TW275169B - - Google Patents

Info

Publication number
TW275169B
TW275169B TW84104778A TW84104778A TW275169B TW 275169 B TW275169 B TW 275169B TW 84104778 A TW84104778 A TW 84104778A TW 84104778 A TW84104778 A TW 84104778A TW 275169 B TW275169 B TW 275169B
Authority
TW
Taiwan
Application number
TW84104778A
Other languages
Chinese (zh)
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=14948485&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW275169(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Application granted granted Critical
Publication of TW275169B publication Critical patent/TW275169B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/407—Optical elements or arrangements indirectly associated with the devices
    • H10W72/30—
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4237—Welding
    • H10W72/07552—
    • H10W72/527—
    • H10W72/5475—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/5525—
    • H10W72/652—
    • H10W72/884—
    • H10W90/753—
    • H10W90/766—

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Light Receiving Elements (AREA)
  • Optical Couplings Of Light Guides (AREA)
TW84104778A 1994-05-16 1995-05-15 TW275169B (esLanguage)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6126973A JP3047735B2 (ja) 1994-05-16 1994-05-16 光受信モジュ−ルとその製造方法

Publications (1)

Publication Number Publication Date
TW275169B true TW275169B (esLanguage) 1996-05-01

Family

ID=14948485

Family Applications (1)

Application Number Title Priority Date Filing Date
TW84104778A TW275169B (esLanguage) 1994-05-16 1995-05-15

Country Status (7)

Country Link
US (1) US5610395A (esLanguage)
EP (1) EP0684651B1 (esLanguage)
JP (1) JP3047735B2 (esLanguage)
KR (1) KR0167628B1 (esLanguage)
CA (1) CA2148894C (esLanguage)
DE (1) DE69519894T2 (esLanguage)
TW (1) TW275169B (esLanguage)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3436009B2 (ja) * 1996-07-31 2003-08-11 住友電気工業株式会社 光半導体素子
JP3830583B2 (ja) * 1996-08-15 2006-10-04 富士通株式会社 光半導体アセンブリ
US5870517A (en) * 1997-10-07 1999-02-09 Integrated Device Technology, Inc. Package including self-aligned laser diode and method of aligning a laser diode
US5977567A (en) * 1998-01-06 1999-11-02 Lightlogic, Inc. Optoelectronic assembly and method of making the same
US6207950B1 (en) 1999-01-11 2001-03-27 Lightlogic, Inc. Optical electronic assembly having a flexure for maintaining alignment between optical elements
US6585427B2 (en) 1999-01-11 2003-07-01 Intel Corporation Flexure coupled to a substrate for maintaining the optical fibers in alignment
US6511236B1 (en) 1999-09-07 2003-01-28 Intel Corporation Optoelectronic assembly and method for fabricating the same
DE19923417A1 (de) * 1999-05-21 2000-11-30 Tyco Electronics Logistics Ag Diodenhaltevorrichtung
US6252726B1 (en) 1999-09-02 2001-06-26 Lightlogic, Inc. Dual-enclosure optoelectronic packages
US6540412B2 (en) * 2000-02-10 2003-04-01 Sumitomo Electric Industries, Ltd. Optical transceiver
JP4187376B2 (ja) * 2000-02-16 2008-11-26 ローム株式会社 受光増幅装置
TW502492B (en) * 2000-05-30 2002-09-11 Alps Electric Co Ltd Electronic circuit unit
DE10064599A1 (de) * 2000-12-18 2002-07-04 Infineon Technologies Ag Sende-/Empfangsmodul für eine bidirektionale optische Nachrichten-und Signalübertragung
JP3996780B2 (ja) * 2001-03-21 2007-10-24 シャープ株式会社 半導体レーザ装置およびその製造方法
DE10120692B4 (de) * 2001-04-27 2004-02-12 Siemens Ag Montageanordnung von elektrischen und/oder elektronischen Bauteilen auf einer Leiterplatte
JP2002329873A (ja) * 2001-05-01 2002-11-15 Mitsubishi Electric Corp 半導体モジュールおよび半導体装置
CN1302306C (zh) * 2001-09-14 2007-02-28 因芬尼昂技术股份公司 光学信号传输之传送及/或接收装置
DE10154834A1 (de) * 2001-11-08 2003-05-22 Daimler Chrysler Ag Stecker und Steckeraufnahme für ein optoelektronisches Steckersystem
JP2003163403A (ja) * 2001-11-29 2003-06-06 Mitsubishi Electric Corp 光素子モジュール
JP2004088046A (ja) 2002-06-25 2004-03-18 Sumitomo Electric Ind Ltd 光受信器及びその製造方法
US7224910B2 (en) * 2002-10-25 2007-05-29 Gennum Corporation Direct attach optical receiver module and method of testing
US7002131B1 (en) 2003-01-24 2006-02-21 Jds Uniphase Corporation Methods, systems and apparatus for measuring average received optical power
US7215883B1 (en) 2003-01-24 2007-05-08 Jds Uniphase Corporation Methods for determining the performance, status, and advanced failure of optical communication channels
TWI247144B (en) * 2003-12-05 2006-01-11 Ind Tech Res Inst Receiving optical subassembly
US7847301B2 (en) * 2004-12-08 2010-12-07 Agilent Technologies, Inc. Electronic microcircuit having internal light enhancement
US20060133742A1 (en) * 2004-12-17 2006-06-22 Ruegg Eugen H Universal multi-port optical block assembly with configurable optical port
JP2006253676A (ja) * 2005-03-08 2006-09-21 Sumitomo Electric Ind Ltd 光アセンブリ
JP4815869B2 (ja) * 2005-05-11 2011-11-16 住友電気工業株式会社 光受信モジュール
JP2007123738A (ja) * 2005-10-31 2007-05-17 Sony Corp 光送信モジュール、光送受信モジュール及び光通信装置
JP2007201213A (ja) * 2006-01-27 2007-08-09 Opnext Japan Inc 光受信モジュール
WO2007098433A2 (en) * 2006-02-17 2007-08-30 Finisar Corporation Discrete bootstrapping in an optical receiver to prevent signal feedback
EP2003689B1 (en) * 2007-06-15 2019-06-12 Schott AG Header, especially for electronic packages
JP2010034287A (ja) * 2008-07-29 2010-02-12 Sumitomo Electric Ind Ltd キャップ及び光モジュール
JP5077158B2 (ja) 2008-09-09 2012-11-21 三菱電機株式会社 受光素子
CN111865429B (zh) * 2019-04-30 2022-05-27 深圳市聚飞光电股份有限公司 光电接收器及光电接收器的制作方法
CN111865430A (zh) * 2019-04-30 2020-10-30 深圳市聚飞光电股份有限公司 光电接收器
JP7279888B2 (ja) 2019-09-27 2023-05-23 住友電工デバイス・イノベーション株式会社 光半導体装置及び光半導体装置の製造方法
GB2575204B (en) * 2019-10-08 2020-08-19 Hilight Semiconductor Ltd Opto-electronic assembly
GB2575205B (en) 2019-10-08 2020-09-09 Hilight Semiconductor Ltd Opto-electronic assembly
JPWO2023063196A1 (esLanguage) * 2021-10-11 2023-04-20
CN118899345B (zh) * 2024-07-04 2025-03-07 浙江珵美科技有限公司 一种用于表面贴装的光电探测器封装壳

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4103157A (en) * 1977-02-04 1978-07-25 Mcdonnell Douglas Corporation High speed photodetector and system
EP0155528B1 (de) * 1984-02-22 1989-02-01 Siemens Aktiengesellschaft Optoelektronisches Modulgehäuse
US4758767A (en) * 1987-05-15 1988-07-19 Multipoint Control Systems, Incorporated Self-contained analog photodiode light sensing head
JPS63316812A (ja) * 1987-06-19 1988-12-26 Toshiba Corp 光半導体装置
JPH03238877A (ja) * 1990-02-15 1991-10-24 Toshiba Corp 光受光器
JP3067151B2 (ja) * 1990-03-13 2000-07-17 日本電気株式会社 光電気変換素子サブキャリア
JP2715672B2 (ja) * 1991-02-06 1998-02-18 日本電気株式会社 前置増幅器内蔵光半導体受光素子装置
JPH05243587A (ja) * 1992-02-28 1993-09-21 Toshiba Corp 受光デバイス

Also Published As

Publication number Publication date
DE69519894D1 (de) 2001-02-22
CA2148894C (en) 1999-05-11
KR950033539A (ko) 1995-12-26
EP0684651A2 (en) 1995-11-29
EP0684651B1 (en) 2001-01-17
DE69519894T2 (de) 2001-06-07
JPH07312430A (ja) 1995-11-28
JP3047735B2 (ja) 2000-06-05
KR0167628B1 (ko) 1999-04-15
US5610395A (en) 1997-03-11
EP0684651A3 (en) 1997-04-02
CA2148894A1 (en) 1995-11-17

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