WO2012014481A1 - オフセット印刷用導電性ペースト - Google Patents
オフセット印刷用導電性ペースト Download PDFInfo
- Publication number
- WO2012014481A1 WO2012014481A1 PCT/JP2011/004279 JP2011004279W WO2012014481A1 WO 2012014481 A1 WO2012014481 A1 WO 2012014481A1 JP 2011004279 W JP2011004279 W JP 2011004279W WO 2012014481 A1 WO2012014481 A1 WO 2012014481A1
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- WIPO (PCT)
- Prior art keywords
- pattern
- conductive
- conductive paste
- offset printing
- resin
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
Definitions
- the present invention relates to a conductive paste for offset printing.
- photolithography is widely used as a high-definition wiring pattern forming technique in electronic devices.
- photolithography is a subtractive process of forming a pattern by removing a material, there are problems such as a low use efficiency of the material, a complicated process, and a large facility for a wet process.
- a conductive paste is supplied to a gravure plate, transferred to a blanket cylinder using, for example, an elastic material such as silicone, and further transferred to a substrate on a stage, thereby forming a wiring pattern.
- a conductive pattern such as can be formed (see, for example, Patent Document 1).
- a conductive paste is transferred from a plate to a substrate through a blanket cylinder, and therefore, good transferability is required in each step.
- pattern shape defects such as a beard defect of a pattern that causes electrical characteristic deterioration (short circuit failure) due to stringing of the conductive paste or static electricity. For this reason, there is a demand for a conductive paste having appropriate rheological properties and excellent printability.
- the conductive paste is required to improve the printability such as transferability.
- offset printing a pattern formed on a plate is transferred onto a blanket cylinder (off process), and further transferred from the blanket cylinder to a substrate (set process). At this time, if the conductive paste is not dried to some extent, the pattern remains on the blanket cylinder. On the other hand, if it is too dry on the blanket cylinder, it cannot be transferred to the substrate. Therefore, selection of the organic solvent contained in the conductive paste that greatly affects drying is important.
- an object of the present invention is to provide a conductive paste for offset printing that has good offset printing suitability such as transferability and can form a high-definition conductive pattern.
- the conductive paste for offset printing of this embodiment contains an organic binder resin, a conductive powder, and an organic solvent containing 30 to 90% by mass of a high-boiling solvent having a boiling point of 250 to 330 ° C. at 760 mmHg.
- the organic binder resin preferably contains a carboxylic acid-containing resin having at least two carboxyl groups in one molecule.
- a carboxylic acid-containing resin By including such a carboxylic acid-containing resin, the elasticity of the conductive paste is improved, so that it is difficult for the paste to break during the transfer process (off process and set process), and good printability. Can be improved.
- the conductive paste for offset printing of this embodiment contains a crosslinking agent.
- this crosslinking agent preferably contains an epoxy resin containing at least two glycidyl groups in at least one molecule.
- the pattern of the conductive paste for offset printing is formed on the plate, the formed pattern is primarily transferred to the surface of the blanket cylinder, and the transferred pattern is secondarily transferred to the surface of the base material.
- the formed pattern is preferably dried or cured at 80 to 200 ° C.
- the conductive paste for offset printing of one embodiment of the present invention has good offset printing suitability such as transferability, and can form a high-definition conductive pattern.
- the conductive paste for offset printing of this embodiment contains an organic binder resin, a conductive powder, and an organic solvent containing 30 to 90% by mass of a high boiling point solvent having a boiling point in the range of 250 to 330 ° C. at 760 mmHg. It is a thing.
- the organic binder resin in the conductive paste for offset printing according to this embodiment is used to impart good printability to the paste or remain in the conductive pattern to impart physical properties such as adhesion, flex resistance, and hardness. Used.
- Such an organic binder resin is not particularly limited as long as it can impart printability to the paste.
- various kinds of resins such as a polyester resin, a urethane-modified polyester resin, an epoxy-modified polyester resin, and an acrylic-modified polyester resin can be used.
- Modified polyester resin polyether urethane resin, polycarbonate urethane resin, acrylic urethane resin, vinyl chloride / vinyl acetate copolymer, epoxy resin, phenol resin, phenoxy resin, acrylic resin, polyvinyl butyral resin, polyamideimide, polyimide, polyamide, nitro Examples thereof include modified celluloses such as cellulose, cellulose acetate butyrate (CAB), and cellulose acetate propionate (CAP).
- CAB cellulose acetate butyrate
- CAP cellulose acetate propionate
- carboxylic acid-containing resin containing at least two carboxyl groups in at least one molecule.
