TWI620808B - Thermally conductive sheet - Google Patents

Thermally conductive sheet Download PDF

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Publication number
TWI620808B
TWI620808B TW103111905A TW103111905A TWI620808B TW I620808 B TWI620808 B TW I620808B TW 103111905 A TW103111905 A TW 103111905A TW 103111905 A TW103111905 A TW 103111905A TW I620808 B TWI620808 B TW I620808B
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TW
Taiwan
Prior art keywords
adhesive
thermally conductive
layer
resin layer
adhesive resin
Prior art date
Application number
TW103111905A
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English (en)
Other versions
TW201444946A (zh
Inventor
Junichiro Sugita
Original Assignee
Dexerials Corp
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Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of TW201444946A publication Critical patent/TW201444946A/zh
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Publication of TWI620808B publication Critical patent/TWI620808B/zh

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    • C—CHEMISTRY; METALLURGY
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
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    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
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    • C08L2203/20—Applications use in electrical or conductive gadgets
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  • Chemical & Material Sciences (AREA)
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  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Nanotechnology (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)

Abstract

本發明係將熱傳導性片材之單面形成為適度之黏著性，從而提昇熱傳導性片材之加工性及重工性。
本發明係積層有黏著性熱傳導層與非黏著性樹脂層之熱傳導性片材。本發明之黏著性熱傳導層含有丙烯酸系樹脂與熱傳導性填料，丙烯酸系樹脂之玻璃轉移溫度為-80~15℃，其觸黏性高於非黏著性樹脂層之觸黏性，非黏著性樹脂層之玻璃轉移溫度為60~110℃。觸黏性係藉由於壓抵速度30mm/min、剝離速度120mm/min、負重196g、壓抵時間5.0秒、拉伸距離5mm、探針加熱40℃、片材台加熱40℃之條件下，將鋁製圓柱狀探針壓抵至該黏著性熱傳導層或該非黏著性樹脂層並剝離，而作為探針觸黏性進行測定。
該非黏著性樹脂層之探針觸黏性為6~30kN/m2。或者非黏著性樹脂層與黏著性熱傳導層之T型剝離強度為0.2N/cm以上。

Description

熱傳導性片材
本發明係關於一種貼附於電子零件等上而提昇其散熱性之熱傳導性片材。
熱傳導性片材係用於填充成為發熱源之電子零件等與散熱板、殼體等散熱座之間隙，使電子零件之散熱性提昇。作為熱傳導性片材，就使用其組裝電子零件與散熱座時之加工性而言，較佳為具有黏著性者，進而，就修正組裝電子零件與散熱座時之位置偏移或於暫時組裝後因某些情況而解體並能再次組裝等重工性之方面而言，較佳為提高單面之黏著性且降低另一面之黏著性者。
因此，業界提出有於由聚矽氧橡膠與熱傳導性填料形成熱傳導性片材時，藉由紫外線照射對其表面實施非黏著處理(專利文獻1)。
又，提出有於丙烯酸系聚胺基甲酸乙酯樹脂中含有無官能性丙烯酸系聚合物與熱傳導性填料之黏著性熱傳導片材中，使丙烯酸系聚胺基甲酸乙酯樹脂與無官能性丙烯酸系聚合物之調配比於正面層與背面層不同，重複塗佈兩層，藉此使黏著性熱傳導片材之正背面之黏著性不同(專利文獻2)。
[先前技術文獻] [專利文獻]
專利文獻1：日本專利3498823號公報
專利文獻2：日本專利特開2010-93077號公報
然而，如專利文獻1所記載般，若為了降低熱傳導性片材單面之黏著性而進行紫外線照射，則擔任熱傳導性之層會劣化。
又，如專利文獻2所記載般，當於正面層與背面層使丙烯酸系聚胺基甲酸乙酯樹脂與無官能性丙烯酸系聚合物之調配比不同並重複塗佈之情形下，正面層與背面層容易混雜，故而難以按照所需改變正面層與背面層之黏著性。
此外，作為使熱傳導性片材之正背面之黏著性不同之方法，亦考慮於由丙烯酸系樹脂與熱傳導性填料形成黏著性熱傳導層之情形下，於其單面積層非黏著性薄膜之方法，該情形下，薄膜面對物品之附著性極端地下降，因此作為熱傳導性片材之加工性較差。
相對於此，本發明之目的在於：於由丙烯酸系樹脂與熱傳導性填料形成黏著性熱傳導層之熱傳導性片材中，於黏著性熱傳導層之一面形成黏著性低於該黏著性熱傳導層但具有適度黏著性之層，從而提昇熱傳導性片材之加工性及重工性。
本發明者發現，於由丙烯酸系樹脂與熱傳導性填料形成之黏著性熱傳導層之一面積層有非黏著性樹脂層之熱傳導性片材中，使非黏著性樹脂層之觸黏性低於該黏著性熱傳導層之觸黏性，並且將該非黏著性樹脂層之探針觸黏性設為特定範圍內； 或者將非黏著性樹脂層與黏著性熱傳導層之剝離強度設為特定範圍，藉此可達成上述目的，從而完成本發明。
即，本發明提供一種熱傳導性片材，該熱傳導性片材係積層有黏著性熱傳導層與非黏著性樹脂層者，且黏著性熱傳導層含有使丙烯酸系化合物硬化之丙烯酸系樹脂與熱傳導性填料，該丙烯酸系樹脂之玻璃轉移溫度為-80~15℃，黏著性熱傳導層之觸黏性高於非黏著性樹脂層之觸黏性，非黏著性樹脂層之玻璃轉移溫度為60~110℃，非黏著性樹脂層之觸黏性作為如下探針觸黏性為6~30kN/m2，該探針觸黏性係藉由於壓抵速度30mm/min、剝離速度120mm/min、負重196g、壓抵時間5.0秒、拉伸距離5mm、探針加熱40℃、片材台加熱40℃之條件下，將鋁製圓柱狀探針壓抵至該非黏著性樹脂層上並剝離而測定。
