TW202301544A - 基板處理裝置 - Google Patents

基板處理裝置 Download PDF

Info

Publication number
TW202301544A
TW202301544A TW111106564A TW111106564A TW202301544A TW 202301544 A TW202301544 A TW 202301544A TW 111106564 A TW111106564 A TW 111106564A TW 111106564 A TW111106564 A TW 111106564A TW 202301544 A TW202301544 A TW 202301544A
Authority
TW
Taiwan
Prior art keywords
clamping
unit
substrate processing
processing apparatus
clamping unit
Prior art date
Application number
TW111106564A
Other languages
English (en)
Inventor
金邦鉉
宋智勳
朴芝鎬
Original Assignee
南韓商杰宜斯科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南韓商杰宜斯科技有限公司 filed Critical 南韓商杰宜斯科技有限公司
Publication of TW202301544A publication Critical patent/TW202301544A/zh

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67132Apparatus for placing on an insulating substrate, e.g. tape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02057Cleaning during device manufacture
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67063Apparatus for fluid treatment for etching
    • H01L21/67075Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836Wafer tapes, e.g. grinding or dicing support tapes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00Chucks or sockets
    • Y10T279/11Vacuum

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)

Abstract

本發明的基板處理裝置的技術特徵在於,其包含:驅動馬達部;傾斜單元,其以可旋轉的方式連接於驅動馬達部;夾持單元,其配置於傾斜單元並夾持密封圈部;以及連接部,其連接於傾斜單元和夾持單元。

