TWI561574B - - Google Patents
Info
- Publication number
- TWI561574B TWI561574B TW104102031A TW104102031A TWI561574B TW I561574 B TWI561574 B TW I561574B TW 104102031 A TW104102031 A TW 104102031A TW 104102031 A TW104102031 A TW 104102031A TW I561574 B TWI561574 B TW I561574B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
Landscapes
- Optics & Photonics (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Electroluminescent Light Sources (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Epoxy Resins (AREA)
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymerisation Methods In General (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014010770 | 2014-01-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201533144A TW201533144A (zh) | 2015-09-01 |
| TWI561574B true TWI561574B (https=) | 2016-12-11 |
Family
ID=53681329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104102031A TW201533144A (zh) | 2014-01-23 | 2015-01-22 | 密封用組成物 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5914778B2 (https=) |
| KR (1) | KR101641480B1 (https=) |
| CN (1) | CN105557068B (https=) |
| TW (1) | TW201533144A (https=) |
| WO (1) | WO2015111525A1 (https=) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5926458B2 (ja) * | 2013-05-28 | 2016-05-25 | 株式会社ダイセル | 光半導体封止用硬化性組成物 |
| CN105940767B (zh) * | 2014-05-20 | 2018-02-09 | 积水化学工业株式会社 | 有机电致发光显示元件用密封剂 |
| JPWO2017094809A1 (ja) * | 2015-11-30 | 2018-09-13 | 株式会社ダイセル | 封止用組成物 |
| JP6022725B1 (ja) * | 2016-03-31 | 2016-11-09 | Ｌｕｍｉｏｔｅｃ株式会社 | 有機ｅｌパネル及びその製造方法 |
| KR101922296B1 (ko) * | 2016-06-23 | 2018-11-26 | 삼성에스디아이 주식회사 | 고체상 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 포함하는 봉지재 및 반도체 패키지 |
| CN109642134B (zh) | 2016-09-07 | 2021-07-06 | 琳得科株式会社 | 粘结剂组合物、密封片和密封体 |
| WO2018047868A1 (ja) | 2016-09-07 | 2018-03-15 | リンテック株式会社 | 接着剤組成物、封止シート、及び封止体 |
| JP6719662B2 (ja) | 2016-09-30 | 2020-07-08 | エルジー・ケム・リミテッド | 接着剤組成物 |
| WO2018106092A1 (ko) | 2016-12-09 | 2018-06-14 | 주식회사 엘지화학 | 밀봉재 조성물 |
| US11171309B2 (en) | 2016-12-09 | 2021-11-09 | Lg Chem, Ltd. | Encapsulating composition |
| US12104075B2 (en) | 2016-12-09 | 2024-10-01 | Lg Chem, Ltd. | Encapsulating composition |
| US10851232B2 (en) | 2016-12-09 | 2020-12-01 | Lg Chem, Ltd. | Encapsulating composition, organic electronic device and method for manufacturing thereof |
| WO2018221510A1 (ja) | 2017-05-31 | 2018-12-06 | リンテック株式会社 | シート状接着剤、ガスバリア性積層体、及び封止体 |
| JP6538774B2 (ja) | 2017-07-28 | 2019-07-03 | 株式会社ダイセル | モノマー混合物、及びそれを含む硬化性組成物 |
| JP6665136B2 (ja) * | 2017-07-28 | 2020-03-13 | 株式会社ダイセル | モノマー混合物、及びそれを含む硬化性組成物 |
| EP3678203B1 (en) | 2017-09-01 | 2025-06-18 | LG Chem, Ltd. | Method for preparing organic electronic device |
