TW263607B - - Google Patents

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Publication number
TW263607B
TW263607B TW083111386A TW83111386A TW263607B TW 263607 B TW263607 B TW 263607B TW 083111386 A TW083111386 A TW 083111386A TW 83111386 A TW83111386 A TW 83111386A TW 263607 B TW263607 B TW 263607B
Authority
TW
Taiwan
Prior art keywords
code
memory
address
register
multiplexer
Prior art date
Application number
TW083111386A
Other languages
English (en)
Chinese (zh)
Original Assignee
Jenoptik Technologie Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jenoptik Technologie Gmbh filed Critical Jenoptik Technologie Gmbh
Application granted granted Critical
Publication of TW263607B publication Critical patent/TW263607B/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/40—Extraction of image or video features
    • G06V10/44—Local feature extraction by analysis of parts of the pattern, e.g. by detecting edges, contours, loops, corners, strokes or intersections; Connectivity analysis, e.g. of connected components
    • G06V10/457—Local feature extraction by analysis of parts of the pattern, e.g. by detecting edges, contours, loops, corners, strokes or intersections; Connectivity analysis, e.g. of connected components by analysing connectivity, e.g. edge linking, connected component analysis or slices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Artificial Intelligence (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Data Mining & Analysis (AREA)
  • Evolutionary Biology (AREA)
  • Evolutionary Computation (AREA)
  • General Engineering & Computer Science (AREA)
  • Image Analysis (AREA)
  • Image Processing (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
TW083111386A 1994-05-05 1994-12-07 TW263607B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4415798A DE4415798C1 (de) 1994-05-05 1994-05-05 Verfahren und Schaltungsanordnung zur Auflösung von Äquivalenzen zeilenförmig erfaßter topologisch zusammenhängender Bildstrukturen

Publications (1)

Publication Number Publication Date
TW263607B true TW263607B (de) 1995-11-21

Family

ID=6517321

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083111386A TW263607B (de) 1994-05-05 1994-12-07

Country Status (6)

Country Link
JP (1) JP2903043B2 (de)
KR (1) KR100187884B1 (de)
DE (1) DE4415798C1 (de)
FR (1) FR2719684A1 (de)
IT (1) IT1279096B1 (de)
TW (1) TW263607B (de)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60200379A (ja) * 1984-03-26 1985-10-09 Hitachi Ltd 画像処理用セグメンテ−シヨン装置
JPS6273382A (ja) * 1985-09-26 1987-04-04 Sumitomo Electric Ind Ltd ラベル付け方法
US4624073A (en) * 1985-11-15 1986-11-25 Traco Locking tilt window sash and lock therefor
US4791675A (en) * 1985-12-31 1988-12-13 Schlumberger Systems And Services, Inc. VSP Connectivity pattern recognition system
US4821336A (en) * 1987-02-19 1989-04-11 Gtx Corporation Method and apparatus for simplifying runlength data from scanning of images
JP2878278B2 (ja) * 1987-02-25 1999-04-05 キヤノン株式会社 画像処理方法
JPS63284685A (ja) * 1987-05-15 1988-11-21 Fujitsu Ltd ラベル付け方法
JPH0644290B2 (ja) * 1987-12-14 1994-06-08 富士通株式会社 連結領域のラベル付け回路
JPH01245366A (ja) * 1988-03-28 1989-09-29 Toshiba Eng Co Ltd ラベリングプロセッサ
JPH01292478A (ja) * 1988-05-19 1989-11-24 Fujitsu Ltd 画像データのラベリング方式
JPH02187874A (ja) * 1989-01-17 1990-07-24 Mitsubishi Heavy Ind Ltd 画像処理装置
JPH0546760A (ja) * 1991-08-19 1993-02-26 Matsushita Electric Ind Co Ltd ラベリングプロセツサ

Also Published As

Publication number Publication date
JPH0830791A (ja) 1996-02-02
KR100187884B1 (ko) 1999-06-01
KR950033943A (ko) 1995-12-26
JP2903043B2 (ja) 1999-06-07
FR2719684A1 (fr) 1995-11-10
IT1279096B1 (it) 1997-12-04
ITTO950007A1 (it) 1996-07-09
ITTO950007A0 (it) 1995-01-09
DE4415798C1 (de) 1995-08-03

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