JP3627949B2 - 半導体装置およびその製造方法 - Google Patents

半導体装置およびその製造方法 Download PDF

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Publication number
JP3627949B2
JP3627949B2 JP07678097A JP7678097A JP3627949B2 JP 3627949 B2 JP3627949 B2 JP 3627949B2 JP 07678097 A JP07678097 A JP 07678097A JP 7678097 A JP7678097 A JP 7678097A JP 3627949 B2 JP3627949 B2 JP 3627949B2
Authority
JP
Japan
Prior art keywords
adhesive tape
insulating adhesive
conductive
electrode pads
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP07678097A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10270491A5 (enExample
JPH10270491A (ja
Inventor
康文 内田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP07678097A priority Critical patent/JP3627949B2/ja
Priority to TW086115366A priority patent/TW392260B/zh
Priority to EP97308718A priority patent/EP0867938A3/en
Priority to CNB971141134A priority patent/CN1147931C/zh
Priority to US08/984,049 priority patent/US6137166A/en
Priority to KR1019970068290A priority patent/KR100366114B1/ko
Publication of JPH10270491A publication Critical patent/JPH10270491A/ja
Publication of JPH10270491A5 publication Critical patent/JPH10270491A5/ja
Application granted granted Critical
Publication of JP3627949B2 publication Critical patent/JP3627949B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H10W72/071—
    • H10W70/415—
    • H10W72/019—
    • H10W72/075—
    • H10W72/90—
    • H10W70/60—
    • H10W72/0711—
    • H10W72/29—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5445—
    • H10W72/5449—
    • H10W72/5524—
    • H10W72/581—
    • H10W72/59—
    • H10W72/932—
    • H10W72/934—
    • H10W72/951—
    • H10W72/983—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP07678097A 1997-03-28 1997-03-28 半導体装置およびその製造方法 Expired - Fee Related JP3627949B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP07678097A JP3627949B2 (ja) 1997-03-28 1997-03-28 半導体装置およびその製造方法
TW086115366A TW392260B (en) 1997-03-28 1997-10-18 Semiconductor device and manufacture method thereof
EP97308718A EP0867938A3 (en) 1997-03-28 1997-10-30 Semiconductor device comprising electrode pads and leads
CNB971141134A CN1147931C (zh) 1997-03-28 1997-11-28 半导体器件及其制造方法
US08/984,049 US6137166A (en) 1997-03-28 1997-12-03 Semiconductor device
KR1019970068290A KR100366114B1 (ko) 1997-03-28 1997-12-12 반도체장치와그의제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP07678097A JP3627949B2 (ja) 1997-03-28 1997-03-28 半導体装置およびその製造方法

Publications (3)

Publication Number Publication Date
JPH10270491A JPH10270491A (ja) 1998-10-09
JPH10270491A5 JPH10270491A5 (enExample) 2004-11-25
JP3627949B2 true JP3627949B2 (ja) 2005-03-09

Family

ID=13615121

Family Applications (1)

Application Number Title Priority Date Filing Date
JP07678097A Expired - Fee Related JP3627949B2 (ja) 1997-03-28 1997-03-28 半導体装置およびその製造方法

Country Status (6)

Country Link
US (1) US6137166A (enExample)
EP (1) EP0867938A3 (enExample)
JP (1) JP3627949B2 (enExample)
KR (1) KR100366114B1 (enExample)
CN (1) CN1147931C (enExample)
TW (1) TW392260B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100561549B1 (ko) * 1999-10-07 2006-03-17 삼성전자주식회사 패드 온 칩형 반도체 패키지
DE10025774A1 (de) * 2000-05-26 2001-12-06 Osram Opto Semiconductors Gmbh Halbleiterbauelement mit Oberflächenmetallisierung
US7626262B2 (en) * 2006-06-14 2009-12-01 Infineon Technologies Ag Electrically conductive connection, electronic component and method for their production
TW201205098A (en) * 2010-07-16 2012-02-01 Chroma Ate Inc Inspection fixture for semiconductor die test maintaining flatness of carrier portion

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4034399A (en) * 1976-02-27 1977-07-05 Rca Corporation Interconnection means for an array of majority carrier microwave devices
JPH04348045A (ja) 1990-05-20 1992-12-03 Hitachi Ltd 半導体装置及びその製造方法
US5227232A (en) 1991-01-23 1993-07-13 Lim Thiam B Conductive tape for semiconductor package, a lead frame without power buses for lead on chip package, and a semiconductor device with conductive tape power distribution
JPH05114622A (ja) * 1991-10-23 1993-05-07 Hitachi Ltd 半導体装置
JPH06283659A (ja) * 1993-03-25 1994-10-07 Mitsubishi Electric Corp 半導体装置
JPH06286659A (ja) 1993-03-31 1994-10-11 Suzuki Motor Corp ペダルブラケットの構造

Also Published As

Publication number Publication date
KR19980079528A (ko) 1998-11-25
US6137166A (en) 2000-10-24
CN1147931C (zh) 2004-04-28
TW392260B (en) 2000-06-01
EP0867938A2 (en) 1998-09-30
EP0867938A3 (en) 1999-03-10
JPH10270491A (ja) 1998-10-09
KR100366114B1 (ko) 2003-02-19
CN1195191A (zh) 1998-10-07

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