TW201224074A - Solvent or solvent composition for printing - Google Patents

Solvent or solvent composition for printing Download PDF

Info

Publication number
TW201224074A
TW201224074A TW100138570A TW100138570A TW201224074A TW 201224074 A TW201224074 A TW 201224074A TW 100138570 A TW100138570 A TW 100138570A TW 100138570 A TW100138570 A TW 100138570A TW 201224074 A TW201224074 A TW 201224074A
Authority
TW
Taiwan
Prior art keywords
pattern
solvent
printing
organic
solar cell
Prior art date
Application number
TW100138570A
Other languages
English (en)
Chinese (zh)
Inventor
Youji Suzuki
Yasuyuki Akai
Original Assignee
Daicel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Corp filed Critical Daicel Corp
Publication of TW201224074A publication Critical patent/TW201224074A/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks
    • C09D11/03Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/033Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C43/00Ethers; Compounds having groups, groups or groups
    • C07C43/02Ethers
    • C07C43/03Ethers having all ether-oxygen atoms bound to acyclic carbon atoms
    • C07C43/04Saturated ethers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/52Electrically conductive inks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4846Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867Applying pastes or inks, e.g. screen printing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional radiating surfaces
    • H05B33/22Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
TW100138570A 2010-10-26 2011-10-25 Solvent or solvent composition for printing TW201224074A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010239264 2010-10-26

Publications (1)

Publication Number Publication Date
TW201224074A true TW201224074A (en) 2012-06-16

Family

ID=46037088

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100138570A TW201224074A (en) 2010-10-26 2011-10-25 Solvent or solvent composition for printing

Country Status (4)

Country Link
JP (1) JP2012107206A (ko)
KR (1) KR20120043647A (ko)
CN (1) CN102453377A (ko)
TW (1) TW201224074A (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5871720B2 (ja) * 2011-06-16 2016-03-01 株式会社ダイセル 印刷用溶剤又は溶剤組成物
JP5886591B2 (ja) * 2011-08-09 2016-03-16 株式会社ダイセル 印刷用溶剤及びペースト組成物
JP5670924B2 (ja) * 2012-01-10 2015-02-18 株式会社ノリタケカンパニーリミテド 導電性接合材とこれを用いたセラミック電子材料の接合方法およびセラミック電子デバイス

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9208955D0 (en) * 1992-04-24 1992-06-10 Dow Europ Sa Dicyandiamide solution
US5922109A (en) * 1997-03-11 1999-07-13 The Dow Chemical Company Gas drying process using glycol solution solubility suppressants
TWI383271B (zh) * 2004-03-03 2013-01-21 Daicel Chem 微影後之洗淨步驟用洗淨劑及沖洗液
TW200604226A (en) * 2004-03-31 2006-02-01 Zeon Corp Radiation-sensitive composition, multilayer body and method for producing same, and electronic component
JP2006195175A (ja) * 2005-01-13 2006-07-27 Hitachi Chem Co Ltd 放射線硬化性組成物、その保存方法、硬化膜形成方法、パターン形成方法、パターン使用方法、電子部品及び光導波路
JP2006278071A (ja) * 2005-03-29 2006-10-12 Toyo Aluminium Kk ペースト組成物、電極およびそれを備えた太陽電池素子
WO2008123388A1 (ja) * 2007-03-26 2008-10-16 Jsr Corporation 硬化性樹脂組成物、保護膜および保護膜の形成方法
TWI370552B (en) * 2007-06-08 2012-08-11 Gigastorage Corp Solar cell
JP2009086292A (ja) * 2007-09-28 2009-04-23 Fujifilm Corp カラーフィルタ用着色組成物、カラーフィルタ、及び表示装置
JP5051371B2 (ja) * 2007-11-26 2012-10-17 Jsr株式会社 感放射線性樹脂組成物、液晶表示素子のスペーサーおよび保護膜ならびに液晶表示素子
JP2009192974A (ja) * 2008-02-18 2009-08-27 Seiko Epson Corp カラーフィルター用インク、カラーフィルター用インクセット、カラーフィルター、画像表示装置、および、電子機器
JP2010072031A (ja) * 2008-09-16 2010-04-02 Seiko Epson Corp カラーフィルター用インク、カラーフィルター、画像表示装置、および、電子機器
JP2010070724A (ja) * 2008-09-22 2010-04-02 Showa Denko Kk 硬化性組成物除去液
WO2010106980A1 (ja) * 2009-03-17 2010-09-23 積水化学工業株式会社 無機微粒子分散ペースト組成物
JP2011064770A (ja) * 2009-09-15 2011-03-31 Sumitomo Chemical Co Ltd 感光性樹脂組成物
JP2011233480A (ja) * 2010-04-30 2011-11-17 Ricoh Co Ltd 積層構造の形成方法及び有機エレクトロルミネッセンス素子の製造方法
JP5703674B2 (ja) * 2010-10-12 2015-04-22 日立化成株式会社 p型拡散層形成組成物、p型拡散層の製造方法、及び太陽電池セルの製造方法

Also Published As

Publication number Publication date
KR20120043647A (ko) 2012-05-04
CN102453377A (zh) 2012-05-16
JP2012107206A (ja) 2012-06-07

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