又，本發明提供一種熱傳導性片材，該熱傳導性片材係積層有黏著性熱傳導層與非黏著性樹脂層者，且黏著性熱傳導層含有使丙烯酸系化合物硬化之丙烯酸系樹脂與熱傳導性填料，該丙烯酸系樹脂之玻璃轉移溫度為-80~15℃，黏著性熱傳導層之觸黏性高於非黏著性樹脂層之觸黏性，非黏著性樹脂層之玻璃轉移溫度為60~110℃，非黏著性樹脂層與黏著性熱傳導層之T型剝離強度為0.2N/cm以上。
根據本發明之熱傳導性片材，由於積層有黏著性熱傳導層、及觸黏性低於該黏著性熱傳導層但具有特定大小之觸黏性之非黏 著性樹脂層，因此，使用熱傳導性片材組裝電子零件與散熱座時之加工性提昇，又，將經暫時組裝者重新組裝之重工性亦提昇。
1‧‧‧PET薄膜
2‧‧‧非黏著性樹脂層
3‧‧‧黏著性熱傳導層
4‧‧‧覆蓋薄膜(PET)
圖1係非黏著性樹脂層與黏著性熱導電層之T型剝離強度之測定方法之說明圖。
以下，對本發明詳細地進行說明。
本發明之熱傳導性片材積層有黏著性熱傳導層與非黏著性樹脂層。
於黏著性熱傳導層中，於使丙烯酸系化合物硬化之丙烯酸系樹脂中分散有熱傳導性填料。於本發明中，就提昇使用熱傳導性片材組裝電子零件與散熱座時之加工性、及將經暫時組裝者重新組裝之重工性而言，作為丙烯酸系化合物，使用作為其硬化物之丙烯酸系樹脂之玻璃轉移溫度成為-80~15℃、較佳為-70~-10℃者。作為此種丙烯酸系化合物，可舉出：(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸4-羥基丁酯等單官能(甲基)丙烯酸酯等，其中，較佳為丙烯酸2-乙基己酯、丙烯酸月桂酯。又，可將1種以上之可與該等共聚合之(甲基)丙烯酸、N-乙烯基吡咯啶酮、衣康酸、丙烯酸四氫糠酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸異莰酯、(甲基)丙烯酸乙氧基乙酯、(甲基)丙烯酸丁氧基乙酯、(甲基)丙烯酸苯氧基乙酯、(甲基)丙烯酸苯酯、(甲基)丙烯酸環己酯等進行混合使用。
又，作為丙烯酸系化合物之硬化方法，例如可設為使用光聚合起始劑、光交聯劑並照射紫外線之方法。於該情形時，若照射相當於光聚合起始劑之裂解所需能量的長波長紫外線(波長320~400nm)，則不會造成藉由紫外線照射而黏著性熱傳導層劣化之問題。
作為黏著性熱傳導層所含有之熱傳導性填料，可使用氫氧化鋁、氫氧化鎂等金屬氫氧化物；鋁、銅、銀等金屬；氧化鋁、氧化鎂等金屬氧化物；氮化鋁、氮化硼、氮化矽等氮化物；奈米碳管等。又，熱傳導性填料之平均粒徑較佳為設為0.5~100μm，尤其是就分散性與熱傳導性而言，較佳為併用平均粒徑3~20μm之小徑之填料與平均粒徑25~100μm之大徑之填料。
黏著性熱傳導層中熱傳導性填料之含量，係相對於上述丙烯酸系化合物之單體單元100質量份，較佳為100~2000質量份，更佳為300~1000質量份。若熱傳導性填料之含量過少，則無法充分地提高熱傳導性片材之熱傳導性，反之，若過多，則熱傳導性片材之柔軟性下降，因而欠佳。
於黏著性熱傳導層使用平均粒徑不同之兩種熱傳導性填料之情形下，較佳為將小徑之填料與大徑之填料之調配比設為15：85~90：10。
又，較佳為黏著性熱傳導層含有1種以上之下述可塑劑，該可塑劑係選自己二酸二辛酯、己二酸二異壬酯等己二酸系化合物；癸二酸辛酯、癸二酸二異癸酯等癸二酸系化合物；磷酸三甲苯酯等磷酸系化合物；蓖麻油或其衍生物、硬脂酸或油酸等高級脂肪酸及衍生物；酞酸二丁酯、酞酸二辛酯等酞酸系化合物；含有1種以上之選自由丙烯酸丁酯、丙烯酸2-乙基己酯、丙烯酸2-甲氧基乙酯所組成之群中之單體而成的均聚物或共聚物、或該等單體與選自由α-烯烴、 乙烯酯、乙烯醚之單體所構成群組中之單體的共聚物等丙烯酸系化合物、低分子量丙烯酸系聚合物；蠟、膠黏劑(tackifier)等，更佳為含有選自己二酸系、癸二酸系、磷酸系、蓖麻油系、油酸系及丙烯酸系中之1種以上之可塑劑。黏著性熱傳導層中可塑劑之含量係相對於上述丙烯酸系化合物之單體單元100質量份較佳為20~80質量份，更佳為30~70質量份。
此外，黏著性熱傳導層視需要可調配抗氧化劑、抗熱劣化劑、難燃劑、著色劑等。
黏著性熱傳導層之層厚較佳為200~3000μm。若過薄，則無法獲得對被黏附體之凹凸之充分之追隨性，若過厚，則硬化需要時間而生產性變差。
黏著性熱傳導層及非黏著性樹脂層之觸黏性係藉由於壓抵速度30mm/min、剝離速度120mm/min、負重196g、壓抵時間5.0秒、拉伸距離5mm、探針加熱40℃、片材台加熱40℃之條件下，將鋁製圓柱狀探針壓抵至該黏著性熱傳導層或該非黏著性樹脂層上並剝離，而作為探針觸黏性進行測定。
黏著性熱傳導層之觸黏性必須高於非黏著性樹脂層之觸黏性。
於第一樣態中，非黏著性樹脂層之觸黏性以探針觸黏性計為6~30kN/m2，較佳為7~25kN/m2。
又，該非黏著性樹脂層與黏著性熱傳導層之接著強度較小者有因加工時或重工時之操作而引起層間剝離等不良情況之虞。於第二樣態中，為了使操作性較佳，必須於T型剝離中設為0.2N/cm以上，可較佳地設為0.2~6N/cm。
若使非黏著性樹脂層之觸黏性如上所述般具有特定範 圍之探針觸黏性，並且非黏著性樹脂層與黏著性熱傳導層之剝離強度成為特定大小以上之方式形成，則非黏著性樹脂層成為於使用熱傳導性片材組裝電子零件與散熱座時並不發黏但發揮適度低之黏著性者，加工性提昇，並且將經暫時組裝者重新組裝時之重工性亦提昇，因而較佳。
為了將非黏著性樹脂層之觸黏性設為上述範圍，對於形 成非黏著性樹脂層之樹脂之玻璃轉移溫度之下限，設為60℃以上，更佳為設為70℃以上。藉此，即便不對用以形成非黏著性樹脂層之樹脂調配硬化劑等而實施硬化處理，亦可將非黏著性樹脂層之探針觸黏性設為30kN/m2以下、尤其是25kN/m2以下。
另一方面，關於形成非黏著性樹脂層之樹脂之玻璃轉移 溫度之上限，就使非黏著性樹脂層發揮適度低之黏著性，並且獲得與黏著性熱傳導層之接著強度之方面而言，設為110℃以下。
又，形成非黏著性樹脂層之樹脂較佳為與用以形成黏著 性熱傳導層之丙烯酸系化合物為非相溶性。藉此，即便將塗佈形成各層之塗敷用組成物重複塗佈而形成黏著性熱傳導層與非黏著性樹脂層之積層物，各層亦難以於該等之界面混雜，從而可獲得所期望之觸黏性。相對於此，於用以形成非黏著性樹脂層之樹脂與用以形成黏著性熱傳導層之丙烯酸系化合物為相溶性之情形下，藉由在進行重複塗佈之前預先對用以形成非黏著性樹脂層之塗敷層實施硬化處理，而使各層難以於該等之界面混雜，可獲得所期望之觸黏性。
作為用以形成非黏著性樹脂層所較佳之樹脂，即，玻璃 轉移溫度為60~110℃且與形成黏著性熱傳導層之丙烯酸系化合物為非相溶性之樹脂，可舉出：聚乙烯丁醛樹脂、聚酯樹脂、胺基甲酸乙 酯樹脂等。又，該等之分子量以數量平均分子量計較佳為10000~500000。
非黏著性樹脂層視需要可含有用以形成非黏著性樹脂 層之樹脂之硬化劑、氰尿酸三聚氰胺等有機系難燃劑、氫氧化鋁等熱傳導性填料、著色劑。
非黏著性樹脂層之層厚較佳為0.5~25μm，更佳為1~ 20μm。若非黏著性樹脂層之層厚過薄，則因與黏著性熱傳導層之相溶或由熱傳導性填料造成之摩擦損傷而會使黏著性增大，若過厚，則作為熱傳導性片材之熱傳導性變不充分。
再者，作為熱傳導性片材之熱傳導性，實用上熱傳導性 片材之厚度方向之熱傳導率於藉由依據ASTM D5470之熱傾斜法所進行之測定中，必需為1W/m．K以上，根據本發明，可設為1.5W/m．K以上，可更佳地設為2W/m．K以上。
