TW269741B - - Google Patents

Info

Publication number
TW269741B
TW269741B TW084106031A TW84106031A TW269741B TW 269741 B TW269741 B TW 269741B TW 084106031 A TW084106031 A TW 084106031A TW 84106031 A TW84106031 A TW 84106031A TW 269741 B TW269741 B TW 269741B
Authority
TW
Taiwan
Application number
TW084106031A
Other languages
Chinese (zh)
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Application granted granted Critical
Publication of TW269741B publication Critical patent/TW269741B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07392—Multiple probes manipulating each probe element or tip individually
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • H10W72/90—
    • H10W70/60—
    • H10W72/019—
    • H10W72/29—
    • H10W72/932—
    • H10W72/983—

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW084106031A 1994-07-05 1995-06-13 TW269741B (index.php)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/270,880 US5554940A (en) 1994-07-05 1994-07-05 Bumped semiconductor device and method for probing the same

Publications (1)

Publication Number Publication Date
TW269741B true TW269741B (index.php) 1996-02-01

Family

ID=23033221

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084106031A TW269741B (index.php) 1994-07-05 1995-06-13

Country Status (4)

Country Link
US (1) US5554940A (index.php)
JP (1) JPH0829451A (index.php)
MY (1) MY112466A (index.php)
TW (1) TW269741B (index.php)

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US8067837B2 (en) * 2004-09-20 2011-11-29 Megica Corporation Metallization structure over passivation layer for IC chip
KR100689218B1 (ko) * 2004-07-26 2007-03-02 주식회사 애트랩 볼 그리드 어레이형 디바이스 및 이의 패키징 방법
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JP4745007B2 (ja) * 2005-09-29 2011-08-10 三洋電機株式会社 半導体装置及びその製造方法
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JP4774071B2 (ja) * 2007-04-05 2011-09-14 ルネサスエレクトロニクス株式会社 プローブ抵抗値測定方法、プローブ抵抗値測定用パッドを有する半導体装置
JP5012530B2 (ja) * 2008-01-21 2012-08-29 富士通セミコンダクター株式会社 半導体装置及び半導体基板、並びにモニタ装置の検査方法
JP2009246218A (ja) 2008-03-31 2009-10-22 Renesas Technology Corp 半導体装置の製造方法および半導体装置
US8987014B2 (en) * 2008-05-21 2015-03-24 Stats Chippac, Ltd. Semiconductor wafer and method of forming sacrificial bump pad for wafer probing during wafer sort test
WO2011021506A1 (ja) * 2009-08-18 2011-02-24 アルプス電気株式会社 ボンディングパッドを有するシリコン構造体
US8797057B2 (en) * 2011-02-11 2014-08-05 Taiwan Semiconductor Manufacturing Company, Ltd. Testing of semiconductor chips with microbumps
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
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JP6211855B2 (ja) * 2013-09-03 2017-10-11 ルネサスエレクトロニクス株式会社 半導体装置
KR20160056379A (ko) 2014-11-10 2016-05-20 삼성전자주식회사 트리플 패드 구조를 이용하는 칩 및 그것의 패키징 방법
KR102398663B1 (ko) 2015-07-09 2022-05-16 삼성전자주식회사 칩 패드, 재배선 테스트 패드 및 재배선 접속 패드를 포함하는 반도체 칩
JP6767789B2 (ja) * 2016-06-29 2020-10-14 ローム株式会社 半導体装置
KR102569929B1 (ko) * 2018-07-02 2023-08-24 삼성디스플레이 주식회사 디스플레이 장치
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Also Published As

Publication number Publication date
MY112466A (en) 2001-06-30
US5554940A (en) 1996-09-10
JPH0829451A (ja) 1996-02-02

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees