JPH09283545A - 樹脂封止型半導体装置及びその製造方法 - Google Patents

樹脂封止型半導体装置及びその製造方法

Info

Publication number
JPH09283545A
JPH09283545A JP8086968A JP8696896A JPH09283545A JP H09283545 A JPH09283545 A JP H09283545A JP 8086968 A JP8086968 A JP 8086968A JP 8696896 A JP8696896 A JP 8696896A JP H09283545 A JPH09283545 A JP H09283545A
Authority
JP
Japan
Prior art keywords
resin
semiconductor element
lead
liquid adhesive
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP8086968A
Other languages
English (en)
Japanese (ja)
Inventor
Nobuhito Oouchi
伸仁 大内
Etsuo Yamada
悦夫 山田
Yasushi Shiraishi
靖 白石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP8086968A priority Critical patent/JPH09283545A/ja
Priority to TW086104250A priority patent/TW494507B/zh
Priority to DE69735032T priority patent/DE69735032T2/de
Priority to EP97105675A priority patent/EP0801424B1/en
Priority to CN97111651A priority patent/CN1091950C/zh
Priority to KR1019970013295A priority patent/KR100366110B1/ko
Priority to US08/827,693 priority patent/US6097083A/en
Publication of JPH09283545A publication Critical patent/JPH09283545A/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H10W74/01—
    • H10W70/415—
    • H10W72/0113—
    • H10W72/07352—
    • H10W72/321—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/865—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
JP8086968A 1996-04-10 1996-04-10 樹脂封止型半導体装置及びその製造方法 Withdrawn JPH09283545A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP8086968A JPH09283545A (ja) 1996-04-10 1996-04-10 樹脂封止型半導体装置及びその製造方法
TW086104250A TW494507B (en) 1996-04-10 1997-04-02 Semiconductor device and its assembling method
DE69735032T DE69735032T2 (de) 1996-04-10 1997-04-07 Halbleiteranordnung und Verfahren zum Zusammensetzen derselben
EP97105675A EP0801424B1 (en) 1996-04-10 1997-04-07 Semiconductor device and assembling method thereof
CN97111651A CN1091950C (zh) 1996-04-10 1997-04-10 半导体器件及其装配方法
KR1019970013295A KR100366110B1 (ko) 1996-04-10 1997-04-10 반도체장치및그실장방법
US08/827,693 US6097083A (en) 1996-04-10 1997-04-10 Semiconductor device which is crack resistant

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8086968A JPH09283545A (ja) 1996-04-10 1996-04-10 樹脂封止型半導体装置及びその製造方法

Publications (1)

Publication Number Publication Date
JPH09283545A true JPH09283545A (ja) 1997-10-31

Family

ID=13901682

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8086968A Withdrawn JPH09283545A (ja) 1996-04-10 1996-04-10 樹脂封止型半導体装置及びその製造方法

Country Status (7)

Country Link
US (1) US6097083A (enExample)
EP (1) EP0801424B1 (enExample)
JP (1) JPH09283545A (enExample)
KR (1) KR100366110B1 (enExample)
CN (1) CN1091950C (enExample)
DE (1) DE69735032T2 (enExample)
TW (1) TW494507B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005277415A (ja) * 2004-03-23 2005-10-06 Samsung Electronics Co Ltd リードチップ直接付着型半導体パッケージ、その製造方法及び装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5969410A (en) * 1996-05-09 1999-10-19 Oki Electric Industry Co., Ltd. Semiconductor IC device having chip support element and electrodes on the same surface
JP2001320007A (ja) * 2000-05-09 2001-11-16 Dainippon Printing Co Ltd 樹脂封止型半導体装置用フレーム

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06105721B2 (ja) * 1985-03-25 1994-12-21 日立超エル・エス・アイエンジニアリング株式会社 半導体装置
US4974057A (en) * 1986-10-31 1990-11-27 Texas Instruments Incorporated Semiconductor device package with circuit board and resin
JPS6437132U (enExample) * 1987-08-31 1989-03-06
JPH02125454A (ja) * 1988-11-02 1990-05-14 Nec Corp 樹脂封止型半導体装置
US5403785A (en) * 1991-03-03 1995-04-04 Matsushita Electric Works, Ltd. Process of fabrication IC chip package from an IC chip carrier substrate and a leadframe and the IC chip package fabricated thereby
SG44840A1 (en) * 1992-09-09 1997-12-19 Texas Instruments Inc Reduced capacitance lead frame for lead on chip package
JP3137518B2 (ja) * 1993-10-29 2001-02-26 株式会社巴川製紙所 電子部品用液状接着剤およびそれを用いる絶縁接着層の形成方法
TW270213B (enExample) * 1993-12-08 1996-02-11 Matsushita Electric Industrial Co Ltd
US5545921A (en) * 1994-11-04 1996-08-13 International Business Machines, Corporation Personalized area leadframe coining or half etching for reduced mechanical stress at device edge
JP3127195B2 (ja) * 1994-12-06 2001-01-22 シャープ株式会社 発光デバイスおよびその製造方法
TW314650B (enExample) * 1995-06-21 1997-09-01 Oki Electric Ind Co Ltd

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005277415A (ja) * 2004-03-23 2005-10-06 Samsung Electronics Co Ltd リードチップ直接付着型半導体パッケージ、その製造方法及び装置

Also Published As

Publication number Publication date
US6097083A (en) 2000-08-01
KR970072220A (ko) 1997-11-07
EP0801424B1 (en) 2006-01-04
DE69735032D1 (de) 2006-03-30
TW494507B (en) 2002-07-11
CN1165400A (zh) 1997-11-19
DE69735032T2 (de) 2006-08-31
EP0801424A3 (enExample) 1997-10-22
CN1091950C (zh) 2002-10-02
KR100366110B1 (ko) 2003-02-19
EP0801424A2 (en) 1997-10-15

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Legal Events

Date Code Title Description
A300 Application deemed to be withdrawn because no request for examination was validly filed

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20030701