TW429409B - Alignment method - Google Patents
Alignment methodInfo
- Publication number
- TW429409B TW429409B TW087112786A TW87112786A TW429409B TW 429409 B TW429409 B TW 429409B TW 087112786 A TW087112786 A TW 087112786A TW 87112786 A TW87112786 A TW 87112786A TW 429409 B TW429409 B TW 429409B
- Authority
- TW
- Taiwan
- Prior art keywords
- alignment
- group
- chip
- alignment method
- decided
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/5442—Marks applied to semiconductor devices or parts comprising non digital, non alphanumeric information, e.g. symbols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
- H01L2223/5448—Located on chip prior to dicing and remaining on chip after dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9208999A JP3047863B2 (ja) | 1997-08-04 | 1997-08-04 | アライメント方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW429409B true TW429409B (en) | 2001-04-11 |
Family
ID=16565640
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW087112786A TW429409B (en) | 1997-08-04 | 1998-08-03 | Alignment method |
Country Status (5)
Country | Link |
---|---|
US (1) | US6084678A (zh) |
JP (1) | JP3047863B2 (zh) |
KR (1) | KR100271048B1 (zh) |
CN (1) | CN1115719C (zh) |
TW (1) | TW429409B (zh) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002289507A (ja) | 2001-03-28 | 2002-10-04 | Sanyo Electric Co Ltd | 半導体装置の製造方法 |
JP3609761B2 (ja) | 2001-07-19 | 2005-01-12 | 三洋電機株式会社 | 半導体装置の製造方法 |
KR100519789B1 (ko) * | 2003-03-20 | 2005-10-10 | 삼성전자주식회사 | 반도체 기판의 얼라인 방법 |
US6948254B2 (en) * | 2003-10-27 | 2005-09-27 | Micronic Laser Systems Ab | Method for calibration of a metrology stage |
CN100406846C (zh) * | 2006-03-20 | 2008-07-30 | 友达光电股份有限公司 | 对准检测装置及对准偏移量的检测方法 |
CN101465311B (zh) * | 2007-12-19 | 2011-12-07 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 基片偏移的诊断及校正方法和诊断及校正装置 |
CN103097956B (zh) * | 2010-02-26 | 2016-01-27 | 密克罗尼克麦达塔公司 | 用于执行图案对准的方法和装置 |
US20120049186A1 (en) * | 2010-08-31 | 2012-03-01 | Li Calvin K | Semiconductor structures |
CN103811298B (zh) * | 2012-11-15 | 2016-11-09 | 上海华虹宏力半导体制造有限公司 | 测试对准使用芯片的制作方法 |
KR102237751B1 (ko) | 2014-12-08 | 2021-04-12 | 삼성디스플레이 주식회사 | 표시 장치 |
CN105449054B (zh) * | 2015-11-11 | 2017-09-08 | 海迪科(南通)光电科技有限公司 | Led芯片的精确定位方法 |
US10115687B2 (en) * | 2017-02-03 | 2018-10-30 | Applied Materials, Inc. | Method of pattern placement correction |
WO2019067809A2 (en) * | 2017-09-29 | 2019-04-04 | Rudolph Technologies, Inc. | SYSTEM AND METHOD FOR OPTIMIZING LITHOGRAPHIC EXPOSURE METHOD |
CN108681623A (zh) * | 2018-04-11 | 2018-10-19 | 上海华虹宏力半导体制造有限公司 | 放置划片槽图形的方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4568189A (en) * | 1983-09-26 | 1986-02-04 | The United States Of America As Represented By The Secretary Of The Navy | Apparatus and method for aligning a mask and wafer in the fabrication of integrated circuits |
US4991962A (en) * | 1989-01-04 | 1991-02-12 | Kantilal Jain | High precision alignment system for microlithography |
EP0824225A3 (en) * | 1989-09-26 | 1998-03-04 | Canon Kabushiki Kaisha | Alignment method |
US5521036A (en) * | 1992-07-27 | 1996-05-28 | Nikon Corporation | Positioning method and apparatus |
US5559601A (en) * | 1994-01-24 | 1996-09-24 | Svg Lithography Systems, Inc. | Mask and wafer diffraction grating alignment system wherein the diffracted light beams return substantially along an incident angle |
JPH08233555A (ja) * | 1994-12-28 | 1996-09-13 | Matsushita Electric Ind Co Ltd | レジストパターンの測定方法及びレジストパターンの測定装置 |
-
1997
- 1997-08-04 JP JP9208999A patent/JP3047863B2/ja not_active Expired - Fee Related
-
1998
- 1998-08-03 TW TW087112786A patent/TW429409B/zh not_active IP Right Cessation
- 1998-08-04 US US09/129,124 patent/US6084678A/en not_active Expired - Fee Related
- 1998-08-04 CN CN98117136A patent/CN1115719C/zh not_active Expired - Fee Related
- 1998-08-04 KR KR1019980031684A patent/KR100271048B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPH1154404A (ja) | 1999-02-26 |
CN1115719C (zh) | 2003-07-23 |
CN1209643A (zh) | 1999-03-03 |
KR100271048B1 (ko) | 2000-12-01 |
US6084678A (en) | 2000-07-04 |
JP3047863B2 (ja) | 2000-06-05 |
KR19990023339A (ko) | 1999-03-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent | ||
MM4A | Annulment or lapse of patent due to non-payment of fees |