TW201935605A - 基板搬送裝置及基板吸附裝置 - Google Patents
基板搬送裝置及基板吸附裝置 Download PDFInfo
- Publication number
- TW201935605A TW201935605A TW108100377A TW108100377A TW201935605A TW 201935605 A TW201935605 A TW 201935605A TW 108100377 A TW108100377 A TW 108100377A TW 108100377 A TW108100377 A TW 108100377A TW 201935605 A TW201935605 A TW 201935605A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- suction
- adsorption
- driving
- section
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Robotics (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP2018-015688 | 2018-01-31 | ||
JP2018015688A JP7033303B2 (ja) | 2018-01-31 | 2018-01-31 | 基板搬送装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201935605A true TW201935605A (zh) | 2019-09-01 |
Family
ID=67443730
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108100377A TW201935605A (zh) | 2018-01-31 | 2019-01-04 | 基板搬送裝置及基板吸附裝置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7033303B2 (ko) |
KR (1) | KR20190093151A (ko) |
CN (1) | CN110092196B (ko) |
TW (1) | TW201935605A (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112010040B (zh) * | 2020-08-10 | 2021-11-02 | Tcl华星光电技术有限公司 | 基板传送装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2534842B2 (ja) * | 1994-12-26 | 1996-09-18 | 富山日本電気株式会社 | 基板分離装置および基板分離方法 |
JPH09100042A (ja) * | 1995-10-03 | 1997-04-15 | Hitachi Chem Co Ltd | 多層プリント板の吸着搬送装置 |
TW200301211A (en) | 2001-12-11 | 2003-07-01 | Mitsuboshi Diamond Ind Co Ltd | Method of suckingly holding substrate, and suckingly and holdingly carrying machine using the method |
KR20110047941A (ko) * | 2009-10-30 | 2011-05-09 | 선 에흐웨이 | 기판흡착장치 및 기판흡착어셈블리 |
JP5938904B2 (ja) * | 2009-12-16 | 2016-06-22 | 株式会社ニコン | 基板支持部材、基板搬送装置、基板搬送方法、露光装置及びデバイス製造方法 |
JP2012129228A (ja) * | 2010-12-13 | 2012-07-05 | Toppan Printing Co Ltd | 基板移載装置並びに基板の取り出し方法および基板の収納方法 |
US9130484B2 (en) * | 2011-10-19 | 2015-09-08 | Sri International | Vacuum augmented electroadhesive device |
JP2013180891A (ja) | 2012-03-05 | 2013-09-12 | Ushio Inc | 基板搬送装置 |
JP5979594B2 (ja) * | 2012-09-13 | 2016-08-24 | 村田機械株式会社 | 吸引チャック、及びこれを備えた移載装置 |
EP2911833B1 (en) * | 2012-10-12 | 2018-02-21 | SRI International | Vacuum augmented electroadhesive device |
CN204980362U (zh) * | 2015-09-23 | 2016-01-20 | 合肥鑫晟光电科技有限公司 | 一种显示面板传输系统 |
-
2018
- 2018-01-31 JP JP2018015688A patent/JP7033303B2/ja active Active
-
2019
- 2019-01-04 TW TW108100377A patent/TW201935605A/zh unknown
- 2019-01-17 CN CN201910043236.6A patent/CN110092196B/zh active Active
- 2019-01-29 KR KR1020190011449A patent/KR20190093151A/ko active Search and Examination
Also Published As
Publication number | Publication date |
---|---|
KR20190093151A (ko) | 2019-08-08 |
JP2019131371A (ja) | 2019-08-08 |
CN110092196A (zh) | 2019-08-06 |
CN110092196B (zh) | 2022-04-08 |
JP7033303B2 (ja) | 2022-03-10 |
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