TW275169B - - Google Patents

Info

Publication number
TW275169B
TW275169B TW84104778A TW84104778A TW275169B TW 275169 B TW275169 B TW 275169B TW 84104778 A TW84104778 A TW 84104778A TW 84104778 A TW84104778 A TW 84104778A TW 275169 B TW275169 B TW 275169B
Authority
TW
Taiwan
Application number
TW84104778A
Other languages
Chinese (zh)
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=14948485&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW275169(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Application granted granted Critical
Publication of TW275169B publication Critical patent/TW275169B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/407—Optical elements or arrangements indirectly associated with the devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4237—Welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07552—Controlling the environment, e.g. atmosphere composition or temperature changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/527—Multiple bond wires having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/652—Materials of strap connectors comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/766—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Light Receiving Elements (AREA)
  • Optical Couplings Of Light Guides (AREA)
TW84104778A 1994-05-16 1995-05-15 TW275169B (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6126973A JP3047735B2 (ja) 1994-05-16 1994-05-16 光受信モジュ−ルとその製造方法

Publications (1)

Publication Number Publication Date
TW275169B true TW275169B (https=) 1996-05-01

Family

ID=14948485

Family Applications (1)

Application Number Title Priority Date Filing Date
TW84104778A TW275169B (https=) 1994-05-16 1995-05-15

Country Status (7)

Country Link
US (1) US5610395A (https=)
EP (1) EP0684651B1 (https=)
JP (1) JP3047735B2 (https=)
KR (1) KR0167628B1 (https=)
CA (1) CA2148894C (https=)
DE (1) DE69519894T2 (https=)
TW (1) TW275169B (https=)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3436009B2 (ja) * 1996-07-31 2003-08-11 住友電気工業株式会社 光半導体素子
JP3830583B2 (ja) * 1996-08-15 2006-10-04 富士通株式会社 光半導体アセンブリ
US5870517A (en) * 1997-10-07 1999-02-09 Integrated Device Technology, Inc. Package including self-aligned laser diode and method of aligning a laser diode
US5977567A (en) * 1998-01-06 1999-11-02 Lightlogic, Inc. Optoelectronic assembly and method of making the same
US6585427B2 (en) 1999-01-11 2003-07-01 Intel Corporation Flexure coupled to a substrate for maintaining the optical fibers in alignment
US6207950B1 (en) 1999-01-11 2001-03-27 Lightlogic, Inc. Optical electronic assembly having a flexure for maintaining alignment between optical elements
US6511236B1 (en) 1999-09-07 2003-01-28 Intel Corporation Optoelectronic assembly and method for fabricating the same
DE19923417A1 (de) * 1999-05-21 2000-11-30 Tyco Electronics Logistics Ag Diodenhaltevorrichtung
US6252726B1 (en) 1999-09-02 2001-06-26 Lightlogic, Inc. Dual-enclosure optoelectronic packages
US6540412B2 (en) * 2000-02-10 2003-04-01 Sumitomo Electric Industries, Ltd. Optical transceiver
JP4187376B2 (ja) * 2000-02-16 2008-11-26 ローム株式会社 受光増幅装置
TW502492B (en) * 2000-05-30 2002-09-11 Alps Electric Co Ltd Electronic circuit unit
DE10064599A1 (de) * 2000-12-18 2002-07-04 Infineon Technologies Ag Sende-/Empfangsmodul für eine bidirektionale optische Nachrichten-und Signalübertragung
JP3996780B2 (ja) * 2001-03-21 2007-10-24 シャープ株式会社 半導体レーザ装置およびその製造方法
DE10120692B4 (de) * 2001-04-27 2004-02-12 Siemens Ag Montageanordnung von elektrischen und/oder elektronischen Bauteilen auf einer Leiterplatte
JP2002329873A (ja) * 2001-05-01 2002-11-15 Mitsubishi Electric Corp 半導体モジュールおよび半導体装置
DE50111658D1 (de) * 2001-09-14 2007-01-25 Finisar Corp Sende- und/oder empfangsanordnung zur optischen signalübertragung
DE10154834A1 (de) * 2001-11-08 2003-05-22 Daimler Chrysler Ag Stecker und Steckeraufnahme für ein optoelektronisches Steckersystem
JP2003163403A (ja) * 2001-11-29 2003-06-06 Mitsubishi Electric Corp 光素子モジュール
JP2004088046A (ja) 2002-06-25 2004-03-18 Sumitomo Electric Ind Ltd 光受信器及びその製造方法
US7224910B2 (en) * 2002-10-25 2007-05-29 Gennum Corporation Direct attach optical receiver module and method of testing
US7002131B1 (en) 2003-01-24 2006-02-21 Jds Uniphase Corporation Methods, systems and apparatus for measuring average received optical power
US7215883B1 (en) 2003-01-24 2007-05-08 Jds Uniphase Corporation Methods for determining the performance, status, and advanced failure of optical communication channels
TWI247144B (en) * 2003-12-05 2006-01-11 Ind Tech Res Inst Receiving optical subassembly
US7847301B2 (en) * 2004-12-08 2010-12-07 Agilent Technologies, Inc. Electronic microcircuit having internal light enhancement
US20060133742A1 (en) * 2004-12-17 2006-06-22 Ruegg Eugen H Universal multi-port optical block assembly with configurable optical port
JP2006253676A (ja) * 2005-03-08 2006-09-21 Sumitomo Electric Ind Ltd 光アセンブリ
JP4815869B2 (ja) * 2005-05-11 2011-11-16 住友電気工業株式会社 光受信モジュール
JP2007123738A (ja) * 2005-10-31 2007-05-17 Sony Corp 光送信モジュール、光送受信モジュール及び光通信装置
JP2007201213A (ja) * 2006-01-27 2007-08-09 Opnext Japan Inc 光受信モジュール
US8059973B2 (en) * 2006-02-17 2011-11-15 Finisar Corporation Discrete bootstrapping in an optical receiver to prevent signal feedback
EP2003689B1 (en) * 2007-06-15 2019-06-12 Schott AG Header, especially for electronic packages
JP2010034287A (ja) * 2008-07-29 2010-02-12 Sumitomo Electric Ind Ltd キャップ及び光モジュール
JP5077158B2 (ja) 2008-09-09 2012-11-21 三菱電機株式会社 受光素子
CN111865430A (zh) * 2019-04-30 2020-10-30 深圳市聚飞光电股份有限公司 光电接收器
CN111865429B (zh) * 2019-04-30 2022-05-27 深圳市聚飞光电股份有限公司 光电接收器及光电接收器的制作方法
JP7279888B2 (ja) 2019-09-27 2023-05-23 住友電工デバイス・イノベーション株式会社 光半導体装置及び光半導体装置の製造方法
GB2575204B (en) * 2019-10-08 2020-08-19 Hilight Semiconductor Ltd Opto-electronic assembly
GB2575205B (en) * 2019-10-08 2020-09-09 Hilight Semiconductor Ltd Opto-electronic assembly
WO2023063196A1 (ja) * 2021-10-11 2023-04-20 古河電気工業株式会社 光学装置
CN118899345B (zh) * 2024-07-04 2025-03-07 浙江珵美科技有限公司 一种用于表面贴装的光电探测器封装壳

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US4103157A (en) * 1977-02-04 1978-07-25 Mcdonnell Douglas Corporation High speed photodetector and system
DE3568087D1 (en) * 1984-02-22 1989-03-09 Siemens Ag Optoelectronic housing module
US4758767A (en) * 1987-05-15 1988-07-19 Multipoint Control Systems, Incorporated Self-contained analog photodiode light sensing head
JPS63316812A (ja) * 1987-06-19 1988-12-26 Toshiba Corp 光半導体装置
JPH03238877A (ja) * 1990-02-15 1991-10-24 Toshiba Corp 光受光器
JP3067151B2 (ja) * 1990-03-13 2000-07-17 日本電気株式会社 光電気変換素子サブキャリア
JP2715672B2 (ja) * 1991-02-06 1998-02-18 日本電気株式会社 前置増幅器内蔵光半導体受光素子装置
JPH05243587A (ja) * 1992-02-28 1993-09-21 Toshiba Corp 受光デバイス

Also Published As

Publication number Publication date
JP3047735B2 (ja) 2000-06-05
EP0684651A2 (en) 1995-11-29
KR0167628B1 (ko) 1999-04-15
DE69519894D1 (de) 2001-02-22
US5610395A (en) 1997-03-11
KR950033539A (ko) 1995-12-26
JPH07312430A (ja) 1995-11-28
DE69519894T2 (de) 2001-06-07
EP0684651A3 (en) 1997-04-02
CA2148894C (en) 1999-05-11
EP0684651B1 (en) 2001-01-17
CA2148894A1 (en) 1995-11-17

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Legal Events

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