/07352—
    • H10W72/321—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/865—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
CN97111651A 1996-04-10 1997-04-10 半导体器件及其装配方法 Expired - Fee Related CN1091950C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP86968/96 1996-04-10
JP8086968A JPH09283545A (ja) 1996-04-10 1996-04-10 樹脂封止型半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
CN1165400A CN1165400A (zh) 1997-11-19
CN1091950C true CN1091950C (zh) 2002-10-02

Family

ID=13901682

Family Applications (1)

Application Number Title Priority Date Filing Date
CN97111651A Expired - Fee Related CN1091950C (zh) 1996-04-10 1997-04-10 半导体器件及其装配方法

Country Status (7)

Country Link
US (1) US6097083A (enExample)
EP (1) EP0801424B1 (enExample)
JP (1) JPH09283545A (enExample)
KR (1) KR100366110B1 (enExample)
CN (1) CN1091950C (enExample)
DE (1) DE69735032T2 (enExample)
TW (1) TW494507B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5969410A (en) * 1996-05-09 1999-10-19 Oki Electric Industry Co., Ltd. Semiconductor IC device having chip support element and electrodes on the same surface
JP2001320007A (ja) * 2000-05-09 2001-11-16 Dainippon Printing Co Ltd 樹脂封止型半導体装置用フレーム
JP2005277415A (ja) * 2004-03-23 2005-10-06 Samsung Electronics Co Ltd リードチップ直接付着型半導体パッケージ、その製造方法及び装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06105721B2 (ja) * 1985-03-25 1994-12-21 日立超エル・エス・アイエンジニアリング株式会社 半導体装置
US4974057A (en) * 1986-10-31 1990-11-27 Texas Instruments Incorporated Semiconductor device package with circuit board and resin
JPS6437132U (enExample) * 1987-08-31 1989-03-06
JPH02125454A (ja) * 1988-11-02 1990-05-14 Nec Corp 樹脂封止型半導体装置
US5403785A (en) * 1991-03-03 1995-04-04 Matsushita Electric Works, Ltd. Process of fabrication IC chip package from an IC chip carrier substrate and a leadframe and the IC chip package fabricated thereby
SG44840A1 (en) * 1992-09-09 1997-12-19 Texas Instruments Inc Reduced capacitance lead frame for lead on chip package
JP3137518B2 (ja) * 1993-10-29 2001-02-26 株式会社巴川製紙所 電子部品用液状接着剤およびそれを用いる絶縁接着層の形成方法
TW270213B (enExample) * 1993-12-08 1996-02-11 Matsushita Electric Industrial Co Ltd
US5545921A (en) * 1994-11-04 1996-08-13 International Business Machines, Corporation Personalized area leadframe coining or half etching for reduced mechanical stress at device edge
JP3127195B2 (ja) * 1994-12-06 2001-01-22 シャープ株式会社 発光デバイスおよびその製造方法
TW314650B (enExample) * 1995-06-21 1997-09-01 Oki Electric Ind Co Ltd

Also Published As

Publication number Publication date
US6097083A (en) 2000-08-01
JPH09283545A (ja) 1997-10-31
KR970072220A (ko) 1997-11-07
EP0801424B1 (en) 2006-01-04
DE69735032D1 (de) 2006-03-30
TW494507B (en) 2002-07-11
CN1165400A (zh) 1997-11-19
DE69735032T2 (de) 2006-08-31
EP0801424A3 (enExample) 1997-10-22
KR100366110B1 (ko) 2003-02-19
EP0801424A2 (en) 1997-10-15

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