TW304230B - - Google Patents

Download PDF

Info

Publication number
TW304230B
TW304230B TW085105095A TW85105095A TW304230B TW 304230 B TW304230 B TW 304230B TW 085105095 A TW085105095 A TW 085105095A TW 85105095 A TW85105095 A TW 85105095A TW 304230 B TW304230 B TW 304230B
Authority
TW
Taiwan
Prior art keywords
inspection
defective
substrate
layout
layout drawing
Prior art date
Application number
TW085105095A
Other languages
English (en)
Chinese (zh)
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Application granted granted Critical
Publication of TW304230B publication Critical patent/TW304230B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G01N2021/8858—Flaw counting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G01N2021/8861—Determining coordinates of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G01N2021/888—Marking defects

Landscapes

  • Engineering & Computer Science (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Signal Processing (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Supply And Installment Of Electrical Components (AREA)
TW085105095A 1995-04-20 1996-04-29 TW304230B (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11763995A JP3216033B2 (ja) 1995-04-20 1995-04-20 検査結果出力装置および検査結果出力方法、ならびにこの検査結果出力装置を用いた基板検査システムおよびこの検査結果出力方法を用いた基板検査方法

Publications (1)

Publication Number Publication Date
TW304230B true TW304230B (ja) 1997-05-01

Family

ID=14716681

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085105095A TW304230B (ja) 1995-04-20 1996-04-29

Country Status (4)

Country Link
JP (1) JP3216033B2 (ja)
KR (1) KR100205733B1 (ja)
CN (2) CN1059740C (ja)
TW (1) TW304230B (ja)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19940584A1 (de) * 1999-08-26 2001-03-22 Siemens Ag Verfahren und System zum Bestücken von in einer Bestückungseinheit angeordneten Schaltungsträgern
JP4045838B2 (ja) * 2002-04-12 2008-02-13 松下電器産業株式会社 部品装着管理方法
JP3733094B2 (ja) * 2002-08-22 2006-01-11 トヨタ自動車株式会社 良否判定装置、良否判定プログラムおよび良否判定方法
JP2005227882A (ja) * 2004-02-10 2005-08-25 Mazda Motor Corp 整備情報提供システム
JP4493421B2 (ja) * 2004-06-30 2010-06-30 株式会社リコー プリント回路基板検査装置とプリント回路基板組み立て検査ラインシステムおよびプログラム
JP4541172B2 (ja) * 2005-01-28 2010-09-08 ヤマハ発動機株式会社 部品実装ラインにおける情報管理システム
JP4552749B2 (ja) * 2005-05-12 2010-09-29 オムロン株式会社 検査基準設定装置及び方法、並びに、工程検査装置
JP2007081318A (ja) * 2005-09-16 2007-03-29 Omron Corp 検査結果出力方法、検査結果出力装置、検査結果出力用プログラム、および検査結果出力用プログラムを記録した記録媒体
KR20090008185A (ko) * 2006-05-15 2009-01-21 가부시키가이샤 니콘 표면 검사 장치
JP2008186879A (ja) * 2007-01-29 2008-08-14 Omron Corp 基板検査方法
JP2009036736A (ja) * 2007-08-04 2009-02-19 Djtech Co Ltd 印刷半田検査方法及び装置
US8285028B2 (en) * 2007-09-28 2012-10-09 Panasonic Corporation Inspection apparatus and inspection method
DE102007049702A1 (de) * 2007-10-17 2009-04-23 Robert Bosch Gmbh Pickerstrasse
JP5400342B2 (ja) 2008-10-01 2014-01-29 キヤノン株式会社 情報処理装置、その表示方法及びプログラム
JP5284767B2 (ja) * 2008-12-03 2013-09-11 東海旅客鉄道株式会社 車両台車油量検査システム
CN101477063B (zh) * 2009-01-22 2011-02-16 北京星河泰视特科技有限公司 印刷电路板的检测方法及光学检测仪
JP5065329B2 (ja) * 2009-05-12 2012-10-31 ヴィスコ・テクノロジーズ株式会社 形状検査装置および形状検査プログラム
US10260996B2 (en) * 2014-02-03 2019-04-16 Fuji Corporation Board production monitoring device and board production monitoring method
JP6652327B2 (ja) * 2015-04-17 2020-02-19 株式会社フジタ 検査対象物の状態評価装置
KR101619721B1 (ko) * 2015-11-25 2016-05-11 주식회사 케이엔케이 Pcb 검사 장치
JP6673268B2 (ja) * 2017-03-14 2020-03-25 オムロン株式会社 管理装置、管理装置の制御方法、情報処理プログラム、および記録媒体

Also Published As

Publication number Publication date
CN1282865A (zh) 2001-02-07
KR100205733B1 (ko) 1999-07-01
JP3216033B2 (ja) 2001-10-09
KR960040114A (ko) 1996-11-25
CN1156673C (zh) 2004-07-07
CN1151519A (zh) 1997-06-11
CN1059740C (zh) 2000-12-20
JPH08292018A (ja) 1996-11-05

Similar Documents

Publication Publication Date Title
TW304230B (ja)
EP0602547B1 (en) Method of executing a reproduction process and apparatus used therefor
US8451286B2 (en) Image display method and image display apparatus, as well as printing assisting system
JP2007232480A (ja) レポートフォーマット設定方法、レポートフォーマット設定装置、及び欠陥レビューシステム
CN105976252A (zh) 电子设备碎屏险查验方法与系统
CN101185032A (zh) 图像处理装置
TW201239541A (en) Drawing data correction apparatus and drawing apparatus
JPH0310294B2 (ja)
JP2006189318A (ja) 物体像表示装置
JP3381129B2 (ja) 観測領域設定方法およびその装置、ならびにこの観測領域設定方法を用いた外観検査方法およびその装置
JP2006201887A (ja) 作業指示書作成システム
JP2000076320A (ja) プリント基板用製造情報管理システム、プリント基板用製造情報管理システムの制御方法、および、記憶媒体
JPH0535850A (ja) 教示データ作成方法
JP3189308B2 (ja) はんだ付検査結果の表示方法およびその装置，はんだ付不良の修正方法，ならびにはんだ付検査装置
JP3264020B2 (ja) 検査用データ作成方法および実装部品検査装置
JP3654946B2 (ja) 図形複写方法および帳票類デザインシステム
US20070153314A1 (en) Computer program and method for converting an image to machine control data
JP3185430B2 (ja) 基板検査方法およびその装置
JP2001216522A (ja) 印刷用データ作成方法、及び印刷用データ作成システム
JP3143709B2 (ja) スキャナ読込み補正方法
JP3035574B2 (ja) 実装部品検査装置の教示方法
JP2023075429A (ja) 工事管理の方法、システム、プログラム、記録媒体、装置およびデータベース
JP3701338B2 (ja) 分色処理方法および帳票類デザインシステム
JPS62176368A (ja) レイアウトスキヤナ−文字、図形入力装置
JP3026404B2 (ja) 前準備装置

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees