TW467807B - Chemical mechanical polishing apparatus and method for washing contaminant off polishing head - Google Patents

Chemical mechanical polishing apparatus and method for washing contaminant off polishing head Download PDF

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Publication number
TW467807B
TW467807B TW089111440A TW89111440A TW467807B TW 467807 B TW467807 B TW 467807B TW 089111440 A TW089111440 A TW 089111440A TW 89111440 A TW89111440 A TW 89111440A TW 467807 B TW467807 B TW 467807B
Authority
TW
Taiwan
Prior art keywords
wafer
deionized water
polishing head
cmp
cleaning
Prior art date
Application number
TW089111440A
Other languages
English (en)
Chinese (zh)
Inventor
Yo-Han An
Byung-Moo Lee
Jae-Won Choi
Tae-Ho Kim
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Application granted granted Critical
Publication of TW467807B publication Critical patent/TW467807B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW089111440A 1999-06-16 2000-06-12 Chemical mechanical polishing apparatus and method for washing contaminant off polishing head TW467807B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019990022542A KR100304706B1 (ko) 1999-06-16 1999-06-16 화학기계적 연마장치 및 연마 헤드 내부의 오염 물질 세척방법

Publications (1)

Publication Number Publication Date
TW467807B true TW467807B (en) 2001-12-11

Family

ID=19592799

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089111440A TW467807B (en) 1999-06-16 2000-06-12 Chemical mechanical polishing apparatus and method for washing contaminant off polishing head

Country Status (4)

Country Link
US (1) US6402598B1 (ja)
JP (1) JP4065650B2 (ja)
KR (1) KR100304706B1 (ja)
TW (1) TW467807B (ja)

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WO2001064391A2 (en) * 2000-02-29 2001-09-07 Applied Materials, Inc. Planarization system with a wafer transfer corridor and multiple polishing modules
US6481447B1 (en) * 2000-09-27 2002-11-19 Lam Research Corporation Fluid delivery ring and methods for making and implementing the same
JP2003071709A (ja) * 2001-08-27 2003-03-12 Applied Materials Inc 基板の受け渡し方法および機械化学的研磨装置
US20060255016A1 (en) * 2002-01-17 2006-11-16 Novellus Systems, Inc. Method for polishing copper on a workpiece surface
KR100470229B1 (ko) * 2002-02-08 2005-02-05 두산디앤디 주식회사 화학기계적 연마장치의 로딩디바이스
KR100495659B1 (ko) * 2002-06-21 2005-06-16 삼성전자주식회사 화학적 기계적 평탄화 기계의 폴리싱 스테이션
KR100500517B1 (ko) * 2002-10-22 2005-07-12 삼성전자주식회사 반도체 웨이퍼용 ｃｍｐ 설비
US7044832B2 (en) * 2003-11-17 2006-05-16 Applied Materials Load cup for chemical mechanical polishing
KR100536175B1 (ko) * 2004-04-14 2005-12-12 두산디앤디 주식회사 반도체 웨이퍼의 화학기계적 연마장치용 로딩디바이스
US7052376B1 (en) * 2005-05-26 2006-05-30 United Microelectronics Corp. Wafer carrier gap washer
US7172496B1 (en) * 2005-08-17 2007-02-06 Agere Systems, Inc. Method and apparatus for cleaning slurry depositions from a water carrier
US7258599B2 (en) * 2005-09-15 2007-08-21 Fujitsu Limited Polishing machine, workpiece supporting table pad, polishing method and manufacturing method of semiconductor device
KR100705355B1 (ko) * 2006-12-14 2007-04-09 (주)건우기술 워터젯 시스템의 분사노즐 장치
US7750657B2 (en) * 2007-03-15 2010-07-06 Applied Materials Inc. Polishing head testing with movable pedestal
US7811153B1 (en) * 2007-03-30 2010-10-12 Novellus Systems, Inc. High throughput servo load cup with integrated wet chemistry delivery
CN101362313B (zh) * 2007-08-09 2010-11-10 中芯国际集成电路制造(上海)有限公司 化学机械研磨设备及化学机械研磨方法
KR101358645B1 (ko) * 2007-09-04 2014-02-05 삼성전자주식회사 웨이퍼 연마 캐리어 장치 및 그가 채용되는 화학적 기계적연마 설비
CN101407039B (zh) * 2007-10-09 2010-12-22 中芯国际集成电路制造(上海)有限公司 一种防止研磨机台上研磨料聚合的喷水装置及其使用方法
JP2009212459A (ja) * 2008-03-06 2009-09-17 Sharp Corp Ｃｍｐ装置及びウェハーの洗浄方法
KR200458010Y1 (ko) * 2008-12-12 2012-01-16 시너스(주) 화학적 기계적 연마장치용 에이치씨엘유 링 구조물
KR101130888B1 (ko) * 2010-05-10 2012-03-28 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드의 세정 유닛 및 이를 이용한 이동식 화학 기계적 연마 시스템
JP2015062956A (ja) * 2012-09-19 2015-04-09 株式会社荏原製作所 研磨装置
JP6055648B2 (ja) * 2012-10-26 2016-12-27 株式会社荏原製作所 研磨装置及び研磨方法
JP2014130881A (ja) * 2012-12-28 2014-07-10 Ebara Corp 研磨装置
JP5927129B2 (ja) * 2013-01-31 2016-05-25 株式会社荏原製作所 研磨装置
US20150017889A1 (en) * 2013-07-12 2015-01-15 Ebara Corporation Polishing apparatus
KR102036929B1 (ko) * 2013-12-23 2019-10-25 주식회사 케이씨텍 화학 기계적 연마 시스템의 캐리어 헤드의 세정 장치
US9539699B2 (en) * 2014-08-28 2017-01-10 Ebara Corporation Polishing method
JP6225088B2 (ja) * 2014-09-12 2017-11-01 株式会社荏原製作所 研磨方法および研磨装置
CN106112809A (zh) * 2016-08-08 2016-11-16 泉州装备制造研究所 自适应智能石材磨抛系统
JP6844970B2 (ja) * 2016-08-18 2021-03-17 株式会社ディスコ 研磨装置
CN106625207B (zh) * 2016-09-27 2018-11-20 天津华海清科机电科技有限公司 晶圆片的卸片方法、辅助装置、装置和具有其的cmp设备
CN109277940B (zh) * 2017-07-20 2021-02-26 中芯国际集成电路制造(上海)有限公司 一种化学机械研磨装置和化学机械研磨方法
US11292101B2 (en) * 2017-11-22 2022-04-05 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and method
KR102385573B1 (ko) * 2017-12-13 2022-04-12 삼성전자주식회사 로드 컵 및 이를 포함하는 화학기계적 연마 장치
CN108890422B (zh) * 2018-06-28 2020-06-09 南京溧水高新创业投资管理有限公司 一种直筒式玻璃水杯生产用底部精加工设备
JP7316785B2 (ja) 2018-12-26 2023-07-28 株式会社荏原製作所 光学式膜厚測定システムの洗浄方法
US11705354B2 (en) 2020-07-10 2023-07-18 Applied Materials, Inc. Substrate handling systems
JP2022018685A (ja) * 2020-07-16 2022-01-27 株式会社岡本工作機械製作所 ドレッシング装置及び研磨装置
US11823916B2 (en) * 2020-11-06 2023-11-21 Applied Materials, Inc. Apparatus and method of substrate edge cleaning and substrate carrier head gap cleaning
CN115179111B (zh) * 2022-06-29 2023-10-24 大连理工大学 一种潮解工件的浴法抛光方法及装置

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JPS58171825A (ja) * 1982-04-01 1983-10-08 Toshiba Mach Co Ltd 両面ポリシング装置
JPH0798302B2 (ja) * 1986-03-25 1995-10-25 スピ−ドフアム株式会社 平面研磨装置
JPH0624202B2 (ja) * 1987-01-20 1994-03-30 富士通株式会社 水洗式中間ステ−ジ
JPH08153693A (ja) * 1994-11-29 1996-06-11 Toshiba Mach Co Ltd ローダ装置
US5655954A (en) * 1994-11-29 1997-08-12 Toshiba Kikai Kabushiki Kaisha Polishing apparatus
US5738574A (en) * 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
JPH09260317A (ja) * 1996-01-19 1997-10-03 Sony Corp 基板研磨装置
US6050884A (en) * 1996-02-28 2000-04-18 Ebara Corporation Polishing apparatus
JPH10163138A (ja) * 1996-11-29 1998-06-19 Fujitsu Ltd 半導体装置の製造方法および研磨装置

Also Published As

Publication number Publication date
US6402598B1 (en) 2002-06-11
KR100304706B1 (ko) 2001-11-01
KR20010002643A (ko) 2001-01-15
JP4065650B2 (ja) 2008-03-26
JP2001015466A (ja) 2001-01-19

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