作為本發明之熱傳導性片材之製造方法，例如分別預先 製備將上述形成黏著性熱傳導層之各成分混合而成之黏著性熱傳導層形成用塗料、及將用以形成非黏著性樹脂層之各成分與溶劑混合而成之非黏著性樹脂層形成用塗料，於由聚對苯二甲酸乙二酯(PET，polyethylene terephthalate)、聚萘二甲酸乙二酯(PEN，polyethylene naphthalate)、聚烯烴、玻璃紙等形成之剝離薄膜上，塗佈非黏著性樹脂層形成用塗料並使其乾燥，繼而，於該非黏著性樹脂層之塗敷面上重複塗佈黏著性熱傳導層形成用塗料，於黏著性熱傳導層形成用塗料之塗佈面上被覆PET、PEN、聚烯烴等覆蓋薄膜，自其上方照射紫外線使黏著性熱傳導層形成用塗料之塗佈層硬化，藉此可獲得本發明之熱傳導性片材。
又，亦可於剝離薄膜上塗佈非黏著性樹脂層形成用塗料 並使其乾燥，另一方面，於另一剝離薄膜塗佈黏著性熱傳導層形成用塗料，使方才之非黏著性樹脂層之塗敷面呈對向進行被覆從而代替覆蓋薄膜，照射紫外線使黏著性熱傳導層形成用塗料之塗佈層硬化，而製造本發明之熱傳導性片材。
再者，於以此種方式製造熱傳導性片材後，可剝離非黏 著性樹脂層之剝離薄膜，捲取熱傳導性片材進行保管。經如此捲取之熱傳導性片材係將黏著性熱傳導層側之剝離薄膜剝離而用於電子零件與散熱座之組裝。
[實施例]
以下，藉由實施例對本發明具體地進行說明。
[實施例1~7、比較例1~3]
利用甲苯：甲基乙基酮=1：1之混合溶劑，將表1所示之樹脂及硬化劑製備成固形份10質量%，利用棒式塗佈機塗佈於PET薄膜，於90℃乾燥5分鐘而形成表1所示之塗佈厚度之非黏著性樹脂層。
另一方面，將作為單官能丙烯酸酯之丙烯酸2-乙基己酯100質量份、作為可塑劑之蓖麻油衍生脂肪酸酯47質量份、光聚合起始劑(IRGACURE 819，BASF)1.4質量份、作為硬化劑之羥基叔戊酸新戊二醇酯二丙烯酸酯(KAYARAD FM-400，日本化藥)1.5質量份、作為熱傳導性填料之氫氧化鋁粉(平均粒徑80μm)400質量份、氫氧化鋁粉(平均粒徑8μm)400質量份進行混合，而製備黏著性熱傳導層形成用塗料。再者，該丙烯酸2-乙基己酯之硬化物之玻璃轉移溫度為-50~-40℃。
將如此製備而成之黏著性熱傳導層形成用塗料，以塗佈 厚度2mm重複塗佈於上述非黏著性樹脂層上，於其上被覆由PET構成之覆蓋薄膜，利用化學燈自PET薄膜側與覆蓋薄膜側之兩側照射長波長紫外線5分鐘，而製造實施例1~7及比較例1~3之熱傳導性片材。
[比較例4]
不設置非黏著性樹脂層，將以與實施例1同樣之方式製備而成之黏著性熱傳導層形成用塗料塗佈於PET薄膜，於其上被覆由PET構成之覆蓋薄膜，利用化學燈自PET薄膜側與覆蓋薄膜側之兩側照射長波長紫外線5分鐘，而製造比較例4之熱傳導性片材。
[評價]
關於各實施例及比較例之熱傳導性片材，以如下方式對(a)非黏著性樹脂層及黏著性熱傳導層之觸黏性、(b)熱傳導性片材之熱傳導率、(c)熱傳導性片材之重工性、(d)熱傳導性片材之非黏著性樹脂層與黏著性熱傳導層之層間剝離強度進行評價。將結果示於表1。
(a)非黏著性樹脂層及黏著性熱傳導層之觸黏性
作為觸黏性試驗機，使用RHESCA公司製造之黏著試驗機TAC-II，於壓抵速度30mm/min、剝離速度120mm/min、負重196g、壓抵時間5.0秒、拉伸距離5mm、探針加熱40℃、片材台加熱40℃之條件下，將直徑10mm之鋁製圓柱狀探針壓抵至實施例1~7及比較例1~3之熱傳導性片材之非黏著性樹脂層並剝離，此時測定探針觸黏性。再者，比較例4之熱傳導性片材中無非黏著性樹脂層，因此測定 黏著性熱傳導層之觸黏性。
(b)熱傳導性片材之熱傳導率
藉由依據ASTM D-5470之熱傳導率計(索尼製造)測定熱傳導片材之厚度方向之熱傳導率(加熱輸出8W，片材面壓1kgf/cm2)
(c)熱傳導性片材之重工性
於上下平行地呈對向一致之銅桿之間以非黏著性樹脂層成為下側之方式夾持熱傳導性片材，於壓力1kgf/cm2下放置10分鐘，其後將桿剝離。此時，將於熱傳導性片材之非黏著性樹脂層與銅板之間發生剝離之情形評價為○，將其以外之情形評價為×。
(d)熱傳導性片材之非黏著性樹脂層與黏著性熱傳導層之T型剝離強度
使用拉伸試驗機(RTG-1225，Orientec公司)，直接於下述狀態下藉由T型剝離試驗測定非黏著性樹脂層2與黏著性熱傳導層3之層間剝離強度：如圖1所示，於非黏著性樹脂層2上積層有PET薄膜1，於黏著性熱傳導層3上積層有覆蓋薄膜4。於該情形時，將拉伸速度設為500mm/min，樣品寬度設為2cm。
根據表1可知，於用以形成非黏著性樹脂層之樹脂之玻璃轉移溫度為60~110℃的實施例1、2、4~7中，即便不調配硬化劑，非黏著性樹脂層之觸黏值亦為6~25kN/m2，並且非黏著性樹脂層與黏著性熱傳導層之層間剝離強度(T型剝離強度)成為0.2N/cm以上，重工性良好。
又，可知非黏著性樹脂層之層厚為20μm以下，熱傳導 性片材具有充分之熱傳導性。
另一方面，於非黏著性樹脂層之觸黏值超過30kN/m2之比較例1、2及無非黏著性樹脂層之比較例4中，熱傳導性片材會貼附於被黏附體上，因此重工性較差，又，非黏著性樹脂層與黏著性熱傳導層之藉由T型剝離試驗所得之層間剝離強度未達0.2N/cm之比較例3，因非黏著樹脂層可輕易地自黏著性熱傳導層剝離而加工性較差。
(產業上之可利用性)
根據本發明之熱傳導性片材，由於積層有黏著性熱傳導層、及觸黏性低於該黏著性熱傳導層但具有特定大小之觸黏性之非黏著性樹脂層，因此使用熱傳導性片材組裝電子零件與散熱座時之加工性提昇，又，將經暫時組裝之者重新組裝之重工性亦提昇。
詳細且參照特定之實施樣態對本發明進行了說明，但業者知曉可在不脫離本發明之精神與範圍之情況下加以各種變更或修正。
本申請案係基於2013年3月28日提出申請之日本專利申請(日本專利特願2013-068724)者，其內容係作為參照而併入至本文中。

Claims (5)

  1. 一種熱傳導性片材，其係積層有黏著性熱傳導層與非黏著性樹脂層者，且黏著性熱傳導層含有使丙烯酸系化合物硬化之丙烯酸系樹脂與熱傳導性填料，該丙烯酸系樹脂之玻璃轉移溫度為-80~15℃，黏著性熱傳導層之觸黏性高於非黏著性樹脂層之觸黏性，非黏著性樹脂層之觸黏性為6~30kN/m2，非黏著性樹脂層之玻璃轉移溫度為60~110℃；非黏著性樹脂層與黏著性熱傳導層之T型剝離強度為0.2N/cm以上；用以形成非黏著性樹脂層之樹脂，係選自聚乙烯丁醛樹脂、聚酯樹脂及胺基甲酸乙酯樹脂；在此，觸黏性係藉由於壓抵速度30mm/min、剝離速度120mm/min、負重196g、壓抵時間5.0秒、拉伸距離5mm、探針加熱40℃、片材台加熱40℃之條件下，將鋁製圓柱狀探針壓抵至該黏著性熱傳導層或該非黏著性樹脂層並剝離，而作為探針觸黏性進行測定。
  2. 如申請專利範圍第1項之熱傳導性片材，其中，熱傳導性片材之厚度方向之熱傳導率為1.5W/m．K以上。
  3. 如申請專利範圍第1或2項之熱傳導性片材，其中，用以形成黏著性熱傳導層之丙烯酸系化合物為單官能(甲基)丙烯酸酯單體。
  4. 如申請專利範圍第1或2項之熱傳導性片材，其中，黏著性熱傳導層係相對於丙烯酸系化合物之單體單元100質量份，含有選 自己二酸系、癸二酸系、磷酸系、蓖麻油系、油酸系及丙烯酸系中之1種以上之可塑劑20~80質量份。
  5. 如申請專利範圍第3項之熱傳導性片材，其中，黏著性熱傳導層係相對於丙烯酸系化合物之單體單元100質量份，含有選自己二酸系、癸二酸系、磷酸系、蓖麻油系、油酸系及丙烯酸系中之1種以上之可塑劑20~80質量份。
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