Description

基板處理裝置
本發明涉及基板處理裝置,更詳細地,涉及一種可以減少驅動元件個數並補償密封圈部與夾持單元之間的夾持偏差以防止產生異物,且可以防止由於藥液而導致的腐蝕乃至損傷的基板處理裝置。
一般而言,在半導體的製程中需要執行蝕刻及清洗晶片等步驟,在晶片蝕刻或清洗步驟中需要使用基板處理裝置。
基板處理裝置包含用於清洗晶片的機械卡盤和密封圈結合裝置。晶片安放於機械卡盤的卡盤臺上部,密封圈結合裝置將環狀密封圈部結合於卡盤臺的邊緣區域後,向安放於卡盤臺上的晶片供應處理液。
在卡盤臺的邊緣側上部安裝有多個固定銷,在密封圈部的下部形成有固定槽,以便固定銷對應地插入,當將密封圈結合於卡盤臺上部時,固定銷垂直插入於固定槽。
然而,以往在密封圈結合裝置的夾持單元夾持密封圈部時,會與密封圈部發生夾持偏差。此時,可能隨著夾持單元和密封圈部受到磨損而產生異物,而使得晶片受到汙染或導致晶片的不良率會增加。
另外,密封圈結合裝置以金屬材料製造,因此密封圈結合裝置會受到藥液腐蝕或損傷。
另外,密封圈結合裝置借助於液壓缸而移動,因此為了使密封圈安放到卡盤臺的正確位置,需要大量的時間來安裝密封圈結合裝置。
本發明的先前技術記載於韓國公開專利公報第10-2016-0122067號(2016年10月21日公開,發明名稱:晶片處理裝置及用於晶片處理裝置的密封圈)。
要解決的技術問題
本發明正是為了改善如上所述的問題而研發的,本發明的目的是提供一種能夠減少驅動元件個數並補償密封圈部與夾持單元之間的夾持偏差以防止產生異物,且防止由於藥液而導致的腐蝕乃至損傷的基板處理裝置。
技術問題解決方案
根據本發明的基板處理裝置包含:驅動馬達部;傾斜單元,其以可旋轉的方式連接於驅動馬達部;夾持單元,其配置於傾斜單元並夾持密封圈部;以及連接部,其連接於傾斜單元和夾持單元。
基板處理裝置可以進一步包含位置校正單元,位置校正單元以可移動的方式安裝於連接部與夾持單元,以便當夾持單元夾持密封圈部時校正夾持單元的夾持偏差。
位置校正單元可以包含:推力部,其結合於連接部,且以可移動的方式安裝於夾持單元;以及位置校正部,當位置校正部在校正夾持單元的夾持偏差時,其依據偏差校正間隔進行錯位移動。
推力部可以包含:推力軸部,其連結於連接部,以隔開方式安裝於夾持單元的校正孔部;以及軸承部,其以與推力軸部外側面隔開的方式插設於推力軸部。
位置校正部可以包含:固定構件,其結合於連接部,且形成有復原槽部;位置可變構件,其以與固定構件相向配置的方式結合於夾持單元;球構件其配置於復原槽部與位置可變構件之間;滑塊部,其以包圍球構件的方式結合於夾持單元,且當校正夾持單元的夾持偏差時使球構件在復原槽部中移動;以及彈性構件,其以將位置可變構件向球構件側加壓的方式結合於夾持單元,並對位置可變構件施加彈力,以使當夾持單元釋放密封圈部時,使球構件向復原槽部的原位置移動。
復原槽部可以從固定構件外側面向中心部側傾斜地形成。
連接部可以包含:連接桿部,其連接傾斜單元與夾持單元,供推力部和位置校正部結合;以及連接波紋管部,其以包圍連接桿部外側的方式安裝。
連接部可以進一步包含波紋管密封部,波紋管密封部以密封連接波紋管部的上側與下側的縫隙的方式安裝。
夾持單元可以包含:夾持殼體部,其以與連接部外側面隔開的方式形成有遊動孔部;夾持驅動部,其分別安裝於夾持殼體部的兩側;移動桿部,其連接於夾持驅動部;以及夾持棘爪部,其連接於移動桿部,以便夾持密封圈部。
夾持單元可以進一步包含夾持密封部,夾持密封部安裝於移動桿部外側面,以便密封移動桿部與夾持殼體部的縫隙。
夾持殼體部可以以合成樹脂材料形成。
基板處理裝置可以進一步包含感測部,感測部安裝於傾斜單元,以便感測密封圈部。
感測部可以包含:延伸軟管,其從傾斜單元延伸;感測器部,其在延伸軟管中照射光並感測密封圈部;以及視窗部,其安裝於延伸軟管,以便感測器部照射的光透過。
感測部可以進一步包含空氣流路部,空氣流路部在延伸軟管中形成,以便向視窗部的光輸出側噴射空氣。
基板處理裝置可以進一步包含機械卡盤部,機械卡盤部以可升降且可旋轉的方式安裝於夾持單元的下側。
技術效果
根據本發明,傾斜單元和夾持單元借助於驅動馬達部而旋轉,因而可以精密地控制驅動馬達部的旋轉角度以精密地設置夾持單元的高度和夾持位置。因此,可以顯著地縮短設置夾持單元的夾持位置的時間。
另外,根據本發明,傾斜單元以可旋轉的方式安裝於驅動馬達部,因而當驅動馬達部發生故障或停電等時,驅動馬達部依然保持其狀態。因此,在發生故障或停電時可以防止傾斜單元和夾持單元掉落而碰撞機械卡盤部。
另外,根據本發明,位置校正單元可移動地安裝於連接部和夾持單元,因而當在夾持單元與傾斜單元之間具有細微錯位的狀態下夾持密封圈部時,允許位置校正單元校正夾持單元的夾持偏差。因此,可以防止在夾持單元夾持密封圈部時產生異物,以最大限度減小基板發生汙染或不良。
在下文中,將參照圖式以說明本發明的基板處理裝置的實施例。在說明基板處理裝置的過程中,為了清楚和方便地說明,圖中繪示出的線的厚度或構成要素的尺寸等可以誇張地示出。另外,後述的術語是考慮到本發明中的功能而定義的術語,其會因使用者、運用者的意圖或慣例而有所差異。因此,對這種術語的定義應以本說明書通篇內容為基礎作出。
第1圖是繪示出本發明一實施例的基板處理裝置的側視圖,第2圖是繪示出本發明一實施例的基板處理裝置的後視圖,第3圖是繪示出本發明一實施例的基板處理裝置的剖面圖,第4圖是繪示出在根據本發明一實施例的基板處理裝置中位置校正單元和夾持單元的放大圖。
參照第1圖至第4圖,根據本發明一實施例的基板處理裝置100包含驅動馬達部120、傾斜單元130、夾持單元140和連接部150。
機械卡盤部110安裝於底座部101的上側。機械卡盤部110包含升降驅動部111、主軸驅動部113、主軸部114和卡盤臺116。
升降驅動部111連接於主軸部114以使主軸部114升降。升降驅動部111例如為線性馬達和皮帶驅動部等。
主軸驅動部113連接於主軸部114以使主軸部114旋轉。主軸驅動部113可以與主軸部114一同升降或固定於底座部101。作為主軸驅動部113,可以應用多樣形態的馬達部。
卡盤臺116以借助於主軸部114而旋轉的方式安裝於主軸部114的上側。在卡盤臺116上安放有諸如環形框架晶片的基板(未繪示出)。在卡盤臺116的外周部凸出安裝有多個卡盤銷部117,以便固定密封圈部20。
如果夾持密封圈部20的夾持單元140借助於驅動馬達部120而位於卡盤臺116上側,則卡盤臺116借助於升降驅動部111而上升。隨著卡盤臺116的上升,密封圈部20結合於卡盤臺116的外周部。因此,密封圈部20可以結合於卡盤臺116的正確位置。
在密封圈部20外側面形成有多個約束槽部22,以便被夾持單元140夾持。多個約束槽部22以與夾持單元140的夾持棘爪部146相向的方式形成。密封圈部20對卡盤臺116上安放的基板的外周進行密封,以防止在處理基板時藥液滲入至基板的外周與密封圈部20的內部。
驅動馬達部120配置於機械卡盤部110的一側。驅動馬達部120安裝於底座部101的上側。作為驅動馬達部120,可以應用能夠準確控制旋轉角度的步進馬達。
傾斜單元130以可旋轉的方式連接於驅動馬達部120。傾斜單元130連接於驅動馬達部120的旋轉軸。傾斜單元130在固定待機狀態下保持向上側豎立的狀態。在將密封圈部20結合於機械卡盤部110的外周部時,驅動馬達部120以使傾斜單元130向機械卡盤部110的上側水平旋轉。在傾斜單元130安裝有設置模組(未繪示出),以使夾持單元140可以水平移動以設置夾持單元140的水平方向初始位置。
傾斜單元130的外側以合成樹脂材料形成。因此,可以防止傾斜單元130與諸如藥液的化學物質發生化學反應而受到腐蝕或損傷。另外,傾斜單元130具有耐化學性,因而可以使用多樣種類的藥液,無需根據藥液種類而重新製作傾斜單元130。
夾持單元140配置於傾斜單元130並夾持密封圈部20。夾持單元140可以以橫跨密封圈部20的方式以矩形盒形態形成。夾持單元140以與傾斜單元130隔開的方式安裝於傾斜單元130的下側。夾持單元140持續保持使密封圈部20結合於卡盤臺116的狀態,直至密封圈部20位置完全固定(chucking)於機械卡盤部110為止。完成密封圈部20在機械卡盤部110的位置固定後,隨著驅動馬達部120的驅動,夾持單元140和密封圈部20從機械卡盤部110向上側移動。
連接部150連接於傾斜單元130和夾持單元140。連接部150在傾斜單元130與夾持單元140之間安裝有多個。例如,連接部150可以在傾斜單元130的兩側至少各安裝2個以上。連接部150以與夾持單元140之間存在有微小間隙的狀態安裝。
如上所述,傾斜單元130和夾持單元140借助於驅動馬達部120而旋轉,因而可以精密地控制驅動馬達部120的旋轉角度以精密地設置夾持單元140的高度(水平面)和夾持位置。另外,夾持單元140和傾斜單元130初始設置於密封圈部20的結合位置。因此,可以顯著地縮短設置夾持單元140的夾持位置的時間。
傾斜單元130以可旋轉的方式安裝於驅動馬達部120,因而當驅動馬達部120發生故障或停電等時,驅動馬達部120依然可以保持當前狀態。因此,在發生故障或停電時,可以防止傾斜單元130和夾持單元140掉落而碰撞機械卡盤部110。
另外,驅動馬達部120使傾斜單元130和夾持單元140旋轉,因而可以減少驅動元件的安裝個數。因此,可以減少基板處理裝置100的製造費用。
基板處理裝置100進一步包含位置校正單元160,位置校正單元160以可移動的方式安裝於連接部150與夾持單元140,以便在夾持單元140夾持密封圈部20時校正夾持單元140的夾持偏差。位置校正單元160以一一對應的方式安裝於連接部150。當夾持單元140在夾持偏差範圍內稍許錯位的狀態下夾持密封圈部20時,位置校正單元160允許夾持單元140在夾持偏差範圍內沿水平方向遊動。
位置校正單元160以可移動的方式安裝於連接部150和夾持單元140,因而當夾持單元140在與傾斜單元130之間具有細微錯位的狀態下夾持密封圈部20時,可以允許位置校正單元160校正夾持單元140的夾持偏差。因此,可以防止夾持單元140因夾持偏差而無法夾持密封圈部20的情形。另外,藉由防止夾持單元140和密封圈部20因夾持偏差而磨損,可以防止在夾持單元140和密封圈部20之間產生異物。另外,可以防止異物進入在夾持單元140和密封圈部20的下部處理的基板,因而可以最大限度減少基板發生汙染或不良。
夾持單元140包含夾持殼體部141、夾持驅動部143、移動桿部144和夾持棘爪部146。
在夾持殼體部141以與連接部150外側面隔開的方式形成有遊動孔部142。夾持殼體部141以橫跨密封圈部20的方式以矩形盒形態形成。遊動孔部142的內徑形成得大於連接部150的連接桿部151的外徑。因此,在遊動孔部142的內側面與連接桿部151的外側面之間形成有遊動間隔。遊動間隔大致形成為10mm左右。
夾持驅動部143分別安裝於夾持殼體部141的兩側。作為夾持驅動部143,可以應用借助於液壓而驅動的液壓缸。當然,夾持驅動部143可以應用滾珠絲槓結構、皮帶驅動馬達等多樣形態。
移動桿部144連接於夾持驅動部143。移動桿部144以穿過夾持殼體部141兩側且一部分露出於外部的方式安裝。移動桿部144可以以圓棒或多棱棒形態形成。隨著夾持驅動部143的驅動,移動桿部144進行直線運動。
夾持棘爪部146連接於移動桿部144,以便夾持密封圈部20。此時,在移動桿部144連接有移動構件145,在移動構件145的內側面安裝有夾持棘爪部146。夾持棘爪部146的端部以圓錐形形成,以便插入於密封圈部20的約束槽部22。
夾持單元140包含夾持密封部147,夾持密封部147安裝於移動桿部144外側面,以使移動桿部144與夾持殼體部141的縫隙密封。夾持密封部147可以以環形形成。夾持密封部147對夾持密封部147外側面的縫隙進行密封,因而可以防止諸如藥液煙霧的異物藉由移動桿部144與夾持殼體部141的縫隙進入夾持殼體部141的內部。因此,可以防止夾持殼體部141的內部構成元件受到化學物質等腐蝕或破損。
夾持殼體部141以合成樹脂材料形成。因此,可以防止夾持單元140與諸如藥液的化學物質發生化學反應而受到腐蝕或損傷。另外,夾持殼體部141具有耐化學性,因而可以使用多樣種類的藥液,而無需根據藥液種類重新製作夾持單元140。
連接部150包含連接桿部151和連接波紋管部155。
連接桿部151連接傾斜單元130和夾持單元140,在連接桿部151結合有推力部170和位置校正部180。連接桿部151的外徑形成得小於夾持殼體部141的遊動孔部142的內徑。因此,在連接桿部151的外側面與遊動孔部142的內徑之間形成有遊動間隔H1。
連接波紋管部155以包圍連接桿部151外側的方式安裝。連接波紋管部155的上側和下側借助於波紋管連結螺栓而固定於傾斜單元130的下側和夾持殼體部141的上側。連接波紋管部155也用於執行對夾持殼體部141的遊動孔部142進行密封的作用。連接波紋管部155以合成樹脂材料形成。連接波紋管部155在夾持殼體部141遊動時彈性變形。連接波紋管部155對遊動孔部142進行密封,因而可以阻斷藥液中產生的諸如煙霧的異物進入至夾持殼體部141內部。因此,可以防止夾持單元140的內部受到化學物質等的腐蝕或損傷。
連接部150進一步包含波紋管密封部157,波紋管密封部157以密封連接波紋管部155上側與下側的縫隙的方式安裝。波紋管密封部157可以以圓形形成,以便密封連接波紋管部155的外周。因此,可以阻斷異物藉由連接波紋管部155的上側與下側的縫隙進入。
第4圖是繪示出在根據本發明一實施例的基板處理裝置中的位置校正單元和夾持單元的放大圖,第5圖是繪示出在根據本發明一實施例的基板處理裝置中,當夾持單元夾持密封圈部時位置校正單元依據夾持偏差進行移動的狀態的放大圖,第6圖是繪示出在根據本發明一實施例的基板處理裝置中,當夾持單元釋放密封圈部時位置校正單元恢復到原位置的狀態的放大圖。
參照第4圖至第6圖,位置校正單元160包含推力部170和位置校正部180。
推力部170結合於連接部150,以可移動預定間隔H1(參照第4圖)的方式安裝於夾持單元140。推力部170借助於推力螺栓部172而連接於連接部150。各連接部150安裝有一個推力部170。推力部170可移動地安裝於夾持單元140的夾持殼體部141的遊動孔部142。
當位置校正部180在校正夾持單元140的夾持偏差時,依據偏差校正間隔G1進行錯位移動。位置校正部180的上側固定於連接部150,位置校正部180的下側可移動地安裝於夾持殼體部141的校正孔部149。位置校正部180插入於夾持殼體部141的校正孔部149。
因此,在夾持單元140與傾斜單元130之間具有細微錯位的狀態下夾持密封圈部20時,推力部170與位置校正部180允許夾持單元140依據偏差校正間隔G1移動。因此,可以防止夾持單元140因夾持偏差而無法夾持密封圈部20。另外,藉由防止夾持單元140與密封圈部20因夾持偏差而磨損,從而可以防止在夾持單元140和密封圈部20之間產生異物。另外,能夠防止異物進入在夾持單元140和密封圈部20的下部處理的基板,因而可以最大限度減少發生基板汙染或不良。
推力部170包含:推力軸部171,推力軸部171連結於連接部150,且可移動地安裝於夾持單元140的校正孔部149;軸承部173,軸承部173以與推力軸部171外側面隔開的方式插設於推力軸部171。
在推力軸部171上形成有連結孔部171a,以便推力螺栓部172插入。在推力軸部171上形成有凸緣部171b,以便支撐軸承部173。推力軸部171的外徑形成得小於軸承部173的內徑。軸承部173插入於推力軸部171並支撐夾持殼體部141。當夾持殼體部141在推力軸部171中移動時,軸承部173在夾持殼體部141移動時,且在推力軸部171的凸緣部171b處依據夾持偏差間隔H2移動。因此,即使推力軸部171固定於連接部150,隨著推力軸部171在軸承部173內部移動,可以消除夾持單元140的夾持偏差。
位置校正部180包含固定構件181、位置可變構件183、球構件184、滑塊部185和彈性構件186。
固定構件181結合於連接部150,其形成有復原槽部181a。復原槽部181a從固定構件181外側面向中心部側傾斜地形成。此時,復原槽部181a的中心部以圓錐形態形成。當然,復原槽部181a可以以中心部凹陷的圓形形態形成。
位置可變構件183以與固定構件181相向配置的方式結合於夾持單元140。在位置可變構件183的上側形成有掛接部183a,以便掛接於彈性構件186的上側。位置可變構件183整體上可以以圓柱形態形成。
球構件184配置於復原槽部181a與位置可變構件183之間。球構件184滾動接觸復原槽部181a和位置可變構件183的上側。因此,校正夾持單元140的夾持時,球構件184在復原槽部181a與位置可變構件183之間順利移動,因而可以防止分離噪聲的產生。另外,可以最大限度地減小復原槽部181a和位置可變構件183因摩擦力而可能發生的磨損。
另外,復原槽部181a以圓錐形態形成,因而球構件184可以從復原槽部181a的中心部向上方移動。因此,球構件184從復原槽部181a的中心部向多樣方向移動,因而可以使密封圈部20與夾持單元140的軸中心一致或校正夾持單元140的夾持棘爪部146與密封圈部20的約束槽部22沿圓周方向錯位狀態的夾持偏差。
滑塊部185以包圍球構件184的方式結合於夾持單元140,在校正夾持單元140的夾持偏差時使球構件184在復原槽部181a移動。滑塊部185以環形態形成。滑塊部185以能沿半徑方向移動的方式安裝。球構件184滑動接觸滑塊部185的內部。滑塊部185在校正夾持偏差時,與夾持殼體部141一同移動。
彈性構件186以向球構件184側對位置可變構件183加壓的方式結合於夾持單元140,對位置可變構件183施加彈力,以使如果夾持單元140釋放密封圈部20時,使球構件184移動到復原槽部181a的原位置。
因此,當夾持單元140夾持密封圈部20時,如果夾持單元140依據夾持偏差向一側移動,則球構件184在向復原槽部181a一側移動的同時對彈性構件186加壓,因而彈性構件186的長度收縮。另外,當夾持單元140解除密封圈部20的夾持時,如果夾持單元140移動到原位置,則隨著球構件184恢復原狀到復原槽部181a中心部,且彈性構件186的長度伸長。
第7圖是繪示出在根據本發明一實施例的基板處理裝置中地感測部的放大圖。
參照第7圖,基板處理裝置100進一步包含感測部190,感測部190安裝於傾斜單元130,以便感測密封圈部20。感測部190感測密封圈部20,因而密封圈部20被夾持單元140夾持後,可以使密封圈部20結合於卡盤臺116。
感測部190包含:延伸軟管191,延伸軟管191從傾斜單元130延伸;感測器部193,感測器部193在延伸軟管191中照射光並感測密封圈部20;視窗部195,視窗部195安裝於延伸軟管191,以便感測器部193照射的光透過。延伸軟管191以從傾斜單元130向下側彎曲的形態形成。感測器部193照射光並接收反射光以感測密封圈部20的有無。夾持驅動部143的夾持感測部(未繪示出)感測密封圈部20是否夾持。視窗部195配置於光通道部192,以便感測器部193照射的光透過。光通道部192可以以直徑向下側越來越增加的圓錐形態形成。視窗部195阻隔諸如藥液煙霧的異物進入光通道部192。因此,可以防止異物附著於感測器部193,以防止感測器部193發生失靈。
感測部190進一步包含空氣流路部197,空氣流路部197在延伸軟管191中形成,以便向視窗部195的光輸出側噴射空氣。空氣流路部197以避開感測器部193的方式在延伸軟管191中形成。在空氣流路部197的端部連接有多個空氣噴射部198,以便向視窗部195的下側噴射空氣。空氣流路部197可以在延伸軟管191中以多樣形態形成。空氣流路部197連接於空氣供應部(未繪示出)。
延伸軟管191以合成樹脂材料形成。因此,可以防止延伸軟管191和感測器部193等因化學物質等而受到腐蝕或損傷。另外,即使應用多樣種類的藥液,也無需重新製作延伸軟管191。
本發明以圖式中繪示出的實施例為參考進行了說明,但這只是示例而已,只要是本發明所屬技術領域具有通常知識者便會理解,可以由此導出多樣的變形及均等的其它實施例。
因此,本發明真正的技術保護範圍應根據發明申請專利範圍確定。
20:密封圈部 22:約束槽部 100:基板處理裝置 101:底座部 110:機械卡盤部 111:升降驅動部 113:主軸驅動部 114:主軸部 116:卡盤臺 117:卡盤銷部 120:驅動馬達部 121:驅動軸部 122:驅動臂部 130:傾斜單元 140:夾持單元 141:夾持殼體部 142:遊動孔部 143:夾持驅動部 144:移動桿部 145:移動構件 146:夾持棘爪部 147:夾持密封部 148:軸承孔部 149:校正孔部 150:連接部 151:連接桿部 155:連接波紋管部 157:波紋管密封部 160:位置校正單元 170:推力部 171:推力軸部 171a:連結孔部 171b:凸緣部 172:推力螺栓部 173:軸承部 180:位置校正部 181:固定構件 181a:復原槽部 183:位置可變構件 183a:掛接部 184:球構件 185:滑塊部 186:彈性構件 190:感測部 191:延伸軟管 192:光通道部 193:感測器部 195:視窗部 197:空氣流路部 198:空氣噴射部 H1,H2:間隔 G1:偏差校正間隔
第1圖是繪示出本發明一實施例的基板處理裝置的側視圖。 第2圖是繪示出本發明一實施例的基板處理裝置的後視圖。 第3圖是繪示出本發明一實施例的基板處理裝置的剖面圖。 第4圖是繪示出在根據本發明一實施例的基板處理裝置中的位置校正單元和夾持單元的放大圖。 第5圖是繪示出在根據本發明一實施例的基板處理裝置中,當夾持單元夾持密封圈部時位置校正單元依據夾持偏差進行移動的狀態的放大圖。 第6圖是繪示出在根據本發明一實施例的基板處理裝置中,當夾持單元釋放密封圈部時位置校正單元恢復到原位置的狀態的放大圖。 第7圖是繪示出在根據本發明一實施例的基板處理裝置中的感測部的放大圖。
20:密封圈部
100:基板處理裝置
101:底座部
110:機械卡盤部
111:升降驅動部
113:主軸驅動部
114:主軸部
116:卡盤臺
117:卡盤銷部
120:驅動馬達部
122:驅動臂部
130:傾斜單元
140:夾持單元
143:夾持驅動部
144:移動桿部
145:移動構件
146:夾持棘爪部
150:連接部

Claims (15)

  1. 一種基板處理裝置,其包含: 一驅動馬達部; 一傾斜單元,該傾斜單元以可旋轉的方式連接於該驅動馬達部; 一夾持單元,該夾持單元配置於該傾斜單元並夾持一密封圈部;以及 一連接部,該連接部連接於該傾斜單元和該夾持單元。
  2. 如請求項1所述之基板處理裝置,其進一步包含一位置校正單元,該位置校正單元以可移動的方式安裝於該連接部與該夾持單元,以在當該夾持單元夾持該密封圈部時校正該夾持單元的夾持偏差。
  3. 如請求項2所述之基板處理裝置,其中, 該位置校正單元包含: 一推力部,該推力部結合於該連接部,且以可移動的方式安裝於該夾持單元;以及 一位置校正部,當該位置校正部在校正該夾持單元的夾持偏差時,其依據一偏差校正間隔進行錯位移動。
  4. 如請求項3所述之基板處理裝置,其中, 該推力部包含: 一推力軸部,該推力軸部連結於該連接部,以隔開方式安裝於該夾持單元的一校正孔部;以及 一軸承部,該軸承部以與該推力軸部外側面隔開的方式插設於該推力軸部。
  5. 如請求項3所述之基板處理裝置,其中, 該位置校正部包含: 一固定構件,該固定構件結合於該連接部,且形成有一復原槽部; 一位置可變構件,該位置可變構件以與該固定構件相向配置的方式結合於該夾持單元; 一球構件,該球構件配置於該復原槽部與該位置可變構件之間; 一滑塊部,該滑塊部以包圍該球構件的方式結合於該夾持單元,當校正該夾持單元的夾持偏差時使該球構件在該復原槽部中移動;以及 一彈性構件,該彈性構件以將該位置可變構件向該球構件側加壓的方式結合於該夾持單元,並對該位置可變構件施加彈力,以使當該夾持單元釋放該密封圈部時,使該球構件向該復原槽部的原位置移動。
  6. 如請求項5所述之基板處理裝置,其中, 該復原槽部從該固定構件外側面向一中心部側傾斜地形成。
  7. 如請求項3所述之基板處理裝置,其中, 該連接部包含: 一連接桿部,該連接桿部連接該傾斜單元與該夾持單元,供該推力部和該位置校正部結合;以及 一連接波紋管部,該連接波紋管部以包圍該連接桿部外側的方式安裝。
  8. 如請求項7所述之基板處理裝置,其中, 該連接部進一步包含一波紋管密封部,該波紋管密封部以密封該連接波紋管部的上側與下側的縫隙的方式安裝。
  9. 如請求項3所述之基板處理裝置,其中, 該夾持單元包含: 一夾持殼體部,該夾持殼體部以與該連接部外側面隔開的方式形成有一遊動孔部; 一夾持驅動部,該夾持驅動部分別安裝於該夾持殼體部的兩側; 一移動桿部,該移動桿部連接於該夾持驅動部;以及 一夾持棘爪部,該夾持棘爪部連接於該移動桿部,以便夾持該密封圈部。
  10. 如請求項9所述之基板處理裝置,其中, 該夾持單元進一步包含一夾持密封部,該夾持密封部安裝於該移動桿部外側面,以便密封該移動桿部與該夾持殼體部的縫隙。
  11. 如請求項9所述之基板處理裝置,其中, 該夾持殼體部以合成樹脂材料形成。
  12. 如請求項9所述之基板處理裝置,其進一步包含一感測部,該感測部安裝於該傾斜單元,以便感測該密封圈部。
  13. 如請求項12所述之基板處理裝置,其中, 該感測部包含: 一延伸軟管,該延伸軟管從該傾斜單元延伸; 一感測器部,該感測器部在該延伸軟管中照射光並感測該密封圈部;以及 一視窗部,該視窗部安裝於該延伸軟管,以便該感測器部照射的光透過。
  14. 如請求項13所述之基板處理裝置,其中, 該感測部進一步包含一空氣流路部,該空氣流路部在該延伸軟管中形成,以便向該視窗部的光輸出側噴射空氣。
  15. 如請求項1所述之基板處理裝置,其進一步包含一機械卡盤部,該機械卡盤部以可升降且可旋轉的方式安裝於該夾持單元的下側。
TW111106564A 2020-08-25 2022-02-23 基板處理裝置 TW202301544A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR20200106758 2020-08-25
KR1020210083046A KR20220027007A (ko) 2020-08-25 2021-06-25 기판처리장치
KR10-2021-0083046 2021-06-25

Publications (1)

Publication Number Publication Date
TW202301544A true TW202301544A (zh) 2023-01-01

Family

ID=80357019

Family Applications (4)

Application Number Title Priority Date Filing Date
TW110120098A TWI821679B (zh) 2020-08-25 2021-06-02 基板處理裝置及基板處理方法
TW111106563A TWI824420B (zh) 2020-08-25 2022-02-23 基板清洗裝置及其控制方法
TW111106564A TW202301544A (zh) 2020-08-25 2022-02-23 基板處理裝置
TW111106562A TWI833167B (zh) 2020-08-25 2022-02-23 基板處理裝置

Family Applications Before (2)

Application Number Title Priority Date Filing Date
TW110120098A TWI821679B (zh) 2020-08-25 2021-06-02 基板處理裝置及基板處理方法
TW111106563A TWI824420B (zh) 2020-08-25 2022-02-23 基板清洗裝置及其控制方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW111106562A TWI833167B (zh) 2020-08-25 2022-02-23 基板處理裝置

Country Status (5)

Country Link
US (2) US11901212B2 (zh)
KR (7) KR20220027011A (zh)
CN (1) CN114121758A (zh)
TW (4) TWI821679B (zh)
WO (3) WO2022270712A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI821679B (zh) * 2020-08-25 2023-11-11 南韓商杰宜斯科技有限公司 基板處理裝置及基板處理方法

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0296726U (zh) * 1989-01-19 1990-08-01
KR100396379B1 (ko) * 2001-05-10 2003-09-02 아남반도체 주식회사 오존을 이용한 습식 세정장비
JP2006049591A (ja) * 2004-08-05 2006-02-16 Disco Abrasive Syst Ltd ウエーハに貼着された接着フィルムの破断方法および破断装置
JP2006054246A (ja) * 2004-08-10 2006-02-23 Disco Abrasive Syst Ltd ウエーハの分離方法
JP4630692B2 (ja) * 2005-03-07 2011-02-09 株式会社ディスコ レーザー加工方法
JP4851795B2 (ja) * 2006-01-13 2012-01-11 株式会社ディスコ ウエーハの分割装置
KR100752653B1 (ko) * 2006-02-01 2007-08-29 삼성전자주식회사 약액조 내에 가열부를 구비하는 기판 습식 처리 장치 및상기 장치를 사용한 기판 처리용 케미컬 가열 방법
KR100831989B1 (ko) * 2006-08-30 2008-05-23 세메스 주식회사 기판 처리 장치
KR100868364B1 (ko) * 2007-09-18 2008-11-12 세메스 주식회사 초음파 발생 장치 및 이를 갖는 기판 세정 장치
KR20100097155A (ko) * 2007-11-15 2010-09-02 후루카와 덴키 고교 가부시키가이샤 반도체 웨이퍼 가공용 점착 테이프
KR100938249B1 (ko) * 2008-05-09 2010-01-21 세메스 주식회사 초음파 발생 장치 및 이를 포함하는 기판 세정 장치
KR101004432B1 (ko) * 2008-06-10 2010-12-28 세메스 주식회사 매엽식 기판 처리 장치
JP5580701B2 (ja) * 2010-09-13 2014-08-27 日東電工株式会社 ダイシング・ダイボンドフィルム
JP5805411B2 (ja) * 2011-03-23 2015-11-04 ファスフォードテクノロジ株式会社 ダイボンダのピックアップ方法およびダイボンダ
JP5908703B2 (ja) * 2011-11-11 2016-04-26 株式会社ディスコ 研削装置及び円形板状ワークの洗浄方法
US20140026926A1 (en) * 2012-07-30 2014-01-30 Lam Research Ag Method and apparatus for liquid treatment of wafer-shaped articles
JP6156509B2 (ja) * 2013-10-15 2017-07-05 三菱電機株式会社 半導体素子の製造方法
KR20150056287A (ko) * 2013-11-15 2015-05-26 김윤수 패널용 초음파 세정장치
NL2014625B1 (en) 2015-04-13 2017-01-06 Suss Microtec Lithography Gmbh Wafer treating device and sealing ring for a wafer treating device.
US20160376702A1 (en) * 2015-06-26 2016-12-29 Lam Research Ag Dual mode chamber for processing wafer-shaped articles
JP6573531B2 (ja) * 2015-11-02 2019-09-11 東京エレクトロン株式会社 洗浄装置、剥離システム、洗浄方法、剥離方法、プログラム、および情報記憶媒体
JP6577341B2 (ja) * 2015-11-13 2019-09-18 日東電工株式会社 積層体および半導体装置の製造方法
KR102637959B1 (ko) * 2016-10-25 2024-02-20 에이씨엠 리서치 (상하이), 인코포레이티드 반도체 기판의 습식 처리를 위한 장치 및 방법
JP6842934B2 (ja) * 2017-01-27 2021-03-17 株式会社Screenホールディングス 基板搬送装置、検出位置較正方法および基板処理装置
JP7217585B2 (ja) * 2017-04-13 2023-02-03 株式会社ディスコ 分割方法
JP6901909B2 (ja) * 2017-06-05 2021-07-14 株式会社ディスコ エキスパンド方法及びエキスパンド装置
JP6934327B2 (ja) * 2017-06-07 2021-09-15 株式会社ディスコ ウエーハの分割方法及び分割装置
JP7042667B2 (ja) * 2018-03-28 2022-03-28 古河電気工業株式会社 半導体チップの製造方法
US11037805B2 (en) * 2018-11-23 2021-06-15 Nanya Technology Corporation Wafer cleaning apparatus and method of cleaning wafer
KR102083268B1 (ko) * 2019-08-14 2020-05-29 주식회사 에스엠비코퍼레이션 금속메쉬 세척 장치
TWI821679B (zh) * 2020-08-25 2023-11-11 南韓商杰宜斯科技有限公司 基板處理裝置及基板處理方法

Also Published As

Publication number Publication date
TWI824420B (zh) 2023-12-01
US11901212B2 (en) 2024-02-13
TW202213445A (zh) 2022-04-01
TW202301543A (zh) 2023-01-01
KR20220027006A (ko) 2022-03-07
KR20220027005A (ko) 2022-03-07
US20240038573A1 (en) 2024-02-01
WO2022270712A1 (ko) 2022-12-29
KR20220027008A (ko) 2022-03-07
TW202300240A (zh) 2023-01-01
KR20220027010A (ko) 2022-03-07
WO2022270714A1 (ko) 2022-12-29
KR20220027009A (ko) 2022-03-07
WO2022270713A1 (ko) 2022-12-29
CN114121758A (zh) 2022-03-01
US20220068697A1 (en) 2022-03-03
TWI833167B (zh) 2024-02-21
KR20220027007A (ko) 2022-03-07
TWI821679B (zh) 2023-11-11
KR20220027011A (ko) 2022-03-07

Similar Documents

Publication Publication Date Title
US8051522B2 (en) Substrate treatment apparatus
US8104488B2 (en) Single side workpiece processing
CN109037106B (zh) 基板清洗装置
TW202301544A (zh) 基板處理裝置
US20070110895A1 (en) Single side workpiece processing
KR102120745B1 (ko) 고압가스통의 자동 정렬장치
US20060102210A1 (en) Substrate processing container
TW201537666A (zh) 清淨裝置及清淨方法
TWI826979B (zh) 基板處理裝置及基板處理裝置的控制方法
CN111433510B (zh) 高压气罐的自动校准方法
JPH11163094A (ja) 基板チャッキング装置および基板洗浄装置
JP4693175B2 (ja) 加圧式処理液供給装置
JP3973022B2 (ja) ドラム缶のプラグ装着装置
KR101591842B1 (ko) 배관 어셈블리 및 이를 가지는 기판처리장치
JP2007220952A (ja) 基板位置決め方法、基板位置決め装置および基板処理装置
TW202308032A (zh) 基板處理方法
TWI817132B (zh) 基板處理裝置及基板處理方法
TWI814011B (zh) 基板處理裝置
TWI827013B (zh) 基板處理方法
WO2021112130A1 (ja) ウェハ処理装置
JPH08206570A (ja) 回転式基板処理装置
TWI832059B (zh) 基板處理裝置及其控制方法
JP2021125667A (ja) ウェハ処理装置
KR20200027229A (ko) 가스공급용 노즐패드 및 이를 구비한 웨이퍼 용기의 가스공급장치
KR20230173506A (ko) 일체형 가스공급장치용 얼라인 하우징