CN1147931C - 半导体器件及其制造方法 - Google Patents

半导体器件及其制造方法

Info

Publication number
CN1147931C
CN1147931C CNB971141134A CN97114113A CN1147931C CN 1147931 C CN1147931 C CN 1147931C CN B971141134 A CNB971141134 A CN B971141134A CN 97114113 A CN97114113 A CN 97114113A CN 1147931 C CN1147931 C CN 1147931C
Authority
CN
China
Prior art keywords
layer
adhesive tape
insulating adhesive
common
electrode pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB971141134A
Other languages
English (en)
Chinese (zh)
Other versions
CN1195191A (zh
Inventor
内田康文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lapis Semiconductor Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Publication of CN1195191A publication Critical patent/CN1195191A/zh
Application granted granted Critical
Publication of CN1147931C publication Critical patent/CN1147931C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H10W72/071—
    • H10W70/415—
    • H10W72/019—
    • H10W72/075—
    • H10W72/90—
    • H10W70/60—
    • H10W72/0711—
    • H10W72/29—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5445—
    • H10W72/5449—
    • H10W72/5524—
    • H10W72/581—
    • H10W72/59—
    • H10W72/932—
    • H10W72/934—
    • H10W72/951—
    • H10W72/983—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
CNB971141134A 1997-03-28 1997-11-28 半导体器件及其制造方法 Expired - Fee Related CN1147931C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP07678097A JP3627949B2 (ja) 1997-03-28 1997-03-28 半導体装置およびその製造方法
JP076780/97 1997-03-28
JP076780/1997 1997-03-28

Publications (2)

Publication Number Publication Date
CN1195191A CN1195191A (zh) 1998-10-07
CN1147931C true CN1147931C (zh) 2004-04-28

Family

ID=13615121

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB971141134A Expired - Fee Related CN1147931C (zh) 1997-03-28 1997-11-28 半导体器件及其制造方法

Country Status (6)

Country Link
US (1) US6137166A (enExample)
EP (1) EP0867938A3 (enExample)
JP (1) JP3627949B2 (enExample)
KR (1) KR100366114B1 (enExample)
CN (1) CN1147931C (enExample)
TW (1) TW392260B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100561549B1 (ko) * 1999-10-07 2006-03-17 삼성전자주식회사 패드 온 칩형 반도체 패키지
DE10025774A1 (de) * 2000-05-26 2001-12-06 Osram Opto Semiconductors Gmbh Halbleiterbauelement mit Oberflächenmetallisierung
US7626262B2 (en) * 2006-06-14 2009-12-01 Infineon Technologies Ag Electrically conductive connection, electronic component and method for their production
TW201205098A (en) * 2010-07-16 2012-02-01 Chroma Ate Inc Inspection fixture for semiconductor die test maintaining flatness of carrier portion

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4034399A (en) * 1976-02-27 1977-07-05 Rca Corporation Interconnection means for an array of majority carrier microwave devices
JPH04348045A (ja) 1990-05-20 1992-12-03 Hitachi Ltd 半導体装置及びその製造方法
US5227232A (en) 1991-01-23 1993-07-13 Lim Thiam B Conductive tape for semiconductor package, a lead frame without power buses for lead on chip package, and a semiconductor device with conductive tape power distribution
JPH05114622A (ja) * 1991-10-23 1993-05-07 Hitachi Ltd 半導体装置
JPH06283659A (ja) * 1993-03-25 1994-10-07 Mitsubishi Electric Corp 半導体装置
JPH06286659A (ja) 1993-03-31 1994-10-11 Suzuki Motor Corp ペダルブラケットの構造

Also Published As

Publication number Publication date
KR19980079528A (ko) 1998-11-25
US6137166A (en) 2000-10-24
TW392260B (en) 2000-06-01
EP0867938A2 (en) 1998-09-30
JP3627949B2 (ja) 2005-03-09
EP0867938A3 (en) 1999-03-10
JPH10270491A (ja) 1998-10-09
KR100366114B1 (ko) 2003-02-19
CN1195191A (zh) 1998-10-07

Similar Documents

Publication Publication Date Title
CN1151554C (zh) 半导体器件、其制造方法以及组合型半导体器件
JP3913481B2 (ja) 半導体装置および半導体装置の製造方法
CN1266764C (zh) 半导体器件及其制造方法
JP4501279B2 (ja) 集積型電子部品及びその集積方法
CN1641832A (zh) 半导体器件及其制造方法
US20020072152A1 (en) Semiconductor package and semiconductor package fabrication method
CN101009269B (zh) 半导体器件及其制造方法
JP2005020004A (ja) 複数のフリップチップを有するマルチチップパッケージ及びその製造方法
CN1638120A (zh) 半导体组装体及其制造方法
CN1445851A (zh) 轻薄叠层封装半导体器件及其制造工艺
TW200919693A (en) Stacked semiconductor package that prevents damage to semiconductor chip when wire-bonding and method for manufacturing the same
CN1790651A (zh) 芯片集成基板的制造方法
US20040108581A1 (en) Assemblies having stacked semiconductor chips and methods of making same
TW201123402A (en) Chip-stacked package structure and method for manufacturing the same
CN101032021A (zh) 低矮外形、芯片级封装及制作方法
CN1147931C (zh) 半导体器件及其制造方法
WO2011030368A1 (ja) 半導体装置とその製造方法
CN101656246B (zh) 具有开口的基板的芯片堆叠封装结构及其封装方法
JPH10335366A (ja) 半導体装置
CN1433081A (zh) 影像感测器及其封装方法
CN1523645A (zh) 半导体器件
JP2001168270A (ja) 半導体装置及びその製造方法
JP2001015677A (ja) 半導体装置
CN1610082A (zh) 强化散热型封装结构及其形成方法
JP2004335970A (ja) 複合電子部品

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: OKI SEMICONDUCTOR CO., LTD.

Free format text: FORMER OWNER: OKI ELECTRIC INDUSTRY CO., LTD.

Effective date: 20090508

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20090508

Address after: Tokyo, Japan, Japan

Patentee after: OKI Semiconductor Co., Ltd.

Address before: Tokyo, Japan, Japan

Patentee before: Oki Electric Industry Co., Ltd.

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20040428

Termination date: 20101128