TW201519330A - 電子元件之成型與表面處理方法及其製成物 - Google Patents

電子元件之成型與表面處理方法及其製成物 Download PDF

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TW201519330A
TW201519330A TW103133616A TW103133616A TW201519330A TW 201519330 A TW201519330 A TW 201519330A TW 103133616 A TW103133616 A TW 103133616A TW 103133616 A TW103133616 A TW 103133616A TW 201519330 A TW201519330 A TW 201519330A
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electronic component
carrier
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electronic components
metal foil
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Wilhelmus Gerardus Jozef Gal
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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Abstract

本發明提供一種電子元件之成型與表面處理方法，其中複數電子元件以陣列方式置於一載體上，並將一金屬箔置於該等電子元件相對於該載體之另一面，於該等電子元件經部分封裝後，將該金屬箔自該等電子元件取下，並於該等電子元件表面進行加工處理；本發明並同時提供以此方法製成之製成物。

Description

電子元件之成型與表面處理方法及其製成物
本發明係與電子元件之成型與表面處理方法有關，該處理方法主要包括下列步驟：A) 將複數電子元件以陣列方式置於一載體上；B) 於該等電子元件相對於該載體之另一面置放一金屬箔；C) 將覆蓋該金屬箔之該電子元件密封，其中並留有一模腔；D) 於該模腔中注入一封料；E) 待注入該模腔之該封料至少呈現部分硬化；以及F) 將該載體與經部分封裝之該電子元件自該模腔中取出。
在將裝配至一載體之電子元件封裝時，特別係封裝半導體電路（晶片）/積體電路（IC）時，習知封壓技術具有二半模，其中至少一半模具有至少一模腔，在將欲封裝之電子元件置放於二半模間後，該等半模朝彼此閉合，以產生如夾起載體之作用。接著取一液體封料，通常係經過加熱者，並將之注入模腔中，通常係利用轉注成形之方法。或者，亦可將粒狀封料置於模腔中，再將欲封裝之電子元件封壓入封料中；如此之壓模過程係為另一種轉注成形方法。此處可用之封料係為環氧樹脂（亦即樹脂），環氧樹脂常作為填料使用。在模腔/腔體中之封料至少部分固化（化學固化）後，將配有封裝電子元件之載體自封壓機中取出，而於進一步加工時再將經封壓之該等產品彼此分離。金屬箔係用以遮閉或覆蓋部分電子元件，以避免電子元件之特定部分受封料所包覆。受部分覆蓋之產品（未經注模成形之產品，以稱為「裸片」）具有諸多用途，例如可作為各種感應器元件或散熱元件。此成形方法已於業界大規模實施，並可極佳地控制取下金屬箔部分之電子元件成形作業。於該部分注模與分離後之電子元件後續加工過程中，會產生無法完全精確控制成形產品精度之問題，以及成形過程中因加熱與冷卻作用所引起之其他問題。
本發明之主要目的係為提供另一種方法與裝置，可達成習知電子元件部分注模之優點，並可於後續步驟中使部分注模之電子元件加工更為精確。
為達上述目的，本發明提供一種電子元件之成型與表面處理方法，其步驟包含：A) 將複數電子元件以陣列方式置於一載體上；B) 於該等電子元件相對於該載體之另一面置放一金屬箔；C) 將覆蓋該金屬箔之該電子元件密封，其中並留有一模腔；D) 於該模腔中注入一封料；E) 待注入該模腔之該封料至少呈現部分硬化；F) 將該載體與經部分封裝之該電子元件自該模腔中取出；G) 將該金屬箔自該載體上經部分封裝之該電子元件上取下；H) 對於該載體上之電子元件經取下該金屬箔之表面提供至少一種表面加工流程；以及I) 使經部分封裝與表面處理之該電子元件自該載體上鬆脫。本發明所提供方法之優點係為，由於自載體上經部分封裝之電子元件直接取下金屬箔後，就對載體上該電子元件之表面施以表面加工流程，故經部分注模之電子元件在施以表面處理之前不會（或較習知技術更不易）變形（縮小、彎折或捲曲）。此處所指之「直接取下」意指將電子元件之金屬箔取下後，並未先與載體脫離後才進行表面處理流程，由於取下金屬箔後之電子元件係保持於載體上接受表面處理，載體會使該電子元件以及已成形之封料（實質上）保持形狀，故就部分注模之電子元件以及與其相接合之成形封料產品而言，兩者皆可保持其形狀與尺寸。於此所進行之表面處理流程亦可受到更佳調控，以使加工產品之精確度提高。另一優點係為，該載體可用於遞送電子元件至一或多個表面處理加工站；僅於表面處理完成後，才將經部分封裝與表面處理過後之電子元件自載體取下。
本方法中所使用之金屬箔係用以覆蓋電子元件接觸載體之相反面，其亦可稱為「防毛邊易脫金屬箔」或「易脫金屬箔」，使該電子元件與接觸載體面之相反面恆久與之相反時，可如其名稱一般，不受封料所附著（防毛邊產生）。於本發明所提供之方法中，該金屬箔係為電子元件覆蓋（故其可稱為易脫金屬箔）。除了必須利用此種（易脫）金屬箔之外，亦可利用其他種類之金屬箔。至於將電子元件以陣列方式配置之步驟A) ，以及將電子元件取出之步驟I)，可利用具有隨溫度變化性質之附著層來達成，該附著層（亦可使用稱為「附著箔」或「黏著箔」之金屬箔）係以於成形溫度時可具有黏著性質，但於超過成形溫度一定程度後又會失去黏著性質者為佳。藉由如此之溫度敏感性，可於低於成形溫度時，將電子元件以陣列方式於步驟A)中配置於載體上，並於步驟I)中，電子元件經部分封裝與表面處理後，藉由將附著層加熱，使其因上述特性而失去黏著性質，藉此使電子元件自載體上鬆脫。將附著層加熱之作法，舉例而言，可藉由傳導加熱、紫外線加熱或其他加熱方式來達成，而加熱方式應依照所使用之載體種類（素材）來決定；其中之重點在於，與附著層脫離後，電子元件上方不留下附著層殘餘。在載體與電子元件之間利用「附著箔」之方法，可搭配於電子元件接觸載體之另一面使用「易脫金屬箔」之方法一同實施。
於經部分方裝與表面處理之電子元件自載體上鬆脫之步驟I)後，該電子元件即可自載體取下；於取下電子元件時，其已於表面處理流程中具有精確之表面處理成果。
於本發明所提供之方法實施例之步驟A)中，電子元件之陣列可藉由矽質晶圓來達成配置，該電子元件之成形作業進行前，皆不需使其彼此相互分離作業。此舉亦可實現增進對產品尺寸與形狀之良好調控，並藉此提升產品之品質。
該等電子元件之陣列可於步驟A)中配置於一平面載體板，較佳者係為一平面金屬板，該金屬板之尺寸需可維持施以封料後之形狀完整，於理想環境下，該平面載體板上之封料固化時，應不受該載體板之形狀（或尺寸）所造成顯著影響。適用成果極佳者，係利用一具有扁圓狀平面之圓型金屬載體板，以使載體可配置於複數固定卡槽中。易可選擇具有其他形狀之平面載體板，例如矩形載體板。載體板之厚度一般介於1-2mm之間，材質係以不鏽鋼製成，但亦可選擇其他材質之載體板，例如銅、鋁、陶或玻璃材質。
由於本發明多使用較小元件，於一實施例中，於步驟D)中所注入模腔之封料係為透過轉注成形之方法所注入之液體封料，其所具有之液體黏性近似於水、油或蜂蜜，例如介於1 – 5 Pa.s. (= 2.103 – 5.103 mPa.s.)之間。特別係該液體封料於此藉由轉注成形之方式注入模腔，但亦可利用（針點）射出成形或其他封料成形之方式。
將載體上經部分封裝之電子元件自模腔中取出之作業（參照步驟F）），可與將金屬箔自電子元件取下之作業同時進行（參照步驟G）），藉由結合此二步驟，可縮短加工處理所需之時間。
為了更輕易將金屬箔自電子元件取下（參照步驟G）），該金屬箔可經過加熱，藉此，不僅移除金屬箔之作業較為容易，亦可降低金屬箔未完全移除所造成之不良品發生率。
於步驟H)中對於電子元件表面所進行之至少一種表面加工流程可包括：平版印刷、蝕刻、照射、壓印、雷射與電鍍。一般可對於部分注模之電子元件（以及對電子元件之封料邊界）表面所進行之表面加工流程而言，係可透過平版印刷提供電子導線接觸以及/或點接觸。於步驟H)中對於電子元件表面所提供之表面加工流程，於此包括但非限定於，以電性連接自電子元件連接至封料表面。類似導線以及/或點接觸之位置精確度，對於此類「表面加工」電子產品的用途而言極為重要。
本發明可提高多變性物理產品之精確性，亦藉此增加本發明所揭露方法所製成部分封裝電子元件於後續利用時之加工管控精確性。
如圖1A所示，一電子元件1（例如一積體電路IC），其設置於一載體2上。於圖1B中，一金屬箔3（例如一「防毛邊易脫金屬箔」），其設置於電子元件1相對於載體2之另一面。圖1C係為電子元件1之狀態，其中於載體2與金屬箔3之間注入一封料4。如圖1D所示，覆蓋於電子元件1相對於載體2相反面之金屬箔3自部分注模之電子元件1上脫離，使電子元件1之其中一面並未與封料4接觸。如圖1E所示，於電子元件1相對於載體2之相反面上設置至少一電子導線5。如圖1F所示，電子元件1成為一獨立成品。另外，亦可於載體2與電子元件1及封料4之接觸面之間設置一附著層（例如一「附著箔」或一「黏著箔」，並未標於圖1A至圖1E中），並透過例如將圖1E中之載體2加熱等方法，使電子元件1與封料4自載體2上鬆脫。
圖2A所示係為本發明所揭露之方法中，用以封裝複數電子元件11之一模具10部分剖面圖，電子元件11係設置於一載體板12上，而載體板12係夾於一上模部13與一下模部14之間。於下模部14中具有一開放之模腔15，該模腔15係用以乘載電子元件11。該等電子元件11與模腔15之間設有一金屬箔16，使該等電子元件11相對於載體板12之另一面受金屬箔16之保護。圖式亦顯示下模部14中具有一流槽，其係與模腔15相連通，以供注入一封料17（未標於圖2A中）於模腔15中。
圖2B所示係為本發明所揭露之方法中，用以封裝複數電子元件11之模具10部分剖面圖，其狀態為一液體狀封料17已注入模腔15中。於封料17至少部分固化（硬化）後，上模部13以及下模部14可相互分離，而具有部分經注模電子元件11之載體板12即可自模具10中取出。金屬箔16亦可於取出載體板12時自模具10中一併取出，或可於取出載體板12與經部分注模之電子元件11時，將金屬箔16留置於下模部14之中。
如圖3A所示之上方視圖中所示，一載體板20乘載置有複數電子元件22之一晶圓21。於圖3B之中，該載體板20之狀態係為該等電子元件22已受一模化合物23部分覆蓋，該等電子元件22相對於載體板20之另一面並未與模化合物23接觸。
如圖4A所示之上方視圖所示，一電子元件30具有複數接點31，該電子元件30並受封料32之部分覆蓋，如前述圖式所示。於圖4B中，具有複數接點31之電子元件30設有複數導線33，該等導線33係設置於電子元件30上方，且封料32包圍電子元件30。該等導線33係配合表面加工流程一同實施，且該表面加工流程係於電子元件30及封料32仍置於載體板20上之狀態（未標於圖4A及圖4B中）所實施。
1‧‧‧電子元件
2‧‧‧載體
3‧‧‧金屬箔
4‧‧‧封料
5‧‧‧導線
10‧‧‧模具
11‧‧‧電子元件
12‧‧‧載體板
13‧‧‧上模部
14‧‧‧下模部
15‧‧‧模腔
16‧‧‧金屬箔
17‧‧‧封料
20‧‧‧載體板
21‧‧‧晶圓
22‧‧‧電子元件
23‧‧‧模化合物
30‧‧‧電子元件
31‧‧‧接點
32‧‧‧封料
33‧‧‧導線
以下圖式所舉實施例僅用以說明本創作而已，非用以限制本創作之範圍。本發明圖式包括：
圖1A至圖1F係為本發明所揭露製作方法之連續示意圖，表示依本發明所揭露方法之不同實施步驟。 圖2A係為本發明之剖面示意圖，表示用以封裝電子元件之模具。 圖2B係為本發明另一剖面示意圖，表示用以封裝電子元件之模具。 圖3A係為本發明之上方視圖，表示裝配電子元件之載體。 圖3B係為本發明另一上方視圖，表示裝配電子元件之載體。 圖4A係為本發明另一上方視圖，表示部分注模電子元件於表面處理前之狀態。 圖4B係為本發明另一上方視圖，表示部分注模電子元件於表面處理後之狀態。
10‧‧‧模具
11‧‧‧電子元件
12‧‧‧載體板
13‧‧‧上模部
14‧‧‧下模部
15‧‧‧模腔
16‧‧‧金屬箔

Claims (11)

  1. 一種電子元件之成型與表面處理方法，其包含以下步驟： A) 將複數電子元件以陣列方式置於一載體上； B) 於該等電子元件相對於該載體之另一面置放一金屬箔； C) 將覆蓋該金屬箔之該電子元件予以密封，其中並留有一模腔； D) 於該模腔中注入一封料； E) 待注入該模腔之該封料至少呈現部分硬化； F) 將該載體與經部分封裝之該電子元件自該模腔中取出； G) 將該金屬箔自該載體上經部分封裝之該電子元件上取下； H) 對於該載體上之電子元件經取下該金屬箔之表面提供至少一種表面加工流程；以及 I) 使經部分封裝與表面處理之該電子元件自該載體上鬆脫。
  2. 如請求項1所述之電子元件之成型與表面處理方法，其特徵在於，於步驟I)後，將經部分封裝與表面加工之該等電子元件相互分離。
  3. 如請求項1或2所述之電子元件之成型與表面處理方法，其特徵在於，於步驟A)中，該等電子元件所構成之陣列係配置於一矽質晶圓。
  4. 如前述任一請求項所述之電子元件之成型與表面處理方法，其特徵在於，於步驟A)中，該等電子元件所構成之陣列係置於一平面載體板，較佳者，該平面載體板係為一平面金屬板。
  5. 如前述任一請求項所述之電子元件之成型與表面處理方法，其特徵在於，於步驟D)中所注於該模腔之封料係為一液體，其所具有之黏度介於1 至 5 Pa.s之間。
  6. 如前述任一請求項所述之電子元件之成型與表面處理方法，其特徵在於，該封料於步驟D)中係透過轉注成形之方式注入該模腔。
  7. 如前述任一請求項所述之電子元件之成型與表面處理方法，其特徵在於，步驟F) 將該載體與經部分封裝之該電子元件自該模腔中取出之步驟係與步驟G) 將該金屬箔自該載體上經部分封裝之該電子元件上取下之步驟同時進行。
  8. 如前述任一請求項所述之電子元件之成型與表面處理方法，其特徵在於，於步驟G)中，該金屬箔經過加熱以自該等電子元件上取下。
  9. 如前述任一請求項所述之電子元件之成型與表面處理方法，其特徵在於，步驟H)中所對於該載體上之電子元件之表面所提供至少一種表面加工流程，係選自由平版印刷、蝕刻、照射、壓印、雷射與電鍍所構成之群組。
  10. 如前述任一請求項所述之電子元件之成型與表面處理方法，其特徵在於，步驟H)中所對於該載體上之電子元件之表面所提供至少一種表面加工流程，係利用電性連接自該等電子元件連接至該封料表面之加工流程。
  11. 以前述任一請求項所述之電子元件之成型與表面處理方法所製成之部分封裝電子元件。
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CN105531806A (zh) 2016-04-27
JP6445536B2 (ja) 2018-12-26
TWI581344B (zh) 2017-05-01
PT2015047089B (pt) 2021-08-26
DE112014004450T5 (de) 2016-07-07
SG11201601604UA (en) 2016-04-28
DE112014004450B4 (de) 2024-05-02
US20160240397A1 (en) 2016-08-18

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