TW201444946A - 熱傳導性片材 - Google Patents
熱傳導性片材 Download PDFInfo
- Publication number
- TW201444946A TW201444946A TW103111905A TW103111905A TW201444946A TW 201444946 A TW201444946 A TW 201444946A TW 103111905 A TW103111905 A TW 103111905A TW 103111905 A TW103111905 A TW 103111905A TW 201444946 A TW201444946 A TW 201444946A
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive
- layer
- resin layer
- thermally conductive
- heat conductive
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/22—Layered products comprising a layer of synthetic resin characterised by the use of special additives using plasticisers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/041—Carbon nanotubes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/11—Esters; Ether-esters of acyclic polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/222—Magnesia, i.e. magnesium oxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/2224—Magnesium hydroxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/204—Applications use in electrical or conductive gadgets use in solar cells
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2431/00—Presence of polyvinyl acetate
- C09J2431/006—Presence of polyvinyl acetate in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
- C09J2475/006—Presence of polyurethane in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Inorganic Chemistry (AREA)
- Nanotechnology (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
Abstract
本發明係將熱傳導性片材之單面形成為適度之黏著性,從而提昇熱傳導性片材之加工性及重工性。本發明係積層有黏著性熱傳導層與非黏著性樹脂層之熱傳導性片材。本發明之黏著性熱傳導層含有丙烯酸系樹脂與熱傳導性填料,丙烯酸系樹脂之玻璃轉移溫度為-80~15℃,其觸黏性高於非黏著性樹脂層之觸黏性,非黏著性樹脂層之玻璃轉移溫度為60~110℃。觸黏性係藉由於壓抵速度30 mm/min、剝離速度120 mm/min、負重196 g、壓抵時間5.0秒、拉伸距離5 mm、探針加熱40℃、片材台加熱40℃之條件下,將鋁製圓柱狀探針壓抵至該黏著性熱傳導層或該非黏著性樹脂層並剝離,而作為探針觸黏性進行測定。該非黏著性樹脂層之探針觸黏性為6~30 kN/m2。或者非黏著性樹脂層與黏著性熱傳導層之T型剝離強度為0.2 N/cm以上。
Description
本發明係關於一種貼附於電子零件等上而提昇其散熱性之熱傳導性片材。
熱傳導性片材係用於填充成為發熱源之電子零件等與散熱板、殼體等散熱座之間隙,使電子零件之散熱性提昇。作為熱傳導性片材,就使用其組裝電子零件與散熱座時之加工性而言,較佳為具有黏著性者,進而,就修正組裝電子零件與散熱座時之位置偏移或於暫時組裝後因某些情況而解體並能再次組裝等重工性之方面而言,較佳為提高單面之黏著性且降低另一面之黏著性者。
因此,業界提出有於由聚矽氧橡膠與熱傳導性填料形成熱傳導性片材時,藉由紫外線照射對其表面實施非黏著處理(專利文獻1)。
又,提出有於丙烯酸系聚胺基甲酸乙酯樹脂中含有無官能性丙烯酸系聚合物與熱傳導性填料之黏著性熱傳導片材中,使丙烯酸系聚胺基甲酸乙酯樹脂與無官能性丙烯酸系聚合物之調配比於正面層與背面層不同,重複塗佈兩層,藉此使黏著性熱傳導片材之正背面之黏著性不同(專利文獻2)。
專利文獻1:日本專利3498823號公報
專利文獻2:日本專利特開2010-93077號公報
然而,如專利文獻1所記載般,若為了降低熱傳導性片材單面之黏著性而進行紫外線照射,則擔任熱傳導性之層會劣化。
又,如專利文獻2所記載般,當於正面層與背面層使丙烯酸系聚胺基甲酸乙酯樹脂與無官能性丙烯酸系聚合物之調配比不同並重複塗佈之情形下,正面層與背面層容易混雜,故而難以按照所需改變正面層與背面層之黏著性。
此外,作為使熱傳導性片材之正背面之黏著性不同之方法,亦考慮於由丙烯酸系樹脂與熱傳導性填料形成黏著性熱傳導層之情形下,於其單面積層非黏著性薄膜之方法,該情形下,薄膜面對物品之附著性極端地下降,因此作為熱傳導性片材之加工性較差。
相對於此,本發明之目的在於:於由丙烯酸系樹脂與熱傳導性填料形成黏著性熱傳導層之熱傳導性片材中,於黏著性熱傳導層之一面形成黏著性低於該黏著性熱傳導層但具有適度黏著性之層,從而提昇熱傳導性片材之加工性及重工性。
本發明者發現,於由丙烯酸系樹脂與熱傳導性填料形成之黏著性熱傳導層之一面積層有非黏著性樹脂層之熱傳導性片材中,使非黏著性樹脂層之觸黏性低於該黏著性熱傳導層之觸黏性,並且將該非黏著性樹脂層之探針觸黏性設為特定範圍內;
或者將非黏著性樹脂層與黏著性熱傳導層之剝離強度設為特定範圍,藉此可達成上述目的,從而完成本發明。
即,本發明提供一種熱傳導性片材,該熱傳導性片材係積層有黏著性熱傳導層與非黏著性樹脂層者,且黏著性熱傳導層含有使丙烯酸系化合物硬化之丙烯酸系樹脂與熱傳導性填料,該丙烯酸系樹脂之玻璃轉移溫度為-80~15℃,黏著性熱傳導層之觸黏性高於非黏著性樹脂層之觸黏性,非黏著性樹脂層之玻璃轉移溫度為60~110℃,非黏著性樹脂層之觸黏性作為如下探針觸黏性為6~30kN/m2,該探針觸黏性係藉由於壓抵速度30mm/min、剝離速度120mm/min、負重196g、壓抵時間5.0秒、拉伸距離5mm、探針加熱40℃、片材台加熱40℃之條件下,將鋁製圓柱狀探針壓抵至該非黏著性樹脂層上並剝離而測定。
又,本發明提供一種熱傳導性片材,該熱傳導性片材係積層有黏著性熱傳導層與非黏著性樹脂層者,且黏著性熱傳導層含有使丙烯酸系化合物硬化之丙烯酸系樹脂與熱傳導性填料,該丙烯酸系樹脂之玻璃轉移溫度為-80~15℃,黏著性熱傳導層之觸黏性高於非黏著性樹脂層之觸黏性,非黏著性樹脂層之玻璃轉移溫度為60~110℃,非黏著性樹脂層與黏著性熱傳導層之T型剝離強度為0.2N/cm以上。
根據本發明之熱傳導性片材,由於積層有黏著性熱傳導層、及觸黏性低於該黏著性熱傳導層但具有特定大小之觸黏性之非黏
著性樹脂層,因此,使用熱傳導性片材組裝電子零件與散熱座時之加工性提昇,又,將經暫時組裝者重新組裝之重工性亦提昇。
1‧‧‧PET薄膜
2‧‧‧非黏著性樹脂層
3‧‧‧黏著性熱傳導層
4‧‧‧覆蓋薄膜(PET)
圖1係非黏著性樹脂層與黏著性熱導電層之T型剝離強度之測定方法之說明圖。
以下,對本發明詳細地進行說明。
本發明之熱傳導性片材積層有黏著性熱傳導層與非黏著性樹脂層。
於黏著性熱傳導層中,於使丙烯酸系化合物硬化之丙烯酸系樹脂中分散有熱傳導性填料。於本發明中,就提昇使用熱傳導性片材組裝電子零件與散熱座時之加工性、及將經暫時組裝者重新組裝之重工性而言,作為丙烯酸系化合物,使用作為其硬化物之丙烯酸系樹脂之玻璃轉移溫度成為-80~15℃、較佳為-70~-10℃者。作為此種丙烯酸系化合物,可舉出:(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸4-羥基丁酯等單官能(甲基)丙烯酸酯等,其中,較佳為丙烯酸2-乙基己酯、丙烯酸月桂酯。又,可將1種以上之可與該等共聚合之(甲基)丙烯酸、N-乙烯基吡咯啶酮、衣康酸、丙烯酸四氫糠酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸異莰酯、(甲基)丙烯酸乙氧基乙酯、(甲基)丙烯酸丁氧基乙酯、(甲基)丙烯酸苯氧基乙酯、(甲基)丙烯酸苯酯、(甲基)丙烯酸環己酯等進行混合使用。
又,作為丙烯酸系化合物之硬化方法,例如可設為使用光聚合起始劑、光交聯劑並照射紫外線之方法。於該情形時,若照射相當於光聚合起始劑之裂解所需能量的長波長紫外線(波長320~400nm),則不會造成藉由紫外線照射而黏著性熱傳導層劣化之問題。
作為黏著性熱傳導層所含有之熱傳導性填料,可使用氫氧化鋁、氫氧化鎂等金屬氫氧化物;鋁、銅、銀等金屬;氧化鋁、氧化鎂等金屬氧化物;氮化鋁、氮化硼、氮化矽等氮化物;奈米碳管等。又,熱傳導性填料之平均粒徑較佳為設為0.5~100μm,尤其是就分散性與熱傳導性而言,較佳為併用平均粒徑3~20μm之小徑之填料與平均粒徑25~100μm之大徑之填料。
黏著性熱傳導層中熱傳導性填料之含量,係相對於上述丙烯酸系化合物之單體單元100質量份,較佳為100~2000質量份,更佳為300~1000質量份。若熱傳導性填料之含量過少,則無法充分地提高熱傳導性片材之熱傳導性,反之,若過多,則熱傳導性片材之柔軟性下降,因而欠佳。
於黏著性熱傳導層使用平均粒徑不同之兩種熱傳導性填料之情形下,較佳為將小徑之填料與大徑之填料之調配比設為15:85~90:10。
又,較佳為黏著性熱傳導層含有1種以上之下述可塑劑,該可塑劑係選自己二酸二辛酯、己二酸二異壬酯等己二酸系化合物;癸二酸辛酯、癸二酸二異癸酯等癸二酸系化合物;磷酸三甲苯酯等磷酸系化合物;蓖麻油或其衍生物、硬脂酸或油酸等高級脂肪酸及衍生物;酞酸二丁酯、酞酸二辛酯等酞酸系化合物;含有1種以上之選自由丙烯酸丁酯、丙烯酸2-乙基己酯、丙烯酸2-甲氧基乙酯所組成之群中之單體而成的均聚物或共聚物、或該等單體與選自由α-烯烴、
乙烯酯、乙烯醚之單體所構成群組中之單體的共聚物等丙烯酸系化合物、低分子量丙烯酸系聚合物;蠟、膠黏劑(tackifier)等,更佳為含有選自己二酸系、癸二酸系、磷酸系、蓖麻油系、油酸系及丙烯酸系中之1種以上之可塑劑。黏著性熱傳導層中可塑劑之含量係相對於上述丙烯酸系化合物之單體單元100質量份較佳為20~80質量份,更佳為30~70質量份。
此外,黏著性熱傳導層視需要可調配抗氧化劑、抗熱劣化劑、難燃劑、著色劑等。
黏著性熱傳導層之層厚較佳為200~3000μm。若過薄,則無法獲得對被黏附體之凹凸之充分之追隨性,若過厚,則硬化需要時間而生產性變差。
黏著性熱傳導層及非黏著性樹脂層之觸黏性係藉由於壓抵速度30mm/min、剝離速度120mm/min、負重196g、壓抵時間5.0秒、拉伸距離5mm、探針加熱40℃、片材台加熱40℃之條件下,將鋁製圓柱狀探針壓抵至該黏著性熱傳導層或該非黏著性樹脂層上並剝離,而作為探針觸黏性進行測定。
黏著性熱傳導層之觸黏性必須高於非黏著性樹脂層之觸黏性。
於第一樣態中,非黏著性樹脂層之觸黏性以探針觸黏性計為6~30kN/m2,較佳為7~25kN/m2。
又,該非黏著性樹脂層與黏著性熱傳導層之接著強度較小者有因加工時或重工時之操作而引起層間剝離等不良情況之虞。於第二樣態中,為了使操作性較佳,必須於T型剝離中設為0.2N/cm以上,可較佳地設為0.2~6N/cm。
若使非黏著性樹脂層之觸黏性如上所述般具有特定範
圍之探針觸黏性,並且非黏著性樹脂層與黏著性熱傳導層之剝離強度成為特定大小以上之方式形成,則非黏著性樹脂層成為於使用熱傳導性片材組裝電子零件與散熱座時並不發黏但發揮適度低之黏著性者,加工性提昇,並且將經暫時組裝者重新組裝時之重工性亦提昇,因而較佳。
為了將非黏著性樹脂層之觸黏性設為上述範圍,對於形
成非黏著性樹脂層之樹脂之玻璃轉移溫度之下限,設為60℃以上,更佳為設為70℃以上。藉此,即便不對用以形成非黏著性樹脂層之樹脂調配硬化劑等而實施硬化處理,亦可將非黏著性樹脂層之探針觸黏性設為30kN/m2以下、尤其是25kN/m2以下。
另一方面,關於形成非黏著性樹脂層之樹脂之玻璃轉移
溫度之上限,就使非黏著性樹脂層發揮適度低之黏著性,並且獲得與黏著性熱傳導層之接著強度之方面而言,設為110℃以下。
又,形成非黏著性樹脂層之樹脂較佳為與用以形成黏著
性熱傳導層之丙烯酸系化合物為非相溶性。藉此,即便將塗佈形成各層之塗敷用組成物重複塗佈而形成黏著性熱傳導層與非黏著性樹脂層之積層物,各層亦難以於該等之界面混雜,從而可獲得所期望之觸黏性。相對於此,於用以形成非黏著性樹脂層之樹脂與用以形成黏著性熱傳導層之丙烯酸系化合物為相溶性之情形下,藉由在進行重複塗佈之前預先對用以形成非黏著性樹脂層之塗敷層實施硬化處理,而使各層難以於該等之界面混雜,可獲得所期望之觸黏性。
作為用以形成非黏著性樹脂層所較佳之樹脂,即,玻璃
轉移溫度為60~110℃且與形成黏著性熱傳導層之丙烯酸系化合物為非相溶性之樹脂,可舉出:聚乙烯丁醛樹脂、聚酯樹脂、胺基甲酸乙
酯樹脂等。又,該等之分子量以數量平均分子量計較佳為10000~500000。
非黏著性樹脂層視需要可含有用以形成非黏著性樹脂
層之樹脂之硬化劑、氰尿酸三聚氰胺等有機系難燃劑、氫氧化鋁等熱傳導性填料、著色劑。
非黏著性樹脂層之層厚較佳為0.5~25μm,更佳為1~
20μm。若非黏著性樹脂層之層厚過薄,則因與黏著性熱傳導層之相溶或由熱傳導性填料造成之摩擦損傷而會使黏著性增大,若過厚,則作為熱傳導性片材之熱傳導性變不充分。
再者,作為熱傳導性片材之熱傳導性,實用上熱傳導性
片材之厚度方向之熱傳導率於藉由依據ASTM D5470之熱傾斜法所進行之測定中,必需為1W/m.K以上,根據本發明,可設為1.5W/m.K以上,可更佳地設為2W/m.K以上。
作為本發明之熱傳導性片材之製造方法,例如分別預先
製備將上述形成黏著性熱傳導層之各成分混合而成之黏著性熱傳導層形成用塗料、及將用以形成非黏著性樹脂層之各成分與溶劑混合而成之非黏著性樹脂層形成用塗料,於由聚對苯二甲酸乙二酯(PET,polyethylene terephthalate)、聚萘二甲酸乙二酯(PEN,polyethylene naphthalate)、聚烯烴、玻璃紙等形成之剝離薄膜上,塗佈非黏著性樹脂層形成用塗料並使其乾燥,繼而,於該非黏著性樹脂層之塗敷面上重複塗佈黏著性熱傳導層形成用塗料,於黏著性熱傳導層形成用塗料之塗佈面上被覆PET、PEN、聚烯烴等覆蓋薄膜,自其上方照射紫外線使黏著性熱傳導層形成用塗料之塗佈層硬化,藉此可獲得本發明之熱傳導性片材。
又,亦可於剝離薄膜上塗佈非黏著性樹脂層形成用塗料
並使其乾燥,另一方面,於另一剝離薄膜塗佈黏著性熱傳導層形成用塗料,使方才之非黏著性樹脂層之塗敷面呈對向進行被覆從而代替覆蓋薄膜,照射紫外線使黏著性熱傳導層形成用塗料之塗佈層硬化,而製造本發明之熱傳導性片材。
再者,於以此種方式製造熱傳導性片材後,可剝離非黏
著性樹脂層之剝離薄膜,捲取熱傳導性片材進行保管。經如此捲取之熱傳導性片材係將黏著性熱傳導層側之剝離薄膜剝離而用於電子零件與散熱座之組裝。
以下,藉由實施例對本發明具體地進行說明。
利用甲苯:甲基乙基酮=1:1之混合溶劑,將表1所示之樹脂及硬化劑製備成固形份10質量%,利用棒式塗佈機塗佈於PET薄膜,於90℃乾燥5分鐘而形成表1所示之塗佈厚度之非黏著性樹脂層。
另一方面,將作為單官能丙烯酸酯之丙烯酸2-乙基己酯100質量份、作為可塑劑之蓖麻油衍生脂肪酸酯47質量份、光聚合起始劑(IRGACURE 819,BASF)1.4質量份、作為硬化劑之羥基叔戊酸新戊二醇酯二丙烯酸酯(KAYARAD FM-400,日本化藥)1.5質量份、作為熱傳導性填料之氫氧化鋁粉(平均粒徑80μm)400質量份、氫氧化鋁粉(平均粒徑8μm)400質量份進行混合,而製備黏著性熱傳導層形成用塗料。再者,該丙烯酸2-乙基己酯之硬化物之玻璃轉移溫度為-50~-40℃。
將如此製備而成之黏著性熱傳導層形成用塗料,以塗佈
厚度2mm重複塗佈於上述非黏著性樹脂層上,於其上被覆由PET構成之覆蓋薄膜,利用化學燈自PET薄膜側與覆蓋薄膜側之兩側照射長波長紫外線5分鐘,而製造實施例1~7及比較例1~3之熱傳導性片材。
不設置非黏著性樹脂層,將以與實施例1同樣之方式製備而成之黏著性熱傳導層形成用塗料塗佈於PET薄膜,於其上被覆由PET構成之覆蓋薄膜,利用化學燈自PET薄膜側與覆蓋薄膜側之兩側照射長波長紫外線5分鐘,而製造比較例4之熱傳導性片材。
關於各實施例及比較例之熱傳導性片材,以如下方式對(a)非黏著性樹脂層及黏著性熱傳導層之觸黏性、(b)熱傳導性片材之熱傳導率、(c)熱傳導性片材之重工性、(d)熱傳導性片材之非黏著性樹脂層與黏著性熱傳導層之層間剝離強度進行評價。將結果示於表1。
作為觸黏性試驗機,使用RHESCA公司製造之黏著試驗機TAC-II,於壓抵速度30mm/min、剝離速度120mm/min、負重196g、壓抵時間5.0秒、拉伸距離5mm、探針加熱40℃、片材台加熱40℃之條件下,將直徑10mm之鋁製圓柱狀探針壓抵至實施例1~7及比較例1~3之熱傳導性片材之非黏著性樹脂層並剝離,此時測定探針觸黏性。再者,比較例4之熱傳導性片材中無非黏著性樹脂層,因此測定
黏著性熱傳導層之觸黏性。
藉由依據ASTM D-5470之熱傳導率計(索尼製造)測定熱傳導片材之厚度方向之熱傳導率(加熱輸出8W,片材面壓1kgf/cm2)
於上下平行地呈對向一致之銅桿之間以非黏著性樹脂層成為下側之方式夾持熱傳導性片材,於壓力1kgf/cm2下放置10分鐘,其後將桿剝離。此時,將於熱傳導性片材之非黏著性樹脂層與銅板之間發生剝離之情形評價為○,將其以外之情形評價為×。
使用拉伸試驗機(RTG-1225,Orientec公司),直接於下述狀態下藉由T型剝離試驗測定非黏著性樹脂層2與黏著性熱傳導層3之層間剝離強度:如圖1所示,於非黏著性樹脂層2上積層有PET薄膜1,於黏著性熱傳導層3上積層有覆蓋薄膜4。於該情形時,將拉伸速度設為500mm/min,樣品寬度設為2cm。
根據表1可知,於用以形成非黏著性樹脂層之樹脂之玻璃轉移溫度為60~110℃的實施例1、2、4~7中,即便不調配硬化劑,非黏著性樹脂層之觸黏值亦為6~25kN/m2,並且非黏著性樹脂層與黏著性熱傳導層之層間剝離強度(T型剝離強度)成為0.2N/cm以上,重工性良好。
又,可知非黏著性樹脂層之層厚為20μm以下,熱傳導
性片材具有充分之熱傳導性。
另一方面,於非黏著性樹脂層之觸黏值超過30kN/m2之比較例1、2及無非黏著性樹脂層之比較例4中,熱傳導性片材會貼附於被黏附體上,因此重工性較差,又,非黏著性樹脂層與黏著性熱傳導層之藉由T型剝離試驗所得之層間剝離強度未達0.2N/cm之比較例3,因非黏著樹脂層可輕易地自黏著性熱傳導層剝離而加工性較差。
根據本發明之熱傳導性片材,由於積層有黏著性熱傳導層、及觸黏性低於該黏著性熱傳導層但具有特定大小之觸黏性之非黏著性樹脂層,因此使用熱傳導性片材組裝電子零件與散熱座時之加工性提昇,又,將經暫時組裝之者重新組裝之重工性亦提昇。
詳細且參照特定之實施樣態對本發明進行了說明,但業者知曉可在不脫離本發明之精神與範圍之情況下加以各種變更或修正。
本申請案係基於2013年3月28日提出申請之日本專利申請(日本專利特願2013-068724)者,其內容係作為參照而併入至本文中。
1‧‧‧PET薄膜
2‧‧‧非黏著性樹脂層
3‧‧‧黏著性熱傳導層
4‧‧‧PET薄膜
Claims (12)
- 一種熱傳導性片材,其係積層有黏著性熱傳導層與非黏著性樹脂層者,且黏著性熱傳導層含有使丙烯酸系化合物硬化之丙烯酸系樹脂與熱傳導性填料,該丙烯酸系樹脂之玻璃轉移溫度為-80~15℃,黏著性熱傳導層之觸黏性高於非黏著性樹脂層之觸黏性,非黏著性樹脂層之觸黏性為6~30kN/m2,非黏著性樹脂層之玻璃轉移溫度為60~110℃;在此,觸黏性係藉由於壓抵速度30mm/min、剝離速度120mm/min、負重196g、壓抵時間5.0秒、拉伸距離5mm、探針加熱40℃、片材台加熱40℃之條件下,將鋁製圓柱狀探針壓抵至該黏著性熱傳導層或該非黏著性樹脂層並剝離,而作為探針觸黏性進行測定。
- 一種熱傳導性片材,其係積層有黏著性熱傳導層與非黏著性樹脂層者,且黏著性熱傳導層含有使丙烯酸系化合物硬化之丙烯酸系樹脂與熱傳導性填料,該丙烯酸系樹脂之玻璃轉移溫度為-80~15℃,黏著性熱傳導層之觸黏性高於非黏著性樹脂層之觸黏性,非黏著性樹脂層之玻璃轉移溫度為60~110℃,非黏著性樹脂層與黏著性熱傳導層之T型剝離強度為0.2N/cm以上;在此,觸黏性係於壓抵速度30mm/min、剝離速度120mm/min、負重196g、壓抵時間5.0秒、拉伸距離5mm、探針加熱40℃、片材台加熱40℃之條件下,將鋁製圓柱狀探針壓抵至該黏著性熱傳導 層或該非黏著性樹脂層並剝離,而作為探針觸黏性進行測定。
- 如申請專利範圍第1或2項之熱傳導性片材,其中,熱傳導性片材之厚度方向之熱傳導率為1.5W/m.K以上。
- 如申請專利範圍第1或2項之熱傳導性片材,其中,用以形成非黏著性樹脂層之樹脂,係選自聚乙烯丁醛樹脂、聚酯樹脂及胺基甲酸乙酯樹脂。
- 如申請專利範圍第3項之熱傳導性片材,其中,用以形成非黏著性樹脂層之樹脂,係選自聚乙烯丁醛樹脂、聚酯樹脂及胺基甲酸乙酯樹脂。
- 如申請專利範圍第1或2項之熱傳導性片材,其中,用以形成黏著性熱傳導層之丙烯酸系化合物為單官能(甲基)丙烯酸酯單體。
- 如申請專利範圍第3項之熱傳導性片材,其中,用以形成黏著性熱傳導層之丙烯酸系化合物為單官能(甲基)丙烯酸酯單體。
- 如申請專利範圍第4項之熱傳導性片材,其中,用以形成黏著性熱傳導層之丙烯酸系化合物為單官能(甲基)丙烯酸酯單體。
- 如申請專利範圍第5項之熱傳導性片材,其中,用以形成黏著性熱傳導層之丙烯酸系化合物為單官能(甲基)丙烯酸酯單體。
- 如申請專利範圍第1或2項之熱傳導性片材,其中,黏著性熱傳導層係相對於丙烯酸系化合物之單體單元100質量份,含有選自己二酸系、癸二酸系、磷酸系、蓖麻油系、油酸系及丙烯酸系中之1種以上之可塑劑20~80質量份。
- 如申請專利範圍第3項之熱傳導性片材,其中,黏著性熱傳導層係相對於丙烯酸系化合物之單體單元100質量份,含有選自己 二酸系、癸二酸系、磷酸系、蓖麻油系、油酸系及丙烯酸系中之1種以上之可塑劑20~80質量份。
- 如申請專利範圍第4項之熱傳導性片材,其中,黏著性熱傳導層係相對於丙烯酸系化合物之單體單元100質量份,含有選自己二酸系、癸二酸系、磷酸系、蓖麻油系、油酸系及丙烯酸系中之1種以上之可塑劑20~80質量份。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013068724A JP6098289B2 (ja) | 2013-03-28 | 2013-03-28 | 熱伝導性シート |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201444946A true TW201444946A (zh) | 2014-12-01 |
TWI620808B TWI620808B (zh) | 2018-04-11 |
Family
ID=51624341
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103111905A TWI620808B (zh) | 2013-03-28 | 2014-03-28 | Thermally conductive sheet |
Country Status (6)
Country | Link |
---|---|
US (1) | US10550296B2 (zh) |
JP (1) | JP6098289B2 (zh) |
KR (1) | KR102057029B1 (zh) |
CN (2) | CN105008480B (zh) |
TW (1) | TWI620808B (zh) |
WO (1) | WO2014157378A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI818911B (zh) * | 2017-06-21 | 2023-10-21 | 日商力森諾科股份有限公司 | 半導體用接著劑、半導體裝置的製造方法及半導體裝置 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6461524B2 (ja) | 2013-09-13 | 2019-01-30 | デクセリアルズ株式会社 | 熱伝導性シート |
CN105493274B (zh) * | 2013-09-13 | 2019-06-04 | 迪睿合株式会社 | 导热性薄片 |
WO2018069512A1 (en) * | 2016-10-13 | 2018-04-19 | Olympic Holding B.V. | Thermally conductive acrylic adhesive tape and the manufacturing thereof |
EP3551709B1 (en) * | 2016-12-07 | 2021-07-28 | 3M Innovative Properties Company | Flexible abrasive article |
WO2019123214A1 (en) * | 2017-12-21 | 2019-06-27 | 3M Innovative Properties Company | Multi-layered thermally conductive sheet |
WO2022071667A1 (ko) * | 2020-09-29 | 2022-04-07 | 주식회사 엘지화학 | 경화성 조성물 |
KR102617131B1 (ko) * | 2020-09-29 | 2023-12-27 | 주식회사 엘지화학 | 경화성 조성물 |
DE102022200002A1 (de) * | 2022-01-03 | 2023-07-06 | Continental Automotive Technologies GmbH | Wärmeableitvorrichtung, elektronische Vorrichtung und Kraftfahrzeug |
KR102558761B1 (ko) * | 2022-06-22 | 2023-07-24 | 한국자동차연구원 | 자동차 배터리용 다층 시트 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3257391B2 (ja) * | 1996-03-18 | 2002-02-18 | 東洋インキ製造株式会社 | インクジェット記録液 |
JP3498823B2 (ja) | 1996-04-30 | 2004-02-23 | 電気化学工業株式会社 | 放熱スペーサーおよびその用途 |
JPH10316953A (ja) * | 1997-05-16 | 1998-12-02 | Nitto Denko Corp | 剥離可能な熱伝導性感圧接着剤とその接着シ―ト類 |
JP2002194306A (ja) * | 2000-12-26 | 2002-07-10 | Sekisui Chem Co Ltd | 熱伝導性シート |
JP2004225022A (ja) * | 2002-11-29 | 2004-08-12 | Sekisui Chem Co Ltd | 接着樹脂シート |
JP4443962B2 (ja) * | 2004-03-17 | 2010-03-31 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
CN101253242A (zh) * | 2005-08-30 | 2008-08-27 | 三井-杜邦聚合化学株式会社 | 阻燃性树脂组合物 |
JP2007169568A (ja) * | 2005-12-26 | 2007-07-05 | Nitto Shinko Kk | 熱伝導性粘着剤ならびに該熱伝導性粘着剤が用いられた熱伝導性粘着シート |
DE102007045166A1 (de) * | 2007-09-20 | 2009-04-02 | Tesa Ag | Transparentes Klebeband |
KR20110056375A (ko) | 2008-09-26 | 2011-05-27 | 제온 코포레이션 | 열전도성 감압 접착제 조성물, 열전도성 감압 접착성 시트, 및 전자 부품 |
JP5153558B2 (ja) * | 2008-10-08 | 2013-02-27 | 日本ジッパーチュービング株式会社 | 粘着性熱伝導シート |
US8568849B2 (en) * | 2009-05-20 | 2013-10-29 | Ming Kun Shi | Surface treated film and/or laminate |
TWI507501B (zh) * | 2009-06-15 | 2015-11-11 | Lg Chemical Ltd | 用於處理晶圓的薄片 |
JP5651344B2 (ja) * | 2010-02-04 | 2015-01-14 | 日東電工株式会社 | 熱伝導性両面粘着シート |
KR20130084608A (ko) * | 2010-05-19 | 2013-07-25 | 닛토덴코 가부시키가이샤 | 열전도성 점착 시트 |
CN103476892A (zh) * | 2011-04-15 | 2013-12-25 | 日东电工株式会社 | 粘合片 |
-
2013
- 2013-03-28 JP JP2013068724A patent/JP6098289B2/ja active Active
-
2014
- 2014-03-26 CN CN201480013296.9A patent/CN105008480B/zh active Active
- 2014-03-26 WO PCT/JP2014/058625 patent/WO2014157378A1/ja active Application Filing
- 2014-03-26 US US14/770,794 patent/US10550296B2/en active Active
- 2014-03-26 KR KR1020157024549A patent/KR102057029B1/ko active IP Right Grant
- 2014-03-26 CN CN201710131494.0A patent/CN107033800B/zh active Active
- 2014-03-28 TW TW103111905A patent/TWI620808B/zh active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI818911B (zh) * | 2017-06-21 | 2023-10-21 | 日商力森諾科股份有限公司 | 半導體用接著劑、半導體裝置的製造方法及半導體裝置 |
Also Published As
Publication number | Publication date |
---|---|
CN107033800A (zh) | 2017-08-11 |
KR102057029B1 (ko) | 2019-12-19 |
CN105008480A (zh) | 2015-10-28 |
CN107033800B (zh) | 2021-06-01 |
WO2014157378A1 (ja) | 2014-10-02 |
US20160009963A1 (en) | 2016-01-14 |
CN105008480B (zh) | 2017-03-15 |
JP2014189727A (ja) | 2014-10-06 |
TWI620808B (zh) | 2018-04-11 |
JP6098289B2 (ja) | 2017-03-22 |
KR20150135258A (ko) | 2015-12-02 |
US10550296B2 (en) | 2020-02-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW201444946A (zh) | 熱傳導性片材 | |
TWI667319B (zh) | Adhesive sheet | |
JP6461524B2 (ja) | 熱伝導性シート | |
TWI645522B (zh) | 多層型熱傳導片、多層型熱傳導片之製造方法 | |
JP2008266455A (ja) | 層状珪酸塩を含む熱剥離型粘着シート及び該シートを使用する電子部品の製造方法 | |
CN111065476B (zh) | 膜状烧成材料及带支撑片的膜状烧成材料 | |
JP6710828B2 (ja) | 熱伝導シート、および、熱伝導シートの製造方法 | |
JP2016130294A (ja) | 粘着シート、粘着シートの利用方法及び精密電子機器 | |
JP2016043691A (ja) | 積層シートおよび積層シートの製造方法 | |
JP6870991B2 (ja) | 熱伝導性シート | |
JP6623092B2 (ja) | 熱硬化性接着シートおよびその製造方法 | |
JP5410684B2 (ja) | 金属化粧板用積層粘着シート | |
JP2020045386A (ja) | 放熱部材形成用組成物、放熱部材およびその製造方法 | |
CN105493274B (zh) | 导热性薄片 | |
JP2022130051A (ja) | 熱伝導性シート | |
JP2022130850A (ja) | 熱伝導性シート | |
CN115810548A (zh) | 接合体的制造方法 |