- carboxylic acid-containing resins include, but are not limited to, the resins listed below.
- Monofunctional epoxy such as butyl glycidyl ether or phenyl glycidyl ether in a copolymer of unsaturated carboxylic acid such as (meth) acrylic acid and one or more other compounds having unsaturated double bonds
- a carboxyl group-containing resin obtained by adding a compound is particularly preferable to include a carboxylic acid-containing resin containing at least two carboxyl groups in at least one molecule.
- a carboxyl group-containing resin obtained by reacting a polyfunctional epoxy compound with a saturated monocarboxylic acid and reacting the resulting hydroxyl group with a saturated or unsaturated polybasic acid anhydride.
- a hydroxyl group- and carboxyl group-containing resin obtained by reacting a hydroxyl group-containing polymer such as a polyvinyl alcohol derivative with a saturated or unsaturated polybasic acid anhydride.
- carboxyl group-containing resins (1), (2) and (3) are particularly preferable to use. These can arbitrarily adjust the molecular weight, the glass transition point, and the like, and can appropriately adjust the printing suitability of the paste and the adhesion to the substrate.
- the acid value of such a carboxyl group-containing resin is preferably 40 to 200 mgKOH / g. If the acid value of the carboxyl group-containing resin is less than 40 mgKOH / g, the cohesive strength of the paste is reduced, and transfer defects are likely to occur during printing. On the other hand, if it exceeds 200 mgKOH / g, the viscosity of the paste becomes too high, and it becomes necessary to add a large amount of a crosslinking agent. More preferably, it is 45 to 150 mgKOH / g.
- polyester resin acrylic resin, polyvinyl butyral resin, modified polyester resin, vinyl chloride / vinyl acetate copolymer, copolymer from the viewpoint of flex resistance and adhesion to the substrate
- acrylic resin polyvinyl butyral resin
- modified polyester resin vinyl chloride / vinyl acetate copolymer, copolymer from the viewpoint of flex resistance and adhesion to the substrate
- a polyester resin or the like is preferable.
- the organic binder resin preferably has a number average molecular weight (Mn) of 3000 to 50000. If the number average molecular weight is less than 3000, transfer defects during printing are likely to occur, and it becomes difficult to form a good conductive pattern. On the other hand, if the number average molecular weight exceeds 50000, whisker defects and line waviness due to stringing of the paste are liable to occur during printing, and printability deteriorates. More preferably, it is 5000-30000.
- the number average molecular weight is a standard polystyrene equivalent value measured by gel permeation chromatography (GPC).
- any material that imparts conductivity to the formed conductive pattern may be used.
- examples of such conductive powder include Ag, Au, Pt, Pd, Ni, Cu, Al, Sn, Pb, Zn, Fe, Ir, Os, Rh, W, Mo, Ru, and the like.
- These conductive powders are not limited to those used in a single form, and may be any of these alloys or a multilayer body having any of these as a core or a coating layer. Furthermore, an oxide such as tin oxide (SnO 2 ), indium oxide (In 2 O 3 ), or ITO (Indium Tin Oxide) may be used.
- an oxide such as tin oxide (SnO 2 ), indium oxide (In 2 O 3 ), or ITO (Indium Tin Oxide) may be used.
- a spherical shape As the shape, various shapes such as a spherical shape, a flake shape and a dentrite shape can be used, but in consideration of printability and dispersibility, it is preferable to use a spherical shape as a main component.
- Such a conductive powder is preferably 85 to 95% by mass based on the non-volatile component of the conductive paste for offset printing (the component that does not evaporate from the paste in the drying step and remains in the film). If it is less than 85% by mass, it will be difficult to obtain sufficient electrical conductivity, and if it exceeds 95% by mass, it will be difficult to obtain sufficient printability and to maintain the shape of the conductive pattern. More preferably, it is 90 to 94% by mass.
- the conductive powder When the spherical conductive powder is used, the conductive powder has an average particle size of 10 to 10 random powders observed with an electron microscope (SEM) at a magnification of 10,000 to 0.1 ⁇ m. Is preferred. When the average particle size is less than 0.1 ⁇ m, the contact between the conductive powders hardly occurs and the conductivity is lowered. On the other hand, when the average particle diameter exceeds 5 ⁇ m, it is difficult to obtain straightness of the line edge when printing. More preferably, the thickness is 0.4 to 2 ⁇ m. It is preferable to use an average particle size measured by Microtrac of 0.5 to 3.5 ⁇ m.
