JP5914778B2 - 封止用組成物 - Google Patents

封止用組成物 Download PDF

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Publication number
JP5914778B2
JP5914778B2 JP2015554922A JP2015554922A JP5914778B2 JP 5914778 B2 JP5914778 B2 JP 5914778B2 JP 2015554922 A JP2015554922 A JP 2015554922A JP 2015554922 A JP2015554922 A JP 2015554922A JP 5914778 B2 JP5914778 B2 JP 5914778B2
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Japan
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group
sealing
composition
component
organic
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Japanese (ja)
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JPWO2015111525A1 (ja
Inventor
智哉 江川
智哉 江川
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Daicel Corp
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Daicel Corp
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Publication of JP5914778B2 publication Critical patent/JP5914778B2/ja
Publication of JPWO2015111525A1 publication Critical patent/JPWO2015111525A1/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Electroluminescent Light Sources (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Epoxy Resins (AREA)
  • Sealing Material Composition (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
JP2015554922A 2014-01-23 2015-01-09 封止用組成物 Active JP5914778B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014010770 2014-01-23
JP2014010770 2014-01-23
PCT/JP2015/051155 WO2015111525A1 (ja) 2014-01-23 2015-01-09 封止用組成物

Publications (2)

Publication Number Publication Date
JP5914778B2 true JP5914778B2 (ja) 2016-05-11
JPWO2015111525A1 JPWO2015111525A1 (ja) 2017-03-23

Family

ID=53681329

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015554922A Active JP5914778B2 (ja) 2014-01-23 2015-01-09 封止用組成物

Country Status (5)

Country Link
JP (1) JP5914778B2 (https=)
KR (1) KR101641480B1 (https=)
CN (1) CN105557068B (https=)
TW (1) TW201533144A (https=)
WO (1) WO2015111525A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020532080A (ja) * 2017-09-01 2020-11-05 エルジー・ケム・リミテッド 有機電子装置の製造方法

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CN105246940B (zh) * 2013-05-28 2018-09-04 株式会社大赛璐 光半导体密封用固化性组合物
CN105940767B (zh) * 2014-05-20 2018-02-09 积水化学工业株式会社 有机电致发光显示元件用密封剂
CN108353475A (zh) * 2015-11-30 2018-07-31 株式会社大赛璐 密封用组合物
JP6022725B1 (ja) * 2016-03-31 2016-11-09 Ｌｕｍｉｏｔｅｃ株式会社 有機ｅｌパネル及びその製造方法
KR101922296B1 (ko) * 2016-06-23 2018-11-26 삼성에스디아이 주식회사 고체상 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 포함하는 봉지재 및 반도체 패키지
TWI747950B (zh) 2016-09-07 2021-12-01 日商琳得科股份有限公司 黏著劑組合物、密封片及密封體
CN109790427B (zh) 2016-09-07 2021-08-20 琳得科株式会社 粘接剂组合物、密封片、以及密封体
US11377518B2 (en) 2016-09-30 2022-07-05 Lg Chem, Ltd. Adhesive composition
US11171309B2 (en) 2016-12-09 2021-11-09 Lg Chem, Ltd. Encapsulating composition
US11773253B2 (en) 2016-12-09 2023-10-03 Lg Chem, Ltd. Encapsulating composition
TWI705983B (zh) 2016-12-09 2020-10-01 南韓商Ｌｇ化學股份有限公司 封裝組成物
KR102118375B1 (ko) 2016-12-09 2020-06-04 주식회사 엘지화학 밀봉재 조성물
CN110709485B (zh) 2017-05-31 2022-06-28 琳得科株式会社 片状粘接剂、阻气层叠体及密封体
JP6538774B2 (ja) * 2017-07-28 2019-07-03 株式会社ダイセル モノマー混合物、及びそれを含む硬化性組成物
JP6665136B2 (ja) * 2017-07-28 2020-03-13 株式会社ダイセル モノマー混合物、及びそれを含む硬化性組成物
KR102716967B1 (ko) 2018-01-31 2024-10-11 니폰 제온 가부시키가이샤 수지 필름 및 유기 일렉트로루미네센스 장치
US11970606B2 (en) 2018-01-31 2024-04-30 Zeon Corporation Resin composition, resin film and organic electroluminescent device
JP6547110B1 (ja) * 2018-05-08 2019-07-24 ナトコ株式会社 活性エネルギー線硬化性インク組成物
WO2020196669A1 (ja) * 2019-03-27 2020-10-01 デンカ株式会社 組成物
JP7440498B2 (ja) * 2019-04-23 2024-02-28 デンカ株式会社 組成物
KR20220038275A (ko) * 2019-07-17 2022-03-28 세키스이가가쿠 고교가부시키가이샤 유기 el 표시 소자용 봉지제
WO2022210785A1 (ja) * 2021-03-31 2022-10-06 デンカ株式会社 組成物、硬化体及び有機ｅｌ表示装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012082266A (ja) * 2010-10-07 2012-04-26 Mitsui Chemicals Inc 封止用組成物及びそれを用いた封止用シート
JP2013157204A (ja) * 2012-01-30 2013-08-15 Sekisui Chem Co Ltd 有機エレクトロルミネッセンス表示素子用封止剤
JP2013170223A (ja) * 2012-02-21 2013-09-02 Sekisui Chem Co Ltd 蒸着用硬化性樹脂組成物、樹脂保護膜、及び、有機光デバイス

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010080093A (ko) * 1999-08-12 2001-08-22 사토 아키오 실링제용광경화형수지조성물 및 실링방법.
JP4384509B2 (ja) 2003-01-09 2009-12-16 積水化学工業株式会社 有機エレクトロルミネッセンス素子の封止方法及び有機エレクトロルミネッセンス素子
JP2007197517A (ja) * 2006-01-24 2007-08-09 Three M Innovative Properties Co 接着性封止組成物、封止フィルム及び有機ｅｌ素子
JP5457078B2 (ja) * 2009-06-05 2014-04-02 株式会社ダイセル カチオン重合性樹脂組成物、及びその硬化物
KR101453848B1 (ko) * 2010-12-13 2014-10-22 디아이씨 가부시끼가이샤 양이온 경화형 액정 씰제, 및 액정 표시 소자

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012082266A (ja) * 2010-10-07 2012-04-26 Mitsui Chemicals Inc 封止用組成物及びそれを用いた封止用シート
JP2013157204A (ja) * 2012-01-30 2013-08-15 Sekisui Chem Co Ltd 有機エレクトロルミネッセンス表示素子用封止剤
JP2013170223A (ja) * 2012-02-21 2013-09-02 Sekisui Chem Co Ltd 蒸着用硬化性樹脂組成物、樹脂保護膜、及び、有機光デバイス

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020532080A (ja) * 2017-09-01 2020-11-05 エルジー・ケム・リミテッド 有機電子装置の製造方法
JP7164268B2 (ja) 2017-09-01 2022-11-01 エルジー・ケム・リミテッド 有機電子装置の製造方法

Also Published As

Publication number Publication date
TWI561574B (https=) 2016-12-11
TW201533144A (zh) 2015-09-01
KR101641480B1 (ko) 2016-07-20
WO2015111525A1 (ja) 2015-07-30
KR20160011228A (ko) 2016-01-29
JPWO2015111525A1 (ja) 2017-03-23
CN105557068B (zh) 2017-06-09
CN105557068A (zh) 2016-05-04

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