TW392260B - Semiconductor device and manufacture method thereof - Google Patents

Semiconductor device and manufacture method thereof Download PDF

Info

Publication number
TW392260B
TW392260B TW086115366A TW86115366A TW392260B TW 392260 B TW392260 B TW 392260B TW 086115366 A TW086115366 A TW 086115366A TW 86115366 A TW86115366 A TW 86115366A TW 392260 B TW392260 B TW 392260B
Authority
TW
Taiwan
Prior art keywords
adhesive tape
insulating adhesive
electrode pads
common
semiconductor device
Prior art date
Application number
TW086115366A
Other languages
English (en)
Chinese (zh)
Inventor
Yasufumi Uchida
Original Assignee
Oki Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Ind Co Ltd filed Critical Oki Electric Ind Co Ltd
Application granted granted Critical
Publication of TW392260B publication Critical patent/TW392260B/zh

Links

Classifications

    • H10W72/071—
    • H10W70/415—
    • H10W72/019—
    • H10W72/075—
    • H10W72/90—
    • H10W70/60—
    • H10W72/0711—
    • H10W72/29—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5445—
    • H10W72/5449—
    • H10W72/5524—
    • H10W72/581—
    • H10W72/59—
    • H10W72/932—
    • H10W72/934—
    • H10W72/951—
    • H10W72/983—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
TW086115366A 1997-03-28 1997-10-18 Semiconductor device and manufacture method thereof TW392260B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP07678097A JP3627949B2 (ja) 1997-03-28 1997-03-28 半導体装置およびその製造方法

Publications (1)

Publication Number Publication Date
TW392260B true TW392260B (en) 2000-06-01

Family

ID=13615121

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086115366A TW392260B (en) 1997-03-28 1997-10-18 Semiconductor device and manufacture method thereof

Country Status (6)

Country Link
US (1) US6137166A (enExample)
EP (1) EP0867938A3 (enExample)
JP (1) JP3627949B2 (enExample)
KR (1) KR100366114B1 (enExample)
CN (1) CN1147931C (enExample)
TW (1) TW392260B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100561549B1 (ko) * 1999-10-07 2006-03-17 삼성전자주식회사 패드 온 칩형 반도체 패키지
DE10025774A1 (de) * 2000-05-26 2001-12-06 Osram Opto Semiconductors Gmbh Halbleiterbauelement mit Oberflächenmetallisierung
US7626262B2 (en) * 2006-06-14 2009-12-01 Infineon Technologies Ag Electrically conductive connection, electronic component and method for their production
TW201205098A (en) * 2010-07-16 2012-02-01 Chroma Ate Inc Inspection fixture for semiconductor die test maintaining flatness of carrier portion

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4034399A (en) * 1976-02-27 1977-07-05 Rca Corporation Interconnection means for an array of majority carrier microwave devices
JPH04348045A (ja) 1990-05-20 1992-12-03 Hitachi Ltd 半導体装置及びその製造方法
US5227232A (en) 1991-01-23 1993-07-13 Lim Thiam B Conductive tape for semiconductor package, a lead frame without power buses for lead on chip package, and a semiconductor device with conductive tape power distribution
JPH05114622A (ja) * 1991-10-23 1993-05-07 Hitachi Ltd 半導体装置
JPH06283659A (ja) * 1993-03-25 1994-10-07 Mitsubishi Electric Corp 半導体装置
JPH06286659A (ja) 1993-03-31 1994-10-11 Suzuki Motor Corp ペダルブラケットの構造

Also Published As

Publication number Publication date
KR19980079528A (ko) 1998-11-25
US6137166A (en) 2000-10-24
CN1147931C (zh) 2004-04-28
EP0867938A2 (en) 1998-09-30
JP3627949B2 (ja) 2005-03-09
EP0867938A3 (en) 1999-03-10
JPH10270491A (ja) 1998-10-09
KR100366114B1 (ko) 2003-02-19
CN1195191A (zh) 1998-10-07

Similar Documents

Publication Publication Date Title
TW523894B (en) Semiconductor device and its manufacturing method
TW312844B (enExample)
TW520541B (en) IC chip package with directly connected leads
TW463346B (en) Dual-leadframe package structure and its manufacturing method
US20040155322A1 (en) Semiconductor package with pattern leads and method for manufacturing the same
US11688659B2 (en) Method for manufacturing a semiconductor device having a semiconductor element mounted on a lead frame
JPH0590482A (ja) 半導体装置およびその製造方法
JP2001084343A (ja) 非接触ｉｃカード及びｉｃカード通信システム
EP0725981B1 (en) Component stacking in multi-chip semiconductor packages
KR960706194A (ko) 계층화된 도전 평면을 갖는 리드 프레임(a lead frame having layered conductive planes)
JPH1050878A (ja) 半導体装置およびその製造方法
JP2000332055A (ja) フリップチップ実装構造及び実装方法
KR100711675B1 (ko) 반도체 장치 및 그 제조 방법
TW392260B (en) Semiconductor device and manufacture method thereof
JP3561117B2 (ja) 無線モジュール及び無線カード
TW417218B (en) Tape carrier package
JPH08153747A (ja) 半導体チップおよびそれを用いた半導体装置
JPH08202844A (ja) 電子機器及びその製造方法
KR100243376B1 (ko) 반도체 패키지 및 그 제조방법
JPH08162599A (ja) 半導体装置の製造方法
JP2773762B2 (ja) 半導体装置の製造方法
TW457836B (en) High heat dissipation type integrated circuit substrate structure and fabrication process
JP3325410B2 (ja) 半導体装置の製造方法
TW472375B (en) Leadframe for exposed-pad type chip package structure
KR100604327B1 (ko) 다층형 ｔｂｇａ 반도체 팩키지 및, 그 제조방법

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees