KR100366114B1 - 반도체장치와그의제조방법 - Google Patents

반도체장치와그의제조방법 Download PDF

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Publication number
KR100366114B1
KR100366114B1 KR1019970068290A KR19970068290A KR100366114B1 KR 100366114 B1 KR100366114 B1 KR 100366114B1 KR 1019970068290 A KR1019970068290 A KR 1019970068290A KR 19970068290 A KR19970068290 A KR 19970068290A KR 100366114 B1 KR100366114 B1 KR 100366114B1
Authority
KR
South Korea
Prior art keywords
adhesive tape
insulating adhesive
conductive
semiconductor device
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019970068290A
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English (en)
Korean (ko)
Other versions
KR19980079528A (ko
Inventor
야쓰후미 우찌다
Original Assignee
오끼 덴끼 고오교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오끼 덴끼 고오교 가부시끼가이샤 filed Critical 오끼 덴끼 고오교 가부시끼가이샤
Publication of KR19980079528A publication Critical patent/KR19980079528A/ko
Application granted granted Critical
Publication of KR100366114B1 publication Critical patent/KR100366114B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H10W72/071—
    • H10W70/415—
    • H10W72/019—
    • H10W72/075—
    • H10W72/90—
    • H10W70/60—
    • H10W72/0711—
    • H10W72/29—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5445—
    • H10W72/5449—
    • H10W72/5524—
    • H10W72/581—
    • H10W72/59—
    • H10W72/932—
    • H10W72/934—
    • H10W72/951—
    • H10W72/983—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR1019970068290A 1997-03-28 1997-12-12 반도체장치와그의제조방법 Expired - Fee Related KR100366114B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP97-76780 1997-03-28
JP07678097A JP3627949B2 (ja) 1997-03-28 1997-03-28 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
KR19980079528A KR19980079528A (ko) 1998-11-25
KR100366114B1 true KR100366114B1 (ko) 2003-02-19

Family

ID=13615121

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970068290A Expired - Fee Related KR100366114B1 (ko) 1997-03-28 1997-12-12 반도체장치와그의제조방법

Country Status (6)

Country Link
US (1) US6137166A (enExample)
EP (1) EP0867938A3 (enExample)
JP (1) JP3627949B2 (enExample)
KR (1) KR100366114B1 (enExample)
CN (1) CN1147931C (enExample)
TW (1) TW392260B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100561549B1 (ko) * 1999-10-07 2006-03-17 삼성전자주식회사 패드 온 칩형 반도체 패키지
DE10025774A1 (de) * 2000-05-26 2001-12-06 Osram Opto Semiconductors Gmbh Halbleiterbauelement mit Oberflächenmetallisierung
US7626262B2 (en) * 2006-06-14 2009-12-01 Infineon Technologies Ag Electrically conductive connection, electronic component and method for their production
TW201205098A (en) * 2010-07-16 2012-02-01 Chroma Ate Inc Inspection fixture for semiconductor die test maintaining flatness of carrier portion

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5252854A (en) * 1990-05-20 1993-10-12 Hitachi, Ltd. Semiconductor device having stacked lead structure

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4034399A (en) * 1976-02-27 1977-07-05 Rca Corporation Interconnection means for an array of majority carrier microwave devices
US5227232A (en) 1991-01-23 1993-07-13 Lim Thiam B Conductive tape for semiconductor package, a lead frame without power buses for lead on chip package, and a semiconductor device with conductive tape power distribution
JPH05114622A (ja) * 1991-10-23 1993-05-07 Hitachi Ltd 半導体装置
JPH06283659A (ja) * 1993-03-25 1994-10-07 Mitsubishi Electric Corp 半導体装置
JPH06286659A (ja) 1993-03-31 1994-10-11 Suzuki Motor Corp ペダルブラケットの構造

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5252854A (en) * 1990-05-20 1993-10-12 Hitachi, Ltd. Semiconductor device having stacked lead structure

Also Published As

Publication number Publication date
KR19980079528A (ko) 1998-11-25
US6137166A (en) 2000-10-24
CN1147931C (zh) 2004-04-28
TW392260B (en) 2000-06-01
EP0867938A2 (en) 1998-09-30
JP3627949B2 (ja) 2005-03-09
EP0867938A3 (en) 1999-03-10
JPH10270491A (ja) 1998-10-09
CN1195191A (zh) 1998-10-07

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