| WO2019151142A1 (ja) * | 2018-01-31 | 2019-08-08 | 日本ゼオン株式会社 | 樹脂組成物、樹脂フィルム及び有機エレクトロルミネッセンス装置 |
| CN111602467B (zh) | 2018-01-31 | 2023-08-29 | 日本瑞翁株式会社 | 树脂膜和有机电致发光装置 |
| JP6547110B1 (ja) * | 2018-05-08 | 2019-07-24 | ナトコ株式会社 | 活性エネルギー線硬化性インク組成物 |
| JP7269323B2 (ja) * | 2019-03-27 | 2023-05-08 | デンカ株式会社 | 組成物 |
| JP7440498B2 (ja) * | 2019-04-23 | 2024-02-28 | デンカ株式会社 | 組成物 |
| JP7561031B2 (ja) * | 2019-07-17 | 2024-10-03 | 積水化学工業株式会社 | 有機ｅｌ表示素子用封止剤 |
| WO2022210785A1 (ja) * | 2021-03-31 | 2022-10-06 | デンカ株式会社 | 組成物、硬化体及び有機ｅｌ表示装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW500791B (en) * | 1999-08-12 | 2002-09-01 | Mitsui Chemicals Inc | Photo-curable resin composition for sealing material and sealing method |
| US20090026934A1 (en) * | 2006-01-24 | 2009-01-29 | Jun Fujita | Adhesive encapsulating composition film and organic electroluminescence device |
| CN102822731A (zh) * | 2010-12-13 | 2012-12-12 | Dic株式会社 | 阳离子固化型液晶密封剂以及液晶显示元件 |
| JP2013170223A (ja) * | 2012-02-21 | 2013-09-02 | Sekisui Chem Co Ltd | 蒸着用硬化性樹脂組成物、樹脂保護膜、及び、有機光デバイス |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4384509B2 (ja) | 2003-01-09 | 2009-12-16 | 積水化学工業株式会社 | 有機エレクトロルミネッセンス素子の封止方法及び有機エレクトロルミネッセンス素子 |
| JP5457078B2 (ja) * | 2009-06-05 | 2014-04-02 | 株式会社ダイセル | カチオン重合性樹脂組成物、及びその硬化物 |
| JP5651421B2 (ja) * | 2010-10-07 | 2015-01-14 | 三井化学株式会社 | 封止用組成物及びそれを用いた封止用シート |
| JP2013157204A (ja) * | 2012-01-30 | 2013-08-15 | Sekisui Chem Co Ltd | 有機エレクトロルミネッセンス表示素子用封止剤 |
-
2015
- 2015-01-09 WO PCT/JP2015/051155 patent/WO2015111525A1/ja not_active Ceased
- 2015-01-09 KR KR1020167000630A patent/KR101641480B1/ko active Active
- 2015-01-09 CN CN201580001941.XA patent/CN105557068B/zh active Active
- 2015-01-09 JP JP2015554922A patent/JP5914778B2/ja active Active
- 2015-01-22 TW TW104102031A patent/TW201533144A/zh not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW500791B (en) * | 1999-08-12 | 2002-09-01 | Mitsui Chemicals Inc | Photo-curable resin composition for sealing material and sealing method |
| US20090026934A1 (en) * | 2006-01-24 | 2009-01-29 | Jun Fujita | Adhesive encapsulating composition film and organic electroluminescence device |
| CN102822731A (zh) * | 2010-12-13 | 2012-12-12 | Dic株式会社 | 阳离子固化型液晶密封剂以及液晶显示元件 |
| JP2013170223A (ja) * | 2012-02-21 | 2013-09-02 | Sekisui Chem Co Ltd | 蒸着用硬化性樹脂組成物、樹脂保護膜、及び、有機光デバイス |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105557068A (zh) | 2016-05-04 |
| JPWO2015111525A1 (ja) | 2017-03-23 |
| CN105557068B (zh) | 2017-06-09 |
| TW201533144A (zh) | 2015-09-01 |
| KR20160011228A (ko) | 2016-01-29 |
| WO2015111525A1 (ja) | 2015-07-30 |
| KR101641480B1 (ko) | 2016-07-20 |
| JP5914778B2 (ja) | 2016-05-11 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |