TW201533144A - 密封用組成物 - Google Patents

密封用組成物 Download PDF

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Publication number
TW201533144A
TW201533144A TW104102031A TW104102031A TW201533144A TW 201533144 A TW201533144 A TW 201533144A TW 104102031 A TW104102031 A TW 104102031A TW 104102031 A TW104102031 A TW 104102031A TW 201533144 A TW201533144 A TW 201533144A
Authority
TW
Taiwan
Prior art keywords
group
sealing
composition
organic electroluminescence
component
Prior art date
Application number
TW104102031A
Other languages
English (en)
Chinese (zh)
Other versions
TWI561574B (https=
Inventor
Tomoya Egawa
Original Assignee
Daicel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Corp filed Critical Daicel Corp
Publication of TW201533144A publication Critical patent/TW201533144A/zh
Application granted granted Critical
Publication of TWI561574B publication Critical patent/TWI561574B/zh

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Electroluminescent Light Sources (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Epoxy Resins (AREA)
  • Sealing Material Composition (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
TW104102031A 2014-01-23 2015-01-22 密封用組成物 TW201533144A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014010770 2014-01-23

Publications (2)

Publication Number Publication Date
TW201533144A true TW201533144A (zh) 2015-09-01
TWI561574B TWI561574B (https=) 2016-12-11

Family

ID=53681329

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104102031A TW201533144A (zh) 2014-01-23 2015-01-22 密封用組成物

Country Status (5)

Country Link
JP (1) JP5914778B2 (https=)
KR (1) KR101641480B1 (https=)
CN (1) CN105557068B (https=)
TW (1) TW201533144A (https=)
WO (1) WO2015111525A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI874385B (zh) * 2019-04-23 2025-03-01 日商電化股份有限公司 有機電致發光顯示元件用密封劑

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105246940B (zh) * 2013-05-28 2018-09-04 株式会社大赛璐 光半导体密封用固化性组合物
CN105940767B (zh) * 2014-05-20 2018-02-09 积水化学工业株式会社 有机电致发光显示元件用密封剂
CN108353475A (zh) * 2015-11-30 2018-07-31 株式会社大赛璐 密封用组合物
JP6022725B1 (ja) * 2016-03-31 2016-11-09 Lumiotec株式会社 有機elパネル及びその製造方法
KR101922296B1 (ko) * 2016-06-23 2018-11-26 삼성에스디아이 주식회사 고체상 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 포함하는 봉지재 및 반도체 패키지
TWI747950B (zh) 2016-09-07 2021-12-01 日商琳得科股份有限公司 黏著劑組合物、密封片及密封體
CN109790427B (zh) 2016-09-07 2021-08-20 琳得科株式会社 粘接剂组合物、密封片、以及密封体
US11377518B2 (en) 2016-09-30 2022-07-05 Lg Chem, Ltd. Adhesive composition
US11171309B2 (en) 2016-12-09 2021-11-09 Lg Chem, Ltd. Encapsulating composition
US11773253B2 (en) 2016-12-09 2023-10-03 Lg Chem, Ltd. Encapsulating composition
TWI705983B (zh) 2016-12-09 2020-10-01 南韓商Lg化學股份有限公司 封裝組成物
KR102118375B1 (ko) 2016-12-09 2020-06-04 주식회사 엘지화학 밀봉재 조성물
CN110709485B (zh) 2017-05-31 2022-06-28 琳得科株式会社 片状粘接剂、阻气层叠体及密封体
JP6538774B2 (ja) * 2017-07-28 2019-07-03 株式会社ダイセル モノマー混合物、及びそれを含む硬化性組成物
JP6665136B2 (ja) * 2017-07-28 2020-03-13 株式会社ダイセル モノマー混合物、及びそれを含む硬化性組成物
KR102167216B1 (ko) * 2017-09-01 2020-10-20 주식회사 엘지화학 유기전자장치의 제조 방법
KR102716967B1 (ko) 2018-01-31 2024-10-11 니폰 제온 가부시키가이샤 수지 필름 및 유기 일렉트로루미네센스 장치
US11970606B2 (en) 2018-01-31 2024-04-30 Zeon Corporation Resin composition, resin film and organic electroluminescent device
JP6547110B1 (ja) * 2018-05-08 2019-07-24 ナトコ株式会社 活性エネルギー線硬化性インク組成物
WO2020196669A1 (ja) * 2019-03-27 2020-10-01 デンカ株式会社 組成物
KR20220038275A (ko) * 2019-07-17 2022-03-28 세키스이가가쿠 고교가부시키가이샤 유기 el 표시 소자용 봉지제
WO2022210785A1 (ja) * 2021-03-31 2022-10-06 デンカ株式会社 組成物、硬化体及び有機el表示装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010080093A (ko) * 1999-08-12 2001-08-22 사토 아키오 실링제용광경화형수지조성물 및 실링방법.
JP4384509B2 (ja) 2003-01-09 2009-12-16 積水化学工業株式会社 有機エレクトロルミネッセンス素子の封止方法及び有機エレクトロルミネッセンス素子
JP2007197517A (ja) * 2006-01-24 2007-08-09 Three M Innovative Properties Co 接着性封止組成物、封止フィルム及び有機el素子
JP5457078B2 (ja) * 2009-06-05 2014-04-02 株式会社ダイセル カチオン重合性樹脂組成物、及びその硬化物
JP5651421B2 (ja) * 2010-10-07 2015-01-14 三井化学株式会社 封止用組成物及びそれを用いた封止用シート
KR101453848B1 (ko) * 2010-12-13 2014-10-22 디아이씨 가부시끼가이샤 양이온 경화형 액정 씰제, 및 액정 표시 소자
JP2013157204A (ja) * 2012-01-30 2013-08-15 Sekisui Chem Co Ltd 有機エレクトロルミネッセンス表示素子用封止剤
JP2013170223A (ja) * 2012-02-21 2013-09-02 Sekisui Chem Co Ltd 蒸着用硬化性樹脂組成物、樹脂保護膜、及び、有機光デバイス

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI874385B (zh) * 2019-04-23 2025-03-01 日商電化股份有限公司 有機電致發光顯示元件用密封劑

Also Published As

Publication number Publication date
TWI561574B (https=) 2016-12-11
KR101641480B1 (ko) 2016-07-20
WO2015111525A1 (ja) 2015-07-30
KR20160011228A (ko) 2016-01-29
JPWO2015111525A1 (ja) 2017-03-23
CN105557068B (zh) 2017-06-09
JP5914778B2 (ja) 2016-05-11
CN105557068A (zh) 2016-05-04

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