TW374792B - Silicone die attach adhesive, method for the fabrication of semiconductor devices, and semiconductor devices - Google Patents

Silicone die attach adhesive, method for the fabrication of semiconductor devices, and semiconductor devices

Info

Publication number
TW374792B
TW374792B TW086104987A TW86104987A TW374792B TW 374792 B TW374792 B TW 374792B TW 086104987 A TW086104987 A TW 086104987A TW 86104987 A TW86104987 A TW 86104987A TW 374792 B TW374792 B TW 374792B
Authority
TW
Taiwan
Prior art keywords
semiconductor devices
composition
die attach
fabrication
attach adhesive
Prior art date
Application number
TW086104987A
Other languages
English (en)
Inventor
Osamu Mitani
Kazumi Nakayoshi
Rikako Tasawa
Katsutoshi Mine
Original Assignee
Dow Corning Toray Silicone
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Silicone filed Critical Dow Corning Toray Silicone
Application granted granted Critical
Publication of TW374792B publication Critical patent/TW374792B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/243—Two or more independent types of crosslinking for one or more polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/10—Block or graft copolymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/28—Non-macromolecular organic substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H10W72/884—
    • H10W90/734—
    • H10W90/736—
    • H10W90/754—
    • H10W90/756—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Silicon Polymers (AREA)
TW086104987A 1996-04-19 1997-04-17 Silicone die attach adhesive, method for the fabrication of semiconductor devices, and semiconductor devices TW374792B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12264096A JPH09286971A (ja) 1996-04-19 1996-04-19 シリコーン系ダイボンディング剤、半導体装置の製造方法および半導体装置

Publications (1)

Publication Number Publication Date
TW374792B true TW374792B (en) 1999-11-21

Family

ID=14840979

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086104987A TW374792B (en) 1996-04-19 1997-04-17 Silicone die attach adhesive, method for the fabrication of semiconductor devices, and semiconductor devices

Country Status (8)

Country Link
US (1) US5982041A (zh)
EP (1) EP0802234B1 (zh)
JP (1) JPH09286971A (zh)
KR (1) KR970070156A (zh)
DE (1) DE69727723D1 (zh)
MY (1) MY132333A (zh)
SG (1) SG75809A1 (zh)
TW (1) TW374792B (zh)

Cited By (1)

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US12023853B2 (en) 2014-10-17 2024-07-02 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles

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US6784555B2 (en) * 2001-09-17 2004-08-31 Dow Corning Corporation Die attach adhesives for semiconductor applications utilizing a polymeric base material with inorganic insulator particles of various sizes
JP4726383B2 (ja) * 2002-02-15 2011-07-20 信越化学工業株式会社 放射線硬化性シリコーンゴム組成物および接着性シリコーンエラストマーフィルム
JP4185292B2 (ja) * 2002-02-15 2008-11-26 信越化学工業株式会社 放射線硬化性シリコーンゴム組成物および接着性シリコーンエラストマーフィルム
US6940177B2 (en) * 2002-05-16 2005-09-06 Dow Corning Corporation Semiconductor package and method of preparing same
US7176044B2 (en) * 2002-11-25 2007-02-13 Henkel Corporation B-stageable die attach adhesives
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US20050038188A1 (en) 2003-08-14 2005-02-17 Dongchan Ahn Silicones having improved chemical resistance and curable silicone compositions having improved migration resistance
US7045586B2 (en) 2003-08-14 2006-05-16 Dow Corning Corporation Adhesives having improved chemical resistance and curable silicone compositions for preparing the adhesives
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US20060113683A1 (en) * 2004-09-07 2006-06-01 Nancy Dean Doped alloys for electrical interconnects, methods of production and uses thereof
US7394150B2 (en) * 2004-11-23 2008-07-01 Siliconix Incorporated Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys
US7238551B2 (en) * 2004-11-23 2007-07-03 Siliconix Incorporated Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys
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JP4984573B2 (ja) * 2006-02-28 2012-07-25 住友ベークライト株式会社 ダイアタッチペースト及びダイアタッチペーストを使用して作製した半導体装置
WO2007129132A1 (en) * 2006-05-10 2007-11-15 Infineon Technologies Ag Semiconductor package and method of assembling a semiconductor package
US8569416B2 (en) 2006-06-06 2013-10-29 Dow Corning Corporation Single phase silicone acrylate formulation
US8614278B2 (en) * 2006-06-06 2013-12-24 Dow Corning Corporation Silicone acrylate hybrid composition and method of making same
JP5487536B2 (ja) * 2007-07-02 2014-05-07 バンドー化学株式会社 ウレタン製のハス歯ベルト
JP2009132749A (ja) 2007-11-28 2009-06-18 Seiko Epson Corp 接合方法および接合体
FR2926082B1 (fr) * 2008-01-04 2010-01-15 Nexans Composition photoreticulable comprenant un polyorganosiloxane.
JP4497218B2 (ja) 2008-03-06 2010-07-07 セイコーエプソン株式会社 接合方法および接合体
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Publication number Priority date Publication date Assignee Title
US12023853B2 (en) 2014-10-17 2024-07-02 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles

Also Published As

Publication number Publication date
KR970070156A (ko) 1997-11-07
EP0802234A2 (en) 1997-10-22
DE69727723D1 (de) 2004-04-01
JPH09286971A (ja) 1997-11-04
US5982041A (en) 1999-11-09
EP0802234A3 (en) 1998-06-24
SG75809A1 (en) 2000-10-24
MY132333A (en) 2007-10-31
EP0802234B1 (en) 2004-02-25

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