- the average particle diameter of 10 random conductive powders observed at 10000 times using an electron microscope (SEM) is preferably 0.1 to 10 ⁇ m.
- the average particle size is less than 0.1 ⁇ m, the contact between the conductive powders hardly occurs and the conductivity is lowered.
- the average particle diameter exceeds 10 ⁇ m, it becomes difficult to obtain straightness of the line edge when printing.
- the thickness is 0.4 to 5 ⁇ m. It is preferable to use an average particle diameter measured by Microtrac of 0.5 to 7 ⁇ m.
- the silver powder preferably has a specific surface area of 0.01 to 2 m 2 / g.
- the specific surface area is less than 0.01 m 2 / g, sedimentation tends to occur during storage.
- the specific surface area exceeds 2 m 2 / g, the oil absorption is increased and the fluidity of the paste is impaired. More preferably, it is 0.5 to 1.5 m 2 / g.
- the organic solvent in the conductive paste for offset printing of this embodiment is used for imparting good printability.
- a solvent containing 30 to 90% by mass of a high boiling point solvent having a boiling point of 250 to 330 ° C. at 760 mmHg is used.
- the high boiling point solvent those having a boiling point of 250 to 330 ° C. at 760 mmHg are used.
- the boiling point is less than 250 ° C., the drying rate is too fast, and transfer to the substrate becomes difficult.
- it exceeds 330 degreeC it will become difficult to use as an organic solvent. More preferably, it is 250 ° C to 300 ° C.
- Examples of such a high boiling point solvent include diamylbenzene (boiling point 260 to 280 ° C), triamylbenzene (boiling point 300 to 320 ° C), n-dodecanol (boiling point 255 to 259 ° C), diethylene glycol dibutyl ether (boiling point 255 ° C).
- Diethylene glycol monoacetate (boiling point 250 ° C), triethylene glycol (boiling point 276 ° C), triethylene glycol monoethyl ether (boiling point 256 ° C), triethylene glycol monobutyl ether (boiling point 271 ° C), tetraethylene glycol (boiling point 327 ° C) ), Tetraethylene glycol monobutyl ether (boiling point 304 ° C), tripropylene glycol (boiling point 267 ° C), 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate (boiling point 253) ), And the like.
- a triethylene glycol derivative or a tripropylene glycol derivative is preferably used.
- Such a high boiling point solvent is contained in an organic solvent in an amount of 30 to 90% by mass. If it is less than 30% by mass, the drying speed of the paste is too high, and it becomes difficult to obtain printability such as good transferability. On the other hand, if it exceeds 90 mass%, the paste becomes difficult to dry and remains on the blanket cylinder, so that the printability deteriorates. More preferably, it is 30 to 60% by mass.
- an organic solvent other than these high-boiling solvents a known solvent can be used as long as it can dissolve the organic binder.
- a known solvent can be used as long as it can dissolve the organic binder.
- examples include acetate, terpineol, methyl ethyl ketone, carbitol, carbitol acetate, and butyl carbitol. These may be used alone or in admixture of two or more.
- the conductive paste for offset printing of the present embodiment is preferably adjusted with an organic solvent containing such a high boiling point solvent so that the paste viscosity is suitable for offset printing, for example, 50 to 1000 dPa ⁇ s.
- the viscosity is less than 50 dPa ⁇ s, the thickness of the printed pattern becomes thin, and the surface resistance of the obtained conductive pattern tends to increase.
- the viscosity exceeds 1000 dPa ⁇ s, it becomes difficult to scrape off the paste with a doctor blade during gravure printing, and printing defects such as background stains (adhesion of paste on non-image areas) and bleeding are likely to occur. .
- a more preferable viscosity is 100 to 750 dPa ⁇ s.
- the viscosity of the paste in the present invention is a value measured using a cone plate viscometer under conditions of a shear rate of 10 s ⁇ 1 and 25 ° C.
- the conductive paste for offset printing of the present embodiment it is preferable to further contain a crosslinking agent in order to form a three-dimensional network chain structure and improve the solvent resistance and adhesion of the formed pattern.
- the cross-linking agent it is only necessary that the cross-linking agent can react with the organic binder resin without causing deterioration in printability.
- a crosslinking agent is not particularly limited as long as it is a resin that is cured by heating.
- epoxy resin, phenol resin, melamine resin, alkyd resin, polyurethane resin, polyester resin, acrylic resin, polyimide resin, and their modification Examples thereof include resins, and these can be used alone or in combination of two or more.
- Other examples include oxetane compounds having at least two oxetanyl groups in the molecule.
- an epoxy resin containing at least two glycidyl groups in at least one molecule examples include bisphenol A type, hydrogenated bisphenol A type, bisphenol F type, bisphenol S type, phenol novolak type, cresol novolak type, bisphenol A novolak type, biphenol type, bixylenol type, and tris.
- Known epoxy resins such as phenol methane type, N-glycidyl type, N-glycidyl type epoxy resin, alicyclic epoxy resin, etc. are mentioned, but are not limited to specific ones. Alternatively, two or more kinds can be used in combination.
- the mixing ratio of these epoxy resins is suitably 1 to 100 parts by mass, preferably 5 to 40 parts by mass, per 100 parts by mass of the organic binder resin.
- a curing catalyst for promoting the reaction between the organic binder resin and the crosslinking agent such as an amine compound or an imidazole derivative, may be blended.
- a coloring agent can be included in order to color the conductive paste for offset printing of the present embodiment.
- the type and shape of the colorant are not particularly limited, and known ones can be used.
- the colorant when used for a display, it may be a color suitable for causing a decrease in brightness sufficient to suppress external light reflection. Preferred examples include blue, black, and black by mixing three colors.
- black is suitable, and carbon black, solvent black, oil black, etc. can be used, but carbon black for coloring material is suitable because of its availability.
- carbon black include carbon black for color materials such as channel black, furnace black, and lamp black, and conductive carbon black and acetylene black.
- the blending amount of such a colorant is not particularly limited as long as good printability can be obtained and the target lightness can be colored. From the viewpoint of printability, it is preferably 100 parts by mass or less with respect to 100 parts by mass of the organic binder resin. When the amount exceeds 100 parts by mass, problems such as a significant increase in viscosity and excessively high thixotropy occur. More preferably, it is 80 parts by mass or less.
- a colorant when it is set as a display use, for example, it is preferable to set it as 5 mass parts or more with respect to 100 mass parts of organic binder resin.
- the blending amount of the colorant is less than 5 parts by mass, the brightness of the paste becomes high and the visibility of the display is deteriorated. More preferably, it is 10 parts by mass or more.
- Such a colorant can be added as a powder or a dispersion.
- the blending amount of the organic binder resin, the conductive powder, and the colorant (when contained) is based on the mass ( The blending amount of the conductive powder + the blending amount of the colorant) / the blending amount of the organic binder: A is 12 ⁇ A ⁇ 26 It is preferable to satisfy the relationship. If the A value is less than 12, the proportion of the conductive powder is relatively reduced, the conductivity is lowered, and the proportion of the powder component in the paste is reduced, so that it is difficult to obtain a rheology suitable for printing. If it exceeds 26, the proportion of the powder in the paste becomes too high, resulting in a highly thixotropic paste, and rheology suitable for printing cannot be achieved. More preferably, 13 ⁇ A ⁇ 22.
- metal dispersants such as thixotropy imparting agents, antifoaming agents, leveling agents, surface tension reducing agents, diluents, plasticizers, antioxidants, metal deactivators, coupling agents as long as printability is not impaired.
- additives such as fillers may be blended.
- the tack value of the paste is preferably set to 5 to 35 in order to provide good printability.
- the transferability of the paste is inferior at the time of printing, the printing quality is deteriorated, the film thickness after printing tends to be thin, and the surface resistance tends to be high.
- the tack value exceeds 35, picking of the printed material (breaking of the printed material) and jamming (the printed material clogs the printing machine) easily occur during printing. More preferably, it is 10-30.
- the tack value is a value measured using a rotary tack meter (generic name: incometer) under the conditions of 30 ° C. and 400 revolutions.
- a conductive pattern can be formed by offset printing on a substrate such as a printed wiring board, a glass substrate, or a resin film such as a PET film. it can.
- a conductive paste is supplied onto an intaglio plate such as a gravure plate or a plate such as a relief plate to form a desired pattern.
- a plate used for intaglio printing such as gravure offset printing is subjected to photoengraving or laser engraving on the surface of a cylinder or planographic plate made of copper, 42 alloy, glass or the like. If necessary, the durability of the intaglio may be improved by performing a chrome plating process or a DLC (diamond-like carbon) process.
- the pattern thus formed is primarily transferred onto the blanket surface made of, for example, silicone rubber.
- the primary-transferred pattern is further transferred onto a substrate placed on a stage to form a coating film pattern on the substrate.
- the obtained coating film pattern is dried or cured at 80 to 200 ° C., for example, in a hot air circulation type drying furnace or the like. In this way, a conductive pattern is formed on the substrate. In the obtained conductive pattern, it is possible to obtain a high-definition conductive pattern having a good shape.
- the translucent conductive film used as a display front board can be formed by forming a mesh-like conductive pattern on a transparent base material.
- a resin film is used as the transparent substrate, for example, polyester resin, acrylic resin, polycarbonate resin, polyethersulfone resin, polypropylene resin, triacetylcellulose resin, dicyclopentadiene resin, norbornene resin, urethane resin, etc.
- the resin film which consists of is mentioned.
- the surface of the film may be provided with a hard coat layer, an easy-adhesion layer, a release treatment layer, a conductive polymer layer, an ink receiving layer, etc., or a plasma treatment or the like. May be.
- the thickness of the film is usually 20 to 800 ⁇ m.
- the mesh-shaped conductive pattern may be a lattice shape such as a triangle, a quadrangle, a pentagon, and other N-gons (N is an integer of 6 or more), or a pattern such as a round shape or a leaf shape. It may be indefinite.
- the line width of this pattern is preferably 10 to 80 ⁇ m, and the line interval is preferably 100 to 500 ⁇ m. If the line width or line interval is too large, the resulting conductive pattern tends to be noticeable, and the visibility of the screen tends to decrease. If the line spacing is too small, the resulting conductive pattern becomes fine (the number of lines per unit area increases), the visible light transmittance tends to decrease, and the screen tends to darken. On the other hand, when the line width and the line interval are small, it tends to be difficult to form a uniform pattern. More preferably, the line width is 10 to 40 ⁇ m and the line interval is 125 to 500 ⁇ m.
- the blackening treatment becomes unnecessary by adding a colorant to the paste.
- the obtained translucent conductive film may be subjected to post-treatment such as antireflection treatment, coloring treatment for color correction, and near infrared absorption treatment. Furthermore, you may laminate the adhesive for affixing on a display.
- part means “part by mass” unless otherwise specified.
- the obtained resin had a number average molecular weight of 15000, a weight average molecular weight of about 40000, and an acid value of 97 mgKOH / g.
- the weight average molecular weight was measured by high performance liquid chromatography in which three pumps LC-6AD manufactured by Shimadzu Corporation and columns Shodex (registered trademark) KF-804, KF-803, and KF-802 manufactured by Showa Denko Co., Ltd. were connected.
- this carboxylic acid-containing resin solution is referred to as Varnish-1.
- Examples 1 to 5 and Comparative Examples 1 and 2 Each component was mix
- Table 2 shows the ratio of high boiling point solvents in the organic solvents of Examples 1 to 4 and Comparative Examples 1 and 2.
- this glass intaglio was applied to a blanket cylinder made of silicone rubber having a rubber hardness of 30 °, and the conductive paste filled in the depression was transferred to the surface of the blanket cylinder (off process). Furthermore, the pattern of the conductive paste on the blanket cylinder surface was transferred onto the surface of soda lime glass having a thickness of 1.8 mm (setting step).
- the samples thus obtained were evaluated as follows.
- Print 1 Transferability evaluation
- a setting process was performed 10 seconds after the off process, and whether or not the conductive paste remained on the blanket cylinder surface was visually evaluated.
- the evaluation criteria are as follows. ⁇ : No conductive paste remains on the blanket surface (100% transfer). ⁇ : The conductive paste remains on a part of the blanket surface. X: The conductive paste remains on the entire blanket.
- Comparative Example 1 containing no high-boiling solvent, the paste on the blanket surface dries after standing for a long time, and the transferability is impaired. Further, in Comparative Example 2, it can be seen that although the transferability is maintained, the formed pattern is poor in straightness and the printability is deteriorated.
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Abstract
Description
このような構成により、転写性など、良好なオフセット印刷適性を有し、高精細な配線パターンの形成が可能となる。
このようなカルボン酸含有樹脂を含有することにより、導電性ペーストの弾性が向上するため、印刷工程において転写(オフ工程、およびセット工程)の際にペーストの破断がおきにくくなり、良好な印刷適性を向上させることが可能となる。
このような架橋剤を含むことにより、有機バインダー樹脂と反応し、3次元網目鎖構造を形成し、形成されるパターンの耐溶剤性、密着性を向上させることが可能となる。
このようにして導電パターンを形成することにより、良好な形状を有し、高精細な導電パターンを得ることが可能となる。
本実施形態のオフセット印刷用導電性ペーストは、有機バインダー樹脂と、導電粉末と、760mmHgにおける沸点が250~330℃の範囲である高沸点溶剤を30~90質量%含む有機溶剤と、を含有する物である。
(1)(メタ)アクリル酸などの不飽和カルボン酸と、それ以外の不飽和二重結合を有する化合物の1種類以上と共重合することにより得られるカルボキシル基含有樹脂。
(2)(メタ)アクリル酸などの不飽和カルボン酸と、それ以外の不飽和二重結合を有する化合物の1種類以上との共重合体に、ブチルグリシジルエーテル、フェニルグリシジルエーテルなどの単官能エポキシ化合物を付加させることによって得られるカルボキシル基含有樹脂。
(3)グリシジル(メタ)アクリレートや3,4-エポキシシクロヘキシルメチル(メタ)アクリレート等のエポキシ基と不飽和二重結合を有する化合物と、それ以外の不飽和二重結合を有する化合物との共重合体に、プロピオン酸などの飽和カルボン酸を反応させ、生成した二級の水酸基に多塩基酸無水物を反応させて得られるカルボキシル基含有樹脂。
(4)無水マレイン酸などの不飽和二重結合を有する酸無水物と、それ以外の不飽和二重結合を有する化合物との共重合体に、ブチルアルコールなどの水酸基を有する化合物を反応させて得られるカルボキシル基含有樹脂。
(5)多官能エポキシ化合物と飽和モノカルボン酸を反応させ、生成した水酸基に飽和又は不飽和多塩基酸無水物を反応させて得られるカルボキシル基含有樹脂。
(6)ポリビニルアルコール誘導体などの水酸基含有ポリマーに、飽和又は不飽和多塩基酸無水物を反応させて得られる水酸基及びカルボキシル基含有樹脂。
(7)多官能エポキシ化合物と、飽和モノカルボン酸と、一分子中に少なくとも1個のアルコール性水酸基と、エポキシ基と反応するアルコール性水酸基以外の1個の反応性基を有する化合物との反応生成物に、飽和又は不飽和多塩基酸無水物を反応させて得られるカルボキシル基含有樹脂。
(8)一分子中に少なくとも2個のオキセタン環を有する多官能オキセタン化合物に飽和モノカルボン酸を反応させ、得られた変性オキセタン樹脂中の第一級水酸基に対して飽和又は不飽和多塩基酸無水物を反応させて得られるカルボキシル基含有樹脂。
(9)多官能エポキシ樹脂に飽和モノカルボン酸を反応させた後、多塩基酸無水物を反応させて得られるカルボキシル基含有樹脂に、更に、分子中に1個のオキシラン環を有する化合物を反応させて得られるカルボキシル基含有樹脂。
なお、数平均分子量は、ゲルパーメーションクロマトグラフィー(GPC)にて測定した標準ポリスチレン換算の値である。
なお、マイクロトラックによって測定した平均粒径では、0.5~3.5μmの大きさのものを用いることが好ましい。
なお、マイクロトラックによって測定した平均粒径では、0.5~7μmの大きさのものを用いることが好ましい。
なお、本発明におけるペーストの粘度は、コーンプレート型粘度計を用い、剪断速度が10s-1、25℃の条件にて測定した値である。
このような着色剤は、粉体や、分散液で添加することができる。
12≦A≦26
の関係を満たすことが好ましい。
A値が12未満であると、相対的に導電粉の割合が減少するため導電性が低下し、かつペースト中の粉体成分の割合が少なくなるため印刷に適したレオロジーとすることが困難となり、26を超えるとペースト中の粉体の割合が多くなりすぎてチキソ性の高いペーストとなり、印刷に適したレオロジーを達成できなくなる。より好ましくは、13≦A≦22である。
温度計、攪拌機、滴下ロート、及び還流冷却器を備えたフラスコに、メチルメタクリレートとアクリル酸を0.80:0.20のモル比で仕込み、溶媒としてトリエチレングリコールモノブチルエーテル(沸点 271℃)、触媒としてアゾビスイソブチロニトリルを入れ、窒素雰囲気下、80℃で6時間攪拌し、不揮発分が40質量%のカルボン酸含有樹脂溶液を得た。
溶剤をトリプロピレングリコールモノメチルエーテル(沸点=243℃)に変え、合成例1と同様の合成方法と、同様の仕込み比で、不揮発分40質量%のカルボン酸含有樹脂を得た。数平均分子量、重量平均分子量および酸価はワニス-1と同様の値であった。以下、このカルボン酸含有樹脂を、ワニス-2と称す。
表1に示す配合割合で各成分を配合し、3本ロールミルにて練肉して導電性ペーストを得た。なお、ペーストの粘度は、約150dPa・sに調整した。
※2:平均粒径1.5μmの球状銀粉末
※3:ジエチレングリコールモノエチルエーテルアセテート(沸点=217℃,グリコールエステル系溶剤)
※4:トリエチレングリコールモノブチルエーテル(沸点=271℃、高沸点溶剤)
※5:2,4-ジアミノ-6-[2’-メチルイミダゾリル-(1)]-エチル-s-トリアジン イソシアヌル酸付加物
※6:ビスフェノールA型エポキシ樹脂(三菱化学社製 jER-828)
※7:日本アエロジル社製 エロジル#200
〈簡易グラビア印刷による印刷適性の評価〉
(試料の作成)
得られた各導電性ペーストを、ライン/スペース=70/30μm、版深:10μmのストライプパターンが形成されたガラス凹版の凹部に、スチールドクターを用いて充填した。
このようにして得られた試料について、以下のように評価を行った。
オフ工程後、10秒後にセット工程を行い、ブランケット胴表面に導電性ペーストが残っているかを目視で評価した。評価基準は以下の通りである。
○:ブランケット表面に導電性ペーストの残存がない(100%転写)。
△:ブランケット表面の一部に、導電性ペーストが残存している。
×:ブランケット全面に導電性ペーストが残っている。
オフ工程後、30秒後にセット工程を行い、ブランケット胴表面に導電性ペーストが残っているかを目視で評価した。評価基準は以下の通りである。
○:ブランケット表面に導電性ペーストの残存がない(100%転写)。
△:ブランケット表面の一部に、導電性ペーストが残存している。
×:ブランケット全面に導電性ペーストが残っている。
導電性ペーストのパターンが転写されたガラス基板を光学顕微鏡で観察し、印刷されたパターンの直進性、ヒゲ欠陥の有無を評価した。評価基準は以下の通りである。
○:直進性がある、及び/又はヒゲ欠陥が全く認められない。
△:やや直進性に欠ける、及び/又はわずかにヒゲ欠陥が生じている。
×:パターンのうねりや断線がある、及び/又は明らかに多くのヒゲ欠陥が生じている。
線幅1mm、長さ40cmのテストパターンを印刷し、熱風循環式乾燥炉を用いて、120℃にて30分間加熱処理をおこなった。得られたパターンの抵抗値を、テスター(ヒオキ社製 ミリオームハイテスター3540)を用いて測定し、パターンの膜厚から比抵抗値を算出した。
これらの評価結果を表2に示す。
Claims (6)
- 有機バインダー樹脂と、導電粉末と、760mmHgにおける沸点が250~330℃である高沸点溶剤を30~90質量%含む有機溶剤と、を含有することを特徴とするオフセット印刷用導電性ペースト。
- 前記有機バインダー樹脂は、少なくとも1分子中にカルボキシル基を2つ以上含むカルボン酸含有樹脂を含有することを特徴とする請求項1に記載のオフセット印刷用導電性ペースト。
- 架橋剤を含むことを特徴とする請求項1又は請求項2に記載のオフセット印刷用導電性ペースト。
- 前記架橋剤は、少なくとも1分子中にグリシジル基を2つ以上含むエポキシ樹脂を含むことを特徴とする請求項3に記載のオフセット印刷用導電性ペースト。
- 請求項1から請求項4のいずれか1項に記載の導電性ペーストのパターンを版上に形成し、
形成された前記パターンをブランケット胴表面に一次転写し、
一次転写された前記パターンを基材表面に2次転写し、
2次転写されたパターンを80~200℃で乾燥又は硬化させることを特徴とする導電パターンの形成方法。 - 請求項5に記載の導電パターンの形成方法により形成されたことを特徴とする導電パターン。
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KR101421195B1 (ko) * | 2013-04-15 | 2014-07-23 | 주식회사 휘닉스소재 | 도전성 페이스트 조성물 및 이로부터 제조된 전극 |
JP5610112B1 (ja) * | 2013-01-30 | 2014-10-22 | Dic株式会社 | 導電性ペースト、導電性パターンの形成方法及び導電性パターン印刷物 |
JPWO2014038331A1 (ja) * | 2012-09-05 | 2016-08-08 | 日立化成株式会社 | 銀ペースト組成物及びそれを用いた半導体装置 |
WO2017209266A1 (ja) * | 2016-06-03 | 2017-12-07 | 株式会社Dnpファインケミカル | 導電性パターン印刷用組成物及び導電性パターンを有する基板の製造方法 |
JP2018095885A (ja) * | 2018-01-22 | 2018-06-21 | 株式会社Dnpファインケミカル | 導電性パターン印刷用組成物及び導電性パターンを有する基板の製造方法 |
JPWO2019225271A1 (ja) * | 2018-05-23 | 2021-06-17 | 株式会社ダイセル | 導電性インク |
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CN104488040B (zh) * | 2012-07-20 | 2018-08-03 | 东洋纺株式会社 | 使用激光刻蚀加工用导电性糊剂而成的回路配线、电路及触摸面板 |
WO2016084312A1 (ja) * | 2014-11-25 | 2016-06-02 | バンドー化学株式会社 | 導電性インク |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62160603A (ja) * | 1986-01-08 | 1987-07-16 | 昭和高分子株式会社 | 導電性ペ−スト |
JPH08274434A (ja) * | 1995-03-30 | 1996-10-18 | Sumitomo Kinzoku Electro Device:Kk | 導電性ペースト及びそれを用いたセラミック回路基板 |
JP2002133944A (ja) * | 2000-10-27 | 2002-05-10 | Sumitomo Rubber Ind Ltd | 導電性インキ組成物とそれを用いた微細パターンの印刷方法および透光性電磁波シールド部材の製造方法 |
JP2009062523A (ja) * | 2007-08-10 | 2009-03-26 | Think Laboratory Co Ltd | 導電性インキ組成物 |
JP2009245844A (ja) * | 2008-03-31 | 2009-10-22 | Sumitomo Rubber Ind Ltd | 導電性ペースト |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005044771A (ja) * | 2003-07-10 | 2005-02-17 | Toyobo Co Ltd | 導電性ペースト |
CN101599313A (zh) * | 2009-07-02 | 2009-12-09 | 张祥成 | 一种疏水和亲水型纳米微米级微相半分离导电碳浆料及其制备方法 |
CN101696333B (zh) * | 2009-10-27 | 2012-05-23 | 彩虹集团公司 | 一种导电油墨及其制备方法 |
-
2011
- 2011-07-28 CN CN2011800347933A patent/CN103003375A/zh active Pending
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62160603A (ja) * | 1986-01-08 | 1987-07-16 | 昭和高分子株式会社 | 導電性ペ−スト |
JPH08274434A (ja) * | 1995-03-30 | 1996-10-18 | Sumitomo Kinzoku Electro Device:Kk | 導電性ペースト及びそれを用いたセラミック回路基板 |
JP2002133944A (ja) * | 2000-10-27 | 2002-05-10 | Sumitomo Rubber Ind Ltd | 導電性インキ組成物とそれを用いた微細パターンの印刷方法および透光性電磁波シールド部材の製造方法 |
JP2009062523A (ja) * | 2007-08-10 | 2009-03-26 | Think Laboratory Co Ltd | 導電性インキ組成物 |
JP2009245844A (ja) * | 2008-03-31 | 2009-10-22 | Sumitomo Rubber Ind Ltd | 導電性ペースト |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2014038331A1 (ja) * | 2012-09-05 | 2016-08-08 | 日立化成株式会社 | 銀ペースト組成物及びそれを用いた半導体装置 |
US10201879B2 (en) | 2012-09-05 | 2019-02-12 | Hitachi Chemical Company, Ltd. | Silver paste composition and semiconductor device using same |
JP5610112B1 (ja) * | 2013-01-30 | 2014-10-22 | Dic株式会社 | 導電性ペースト、導電性パターンの形成方法及び導電性パターン印刷物 |
KR101421195B1 (ko) * | 2013-04-15 | 2014-07-23 | 주식회사 휘닉스소재 | 도전성 페이스트 조성물 및 이로부터 제조된 전극 |
WO2017209266A1 (ja) * | 2016-06-03 | 2017-12-07 | 株式会社Dnpファインケミカル | 導電性パターン印刷用組成物及び導電性パターンを有する基板の製造方法 |
JP2017218469A (ja) * | 2016-06-03 | 2017-12-14 | 株式会社Dnpファインケミカル | 導電性パターン印刷用組成物及び導電性パターンを有する基板の製造方法 |
JP2018095885A (ja) * | 2018-01-22 | 2018-06-21 | 株式会社Dnpファインケミカル | 導電性パターン印刷用組成物及び導電性パターンを有する基板の製造方法 |
JPWO2019225271A1 (ja) * | 2018-05-23 | 2021-06-17 | 株式会社ダイセル | 導電性インク |
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