JPS56160039A - Printing device - Google Patents

Printing device

Info

Publication number
JPS56160039A
JPS56160039A JP6378680A JP6378680A JPS56160039A JP S56160039 A JPS56160039 A JP S56160039A JP 6378680 A JP6378680 A JP 6378680A JP 6378680 A JP6378680 A JP 6378680A JP S56160039 A JPS56160039 A JP S56160039A
Authority
JP
Japan
Prior art keywords
wafer
positioning marks
mask
exposure
make
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6378680A
Other languages
Japanese (ja)
Other versions
JPH0140486B2 (en
Inventor
Ryozo Hiraga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP6378680A priority Critical patent/JPS56160039A/en
Priority to DE19813118802 priority patent/DE3118802A1/en
Publication of JPS56160039A publication Critical patent/JPS56160039A/en
Priority to US06/471,062 priority patent/US4440493A/en
Publication of JPH0140486B2 publication Critical patent/JPH0140486B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70466—Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Abstract

PURPOSE:To enhance the resolution of the device by a method wherein a means to detect the relative slip quantity between a mask and a wafer by positioning marks provided on both and to make both to align, and a means to make the relative position of both to slip according to the positioning marks when plural times exposure are to be performed are provided. CONSTITUTION:In the device to form the mask pattern on the wafer for manufacture of a semiconductor circuit element and to print the pattern on the wafer, the relative slip quantity between the positioning marks 90 provided at the circumference of the mask and the positioning marks 95 provided at the circumference of the wafer is detected, and one of both is made to be transferred to make both to align. When plural times exposure are to be performed, the relative positional relation of both is made to differ for the prescribed quantity reading the positioning marks after respective exposure, and then next exposure is performed. Accordingly alignment and transfere of the mask and the wafer can be performed precisely, and the resolution of pattern is enhanced.
JP6378680A 1980-05-14 1980-05-14 Printing device Granted JPS56160039A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP6378680A JPS56160039A (en) 1980-05-14 1980-05-14 Printing device
DE19813118802 DE3118802A1 (en) 1980-05-14 1981-05-12 PRESSURE TRANSFER DEVICE
US06/471,062 US4440493A (en) 1980-05-14 1983-03-02 Printing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6378680A JPS56160039A (en) 1980-05-14 1980-05-14 Printing device

Publications (2)

Publication Number Publication Date
JPS56160039A true JPS56160039A (en) 1981-12-09
JPH0140486B2 JPH0140486B2 (en) 1989-08-29

Family

ID=13239397

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6378680A Granted JPS56160039A (en) 1980-05-14 1980-05-14 Printing device

Country Status (1)

Country Link
JP (1) JPS56160039A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6358825A (en) * 1986-08-29 1988-03-14 Sony Corp Pattern formation
JP2019095664A (en) * 2017-11-24 2019-06-20 キヤノン株式会社 Management method for managing processing device, management device, program and article manufacturing method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5348676A (en) * 1976-10-15 1978-05-02 Handotai Kenkyu Shinkokai Method of forming pattern

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5348676A (en) * 1976-10-15 1978-05-02 Handotai Kenkyu Shinkokai Method of forming pattern

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6358825A (en) * 1986-08-29 1988-03-14 Sony Corp Pattern formation
JP2019095664A (en) * 2017-11-24 2019-06-20 キヤノン株式会社 Management method for managing processing device, management device, program and article manufacturing method

Also Published As

Publication number Publication date
JPH0140486B2 (en) 1989-08-29

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