TW363257B - Semiconductor integrated circuit apparatus and manufacturing method thereof - Google Patents

Semiconductor integrated circuit apparatus and manufacturing method thereof

Info

Publication number
TW363257B
TW363257B TW086116461A TW86116461A TW363257B TW 363257 B TW363257 B TW 363257B TW 086116461 A TW086116461 A TW 086116461A TW 86116461 A TW86116461 A TW 86116461A TW 363257 B TW363257 B TW 363257B
Authority
TW
Taiwan
Prior art keywords
semiconductor integrated
integrated circuit
over voltage
circuit apparatus
manufacturing
Prior art date
Application number
TW086116461A
Other languages
English (en)
Inventor
Hiroyasu Ishizuka
Kousuke Okuyama
Katsuhiko Kubota
Original Assignee
Hitachi Microcomp System Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Microcomp System Ltd, Hitachi Ltd filed Critical Hitachi Microcomp System Ltd
Application granted granted Critical
Publication of TW363257B publication Critical patent/TW363257B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/861—Diodes
    • H01L29/87—Thyristor diodes, e.g. Shockley diodes, break-over diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
TW086116461A 1996-11-07 1997-11-05 Semiconductor integrated circuit apparatus and manufacturing method thereof TW363257B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP29503796 1996-11-07
PCT/JP1997/003964 WO1998020564A1 (en) 1996-11-07 1997-10-30 Semiconductor integrated circuit device and its manufacture

Publications (1)

Publication Number Publication Date
TW363257B true TW363257B (en) 1999-07-01

Family

ID=17815512

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086116461A TW363257B (en) 1996-11-07 1997-11-05 Semiconductor integrated circuit apparatus and manufacturing method thereof

Country Status (7)

Country Link
US (1) US6469325B1 (zh)
JP (1) JP4144901B2 (zh)
KR (1) KR100673421B1 (zh)
CN (2) CN1521848A (zh)
AU (1) AU4726197A (zh)
TW (1) TW363257B (zh)
WO (1) WO1998020564A1 (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6674129B1 (en) 1999-12-17 2004-01-06 Koninklijke Phillips Electronics N.V. ESD diode structure
DE10111462A1 (de) * 2001-03-09 2002-09-19 Infineon Technologies Ag Thyristorstruktur und Überspannungsschutzanordnung mit einer solchen Thyristorstruktur
JP2003060088A (ja) * 2001-08-14 2003-02-28 Mitsubishi Electric Corp 半導体記憶装置
JP2003100899A (ja) * 2001-09-27 2003-04-04 Mitsubishi Electric Corp 半導体装置およびその製造方法
CN100570872C (zh) * 2002-05-24 2009-12-16 独立行政法人产业技术综合研究所 电信号传输线
JP4651044B2 (ja) 2004-02-13 2011-03-16 オーストリアマイクロシステムズ アクチエンゲゼルシャフト 集積半導体回路を保護するための回路装置および方法
JP2006303110A (ja) * 2005-04-19 2006-11-02 Nec Electronics Corp 半導体装置
JP5132077B2 (ja) * 2006-04-18 2013-01-30 オンセミコンダクター・トレーディング・リミテッド 半導体装置
JP2008205271A (ja) * 2007-02-21 2008-09-04 Matsushita Electric Ind Co Ltd 半導体保護回路およびその製造方法、半導体保護回路の動作方法
JP2009054851A (ja) * 2007-08-28 2009-03-12 Panasonic Corp 半導体集積回路
US20110032648A1 (en) * 2008-04-09 2011-02-10 Nxp B.V. Esd protection
JP2010067632A (ja) * 2008-09-08 2010-03-25 Sharp Corp 静電気保護素子
US9385241B2 (en) * 2009-07-08 2016-07-05 Taiwan Semiconductor Manufacturing Company, Ltd. Electrostatic discharge (ESD) protection circuits, integrated circuits, systems, and methods for forming the ESD protection circuits
CN102034806B (zh) * 2009-09-24 2014-08-13 新唐科技股份有限公司 静电放电防护装置
US8053898B2 (en) * 2009-10-05 2011-11-08 Samsung Electronics Co., Ltd. Connection for off-chip electrostatic discharge protection
US8405941B2 (en) 2009-11-30 2013-03-26 Nuvoton Technology Corporation ESD protection apparatus and ESD device therein
JP5990986B2 (ja) * 2012-04-10 2016-09-14 三菱電機株式会社 保護ダイオード

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51146188A (en) * 1975-06-11 1976-12-15 Fujitsu Ltd Diode device
DE3422132C1 (de) * 1984-06-14 1986-01-09 Texas Instruments Deutschland Gmbh, 8050 Freising Schutzschaltungsanordnung
US4763184A (en) * 1985-04-30 1988-08-09 Waferscale Integration, Inc. Input circuit for protecting against damage caused by electrostatic discharge
JPH01158766A (ja) * 1987-12-16 1989-06-21 Matsushita Electron Corp 半導体装置
US4989057A (en) * 1988-05-26 1991-01-29 Texas Instruments Incorporated ESD protection for SOI circuits
US4870530A (en) * 1988-06-27 1989-09-26 Advanced Micro Devices, Inc. Electrostatic discharge protection circuitry for any two external pins of an I.C. package
JPH0817206B2 (ja) * 1990-03-02 1996-02-21 株式会社東芝 半導体装置
JPH0677405A (ja) * 1990-07-31 1994-03-18 Texas Instr Inc <Ti> 低電圧トリガ式ｅｓｄ保護回路
JPH04196352A (ja) * 1990-11-28 1992-07-16 Nissan Motor Co Ltd 半導体保護装置
FR2690786A1 (fr) * 1992-04-30 1993-10-29 Sgs Thomson Microelectronics Sa Dispositif de protection d'un circuit intégré contre les décharges électrostatiques.
US5400202A (en) * 1992-06-15 1995-03-21 Hewlett-Packard Company Electrostatic discharge protection circuit for integrated circuits
JP2874583B2 (ja) * 1995-02-10 1999-03-24 日本電気株式会社 半導体装置の入力保護回路
US6064093A (en) * 1996-03-29 2000-05-16 Citizen Watch Co., Ltd. Protection circuit with clamping feature for semiconductor device
JPH10270567A (ja) * 1997-03-21 1998-10-09 Oki Electric Ind Co Ltd トランジスタ保護素子

Also Published As

Publication number Publication date
CN1236485A (zh) 1999-11-24
KR20000053032A (ko) 2000-08-25
CN1150628C (zh) 2004-05-19
CN1521848A (zh) 2004-08-18
AU4726197A (en) 1998-05-29
WO1998020564A1 (en) 1998-05-14
KR100673421B1 (ko) 2007-01-23
US6469325B1 (en) 2002-10-22
JP4144901B2 (ja) 2008-09-03

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees