TW201224074A - Solvent or solvent composition for printing - Google Patents
Solvent or solvent composition for printing Download PDFInfo
- Publication number
- TW201224074A TW201224074A TW100138570A TW100138570A TW201224074A TW 201224074 A TW201224074 A TW 201224074A TW 100138570 A TW100138570 A TW 100138570A TW 100138570 A TW100138570 A TW 100138570A TW 201224074 A TW201224074 A TW 201224074A
- Authority
- TW
- Taiwan
- Prior art keywords
- pattern
- solvent
- printing
- organic
- solar cell
- Prior art date
Links
- 239000002904 solvent Substances 0.000 title claims abstract description 65
- 238000007639 printing Methods 0.000 title claims abstract description 55
- 239000000203 mixture Substances 0.000 title claims abstract description 52
- 238000000034 method Methods 0.000 claims abstract description 78
- -1 dipropylene glycol dialkyl ether Chemical class 0.000 claims abstract description 37
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 239000011347 resin Substances 0.000 claims abstract description 13
- 150000001875 compounds Chemical class 0.000 claims abstract description 6
- 238000000813 microcontact printing Methods 0.000 claims abstract description 6
- 238000007645 offset printing Methods 0.000 claims abstract description 6
- 238000007650 screen-printing Methods 0.000 claims abstract description 6
- 238000007646 gravure printing Methods 0.000 claims abstract description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract 2
- 239000010409 thin film Substances 0.000 claims description 16
- 239000004840 adhesive resin Substances 0.000 claims description 12
- 229920006223 adhesive resin Polymers 0.000 claims description 12
- 238000005401 electroluminescence Methods 0.000 claims description 12
- 238000010304 firing Methods 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 6
- 239000004925 Acrylic resin Substances 0.000 claims description 5
- 229920000178 Acrylic resin Polymers 0.000 claims description 5
- 239000012461 cellulose resin Substances 0.000 claims description 4
- 238000000059 patterning Methods 0.000 claims description 3
- 210000004027 cell Anatomy 0.000 claims 7
- 210000002858 crystal cell Anatomy 0.000 claims 1
- 239000004973 liquid crystal related substance Substances 0.000 claims 1
- 239000000654 additive Substances 0.000 abstract description 9
- 230000000996 additive effect Effects 0.000 abstract description 6
- 239000011230 binding agent Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 16
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 13
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 13
- 239000001856 Ethyl cellulose Substances 0.000 description 12
- 229920001249 ethyl cellulose Polymers 0.000 description 12
- 235000019325 ethyl cellulose Nutrition 0.000 description 12
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 230000007261 regionalization Effects 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- 229910052799 carbon Inorganic materials 0.000 description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 5
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 5
- 229920002678 cellulose Polymers 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000001913 cellulose Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 239000012074 organic phase Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 241000234282 Allium Species 0.000 description 3
- 235000002732 Allium cepa var. cepa Nutrition 0.000 description 3
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 3
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229940022663 acetate Drugs 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 3
- 239000012153 distilled water Substances 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 3
- 238000007644 letterpress printing Methods 0.000 description 3
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- CRWNQZTZTZWPOF-UHFFFAOYSA-N 2-methyl-4-phenylpyridine Chemical compound C1=NC(C)=CC(C=2C=CC=CC=2)=C1 CRWNQZTZTZWPOF-UHFFFAOYSA-N 0.000 description 2
- VATRWWPJWVCZTA-UHFFFAOYSA-N 3-oxo-n-[2-(trifluoromethyl)phenyl]butanamide Chemical compound CC(=O)CC(=O)NC1=CC=CC=C1C(F)(F)F VATRWWPJWVCZTA-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 150000001346 alkyl aryl ethers Chemical class 0.000 description 2
- QUKGYYKBILRGFE-UHFFFAOYSA-N benzyl acetate Chemical compound CC(=O)OCC1=CC=CC=C1 QUKGYYKBILRGFE-UHFFFAOYSA-N 0.000 description 2
- XUPYJHCZDLZNFP-UHFFFAOYSA-N butyl butanoate Chemical compound CCCCOC(=O)CCC XUPYJHCZDLZNFP-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- MTZQAGJQAFMTAQ-UHFFFAOYSA-N ethyl benzoate Chemical compound CCOC(=O)C1=CC=CC=C1 MTZQAGJQAFMTAQ-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 229940116333 ethyl lactate Drugs 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- NGAZZOYFWWSOGK-UHFFFAOYSA-N heptan-3-one Chemical compound CCCCC(=O)CC NGAZZOYFWWSOGK-UHFFFAOYSA-N 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000010416 ion conductor Substances 0.000 description 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- XMGQYMWWDOXHJM-UHFFFAOYSA-N limonene Chemical compound CC(=C)C1CCC(C)=CC1 XMGQYMWWDOXHJM-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- ZWRUINPWMLAQRD-UHFFFAOYSA-N nonan-1-ol Chemical compound CCCCCCCCCO ZWRUINPWMLAQRD-UHFFFAOYSA-N 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000011118 polyvinyl acetate Substances 0.000 description 2
- 229940075065 polyvinyl acetate Drugs 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 description 2
- URAYPUMNDPQOKB-UHFFFAOYSA-N triacetin Chemical compound CC(=O)OCC(OC(C)=O)COC(C)=O URAYPUMNDPQOKB-UHFFFAOYSA-N 0.000 description 2
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000052 vinegar Substances 0.000 description 2
- 235000021419 vinegar Nutrition 0.000 description 2
- NOOLISFMXDJSKH-UTLUCORTSA-N (+)-Neomenthol Chemical compound CC(C)[C@@H]1CC[C@@H](C)C[C@@H]1O NOOLISFMXDJSKH-UTLUCORTSA-N 0.000 description 1
- XUKSWKGOQKREON-UHFFFAOYSA-N 1,4-diacetoxybutane Chemical compound CC(=O)OCCCCOC(C)=O XUKSWKGOQKREON-UHFFFAOYSA-N 0.000 description 1
- CUVLMZNMSPJDON-UHFFFAOYSA-N 1-(1-butoxypropan-2-yloxy)propan-2-ol Chemical compound CCCCOCC(C)OCC(C)O CUVLMZNMSPJDON-UHFFFAOYSA-N 0.000 description 1
- STXQJDVOMPXMMW-UHFFFAOYSA-N 1-(1-methoxypropan-2-yloxy)butane Chemical compound CCCCOC(C)COC STXQJDVOMPXMMW-UHFFFAOYSA-N 0.000 description 1
- LAVARTIQQDZFNT-UHFFFAOYSA-N 1-(1-methoxypropan-2-yloxy)propan-2-yl acetate Chemical compound COCC(C)OCC(C)OC(C)=O LAVARTIQQDZFNT-UHFFFAOYSA-N 0.000 description 1
- FJJOLPMSHZJZPV-UHFFFAOYSA-N 1-(2-propoxypropoxy)decane Chemical compound CCCCCCCCCCOCC(C)OCCC FJJOLPMSHZJZPV-UHFFFAOYSA-N 0.000 description 1
- JWZSJQJEMGTJHC-UHFFFAOYSA-N 1-[1-(1-propoxypropan-2-yloxy)propan-2-yloxy]decane Chemical compound CCCCCCCCCCOC(C)COC(C)COCCC JWZSJQJEMGTJHC-UHFFFAOYSA-N 0.000 description 1
- UOWSVNMPHMJCBZ-UHFFFAOYSA-N 1-[2-(2-butoxypropoxy)propoxy]butane Chemical compound CCCCOCC(C)OCC(C)OCCCC UOWSVNMPHMJCBZ-UHFFFAOYSA-N 0.000 description 1
- VOIWQNVWCVIHPK-UHFFFAOYSA-N 1-[2-(2-decoxyethoxy)ethoxy]decane Chemical compound CCCCCCCCCCOCCOCCOCCCCCCCCCC VOIWQNVWCVIHPK-UHFFFAOYSA-N 0.000 description 1
- QPHFJZRSMXHTAW-UHFFFAOYSA-N 1-[2-(2-methoxypropoxy)propoxy]butane Chemical compound CCCCOCC(C)OCC(C)OC QPHFJZRSMXHTAW-UHFFFAOYSA-N 0.000 description 1
- HNAGHMKIPMKKBB-UHFFFAOYSA-N 1-benzylpyrrolidine-3-carboxamide Chemical compound C1C(C(=O)N)CCN1CC1=CC=CC=C1 HNAGHMKIPMKKBB-UHFFFAOYSA-N 0.000 description 1
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 1
- FUWDFGKRNIDKAE-UHFFFAOYSA-N 1-butoxypropan-2-yl acetate Chemical compound CCCCOCC(C)OC(C)=O FUWDFGKRNIDKAE-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- ZIKLJUUTSQYGQI-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxypropoxy)propane Chemical compound CCOCC(C)OCC(C)OCC ZIKLJUUTSQYGQI-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- BPIUIOXAFBGMNB-UHFFFAOYSA-N 1-hexoxyhexane Chemical compound CCCCCCOCCCCCC BPIUIOXAFBGMNB-UHFFFAOYSA-N 0.000 description 1
- RERATEUBWLKDFE-UHFFFAOYSA-N 1-methoxy-2-[2-(2-methoxypropoxy)propoxy]propane Chemical compound COCC(C)OCC(C)OCC(C)OC RERATEUBWLKDFE-UHFFFAOYSA-N 0.000 description 1
- FENFUOGYJVOCRY-UHFFFAOYSA-N 1-propoxypropan-2-ol Chemical compound CCCOCC(C)O FENFUOGYJVOCRY-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- UVNSFSOKRSZVEZ-UHFFFAOYSA-N 2-(2-decoxyethoxy)ethanol Chemical compound CCCCCCCCCCOCCOCCO UVNSFSOKRSZVEZ-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- CUDYYMUUJHLCGZ-UHFFFAOYSA-N 2-(2-methoxypropoxy)propan-1-ol Chemical compound COC(C)COC(C)CO CUDYYMUUJHLCGZ-UHFFFAOYSA-N 0.000 description 1
- DJCYDDALXPHSHR-UHFFFAOYSA-N 2-(2-propoxyethoxy)ethanol Chemical compound CCCOCCOCCO DJCYDDALXPHSHR-UHFFFAOYSA-N 0.000 description 1
- XYVAYAJYLWYJJN-UHFFFAOYSA-N 2-(2-propoxypropoxy)propan-1-ol Chemical compound CCCOC(C)COC(C)CO XYVAYAJYLWYJJN-UHFFFAOYSA-N 0.000 description 1
- YGZNPWLHYNXTGF-UHFFFAOYSA-N 2-[2-(2-decoxypropoxy)propoxy]propan-1-ol Chemical compound CCCCCCCCCCOC(C)COC(C)COC(C)CO YGZNPWLHYNXTGF-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- IAUVAUNHQGMRAP-UHFFFAOYSA-N 2-ethoxyethyl acetate;2-methoxyethyl acetate Chemical compound COCCOC(C)=O.CCOCCOC(C)=O IAUVAUNHQGMRAP-UHFFFAOYSA-N 0.000 description 1
- AAMWEWAFFUFOJV-UHFFFAOYSA-N 2-hydroxypropyl propanoate Chemical compound CCC(=O)OCC(C)O AAMWEWAFFUFOJV-UHFFFAOYSA-N 0.000 description 1
- WHFKYDMBUMLWDA-UHFFFAOYSA-N 2-phenoxyethyl acetate Chemical compound CC(=O)OCCOC1=CC=CC=C1 WHFKYDMBUMLWDA-UHFFFAOYSA-N 0.000 description 1
- YEYKMVJDLWJFOA-UHFFFAOYSA-N 2-propoxyethanol Chemical compound CCCOCCO YEYKMVJDLWJFOA-UHFFFAOYSA-N 0.000 description 1
- QMAQLCVJIYANPZ-UHFFFAOYSA-N 2-propoxyethyl acetate Chemical compound CCCOCCOC(C)=O QMAQLCVJIYANPZ-UHFFFAOYSA-N 0.000 description 1
- MPAGVACEWQNVQO-UHFFFAOYSA-N 3-acetyloxybutyl acetate Chemical compound CC(=O)OC(C)CCOC(C)=O MPAGVACEWQNVQO-UHFFFAOYSA-N 0.000 description 1
- HTNUUDFQRYBJPH-UHFFFAOYSA-N 3-methoxypropanehydrazide Chemical compound COCCC(=O)NN HTNUUDFQRYBJPH-UHFFFAOYSA-N 0.000 description 1
- UNDXPKDBFOOQFC-UHFFFAOYSA-N 4-[2-nitro-4-(trifluoromethyl)phenyl]morpholine Chemical compound [O-][N+](=O)C1=CC(C(F)(F)F)=CC=C1N1CCOCC1 UNDXPKDBFOOQFC-UHFFFAOYSA-N 0.000 description 1
- IEAJQNJSHYCMEK-UHFFFAOYSA-N 5-methoxy-2,5-dimethylhexanoic acid Chemical compound COC(C)(C)CCC(C)C(O)=O IEAJQNJSHYCMEK-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical group [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- BKKRCXHXTAMFCJ-UHFFFAOYSA-N C(CCC)OCC(OCC(C)OCCCCCCCCCC)C Chemical compound C(CCC)OCC(OCC(C)OCCCCCCCCCC)C BKKRCXHXTAMFCJ-UHFFFAOYSA-N 0.000 description 1
- APNLEEXMEADBAD-UHFFFAOYSA-N C(CCCC)OC(COC)C Chemical compound C(CCCC)OC(COC)C APNLEEXMEADBAD-UHFFFAOYSA-N 0.000 description 1
- FRGYWHGLCQBTBJ-UHFFFAOYSA-N C(CCCC)OCC(OCC(C)OC)C Chemical compound C(CCCC)OCC(OCC(C)OC)C FRGYWHGLCQBTBJ-UHFFFAOYSA-N 0.000 description 1
- 239000005635 Caprylic acid (CAS 124-07-2) Substances 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 239000004713 Cyclic olefin copolymer Substances 0.000 description 1
- NOOLISFMXDJSKH-UHFFFAOYSA-N DL-menthol Natural products CC(C)C1CCC(C)CC1O NOOLISFMXDJSKH-UHFFFAOYSA-N 0.000 description 1
- YZGQDNOIGFBYKF-UHFFFAOYSA-N Ethoxyacetic acid Natural products CCOCC(O)=O YZGQDNOIGFBYKF-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 108010068370 Glutens Proteins 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 241000779819 Syncarpia glomulifera Species 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RNFAKTRFMQEEQE-UHFFFAOYSA-N Tripropylene glycol butyl ether Chemical compound CCCCOC(CC)OC(C)COC(O)CC RNFAKTRFMQEEQE-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- 239000003146 anticoagulant agent Substances 0.000 description 1
- 229940127219 anticoagulant drug Drugs 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 229940007550 benzyl acetate Drugs 0.000 description 1
- 235000019445 benzyl alcohol Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- PASOAYSIZAJOCT-UHFFFAOYSA-N butanoic acid Chemical compound CCCC(O)=O.CCCC(O)=O PASOAYSIZAJOCT-UHFFFAOYSA-N 0.000 description 1
- OBNCKNCVKJNDBV-UHFFFAOYSA-N butanoic acid ethyl ester Natural products CCCC(=O)OCC OBNCKNCVKJNDBV-UHFFFAOYSA-N 0.000 description 1
- 229940043232 butyl acetate Drugs 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- AJEHNBIPLQJTNU-UHFFFAOYSA-N cyanomethyl acetate Chemical compound CC(=O)OCC#N AJEHNBIPLQJTNU-UHFFFAOYSA-N 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- DIOQZVSQGTUSAI-NJFSPNSNSA-N decane Chemical compound CCCCCCCCC[14CH3] DIOQZVSQGTUSAI-NJFSPNSNSA-N 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- WYACBZDAHNBPPB-UHFFFAOYSA-N diethyl oxalate Chemical compound CCOC(=O)C(=O)OCC WYACBZDAHNBPPB-UHFFFAOYSA-N 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- UYAAVKFHBMJOJZ-UHFFFAOYSA-N diimidazo[1,3-b:1',3'-e]pyrazine-5,10-dione Chemical compound O=C1C2=CN=CN2C(=O)C2=CN=CN12 UYAAVKFHBMJOJZ-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- GFUIDHWFLMPAGY-UHFFFAOYSA-N ethyl 2-hydroxy-2-methylpropanoate Chemical compound CCOC(=O)C(C)(C)O GFUIDHWFLMPAGY-UHFFFAOYSA-N 0.000 description 1
- IJUHLFUALMUWOM-UHFFFAOYSA-N ethyl 3-methoxypropanoate Chemical compound CCOC(=O)CCOC IJUHLFUALMUWOM-UHFFFAOYSA-N 0.000 description 1
- 229940093499 ethyl acetate Drugs 0.000 description 1
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- VAJCYQHLYBTSHG-UHFFFAOYSA-N ethyl n,n-diethylcarbamate Chemical compound CCOC(=O)N(CC)CC VAJCYQHLYBTSHG-UHFFFAOYSA-N 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 230000000762 glandular Effects 0.000 description 1
- 235000021312 gluten Nutrition 0.000 description 1
- 239000001087 glyceryl triacetate Substances 0.000 description 1
- 235000013773 glyceryl triacetate Nutrition 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- VLKZOEOYAKHREP-UHFFFAOYSA-N hexane Substances CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 1
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 235000001510 limonene Nutrition 0.000 description 1
- 229940087305 limonene Drugs 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229940041616 menthol Drugs 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- DIOQZVSQGTUSAI-UHFFFAOYSA-N n-butylhexane Natural products CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229960002446 octanoic acid Drugs 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 239000001739 pinus spp. Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- ILPVOWZUBFRIAX-UHFFFAOYSA-N propyl 2-oxopropanoate Chemical compound CCCOC(=O)C(C)=O ILPVOWZUBFRIAX-UHFFFAOYSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- 229940116423 propylene glycol diacetate Drugs 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- CXWXQJXEFPUFDZ-UHFFFAOYSA-N tetralin Chemical compound C1=CC=C2CCCCC2=C1 CXWXQJXEFPUFDZ-UHFFFAOYSA-N 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229960002622 triacetin Drugs 0.000 description 1
- 229940036248 turpentine Drugs 0.000 description 1
- 229940005605 valeric acid Drugs 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C43/00—Ethers; Compounds having groups, groups or groups
- C07C43/02—Ethers
- C07C43/03—Ethers having all ether-oxygen atoms bound to acyclic carbon atoms
- C07C43/04—Saturated ethers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Wood Science & Technology (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Electroluminescent Light Sources (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
Description
201224074 六、發明說明： 【發明所屬之技術領域】 本發月係關於一種溶劑或溶劑組成物，其係難吸濕 且具優越之樹脂溶解性、於藉印刷法而形成圖案之際所 使用。 【先前技術】 習知之配線基板或顯示器等之電子零件的圖案形成 大多為利用所謂的光刻之方法所形成。光刻係將糊組成 物塗布於基板上，進行微細圖案之曝光後烘烤利用蝕 刻而去除不要之部分後進行圖案形成之方法。但是一般 而言，問題係由於必須具有蝕刻廢液處理設備，裝置本 身變彳于龐大，且必須具有巨額之設備投資，材料之使用 效率也差，由於製造步驟多而導致生產性差。另外，由 於受裝置之容量所限制，對大面積基板難以形成圖案。 因此，近年來圖案形成方法並不需要龐大的裝置且 材料之使用效率佳，也容易對應於大面積基板的喷墨 法、網板印刷法、凸版印刷法、膠版印刷法、照相凹版 印刷法、微接觸印刷法、奈米印跡法等之印刷法而受到 矚目。可用於印刷法之糊組成物所使用的溶劑大多為使 用二乙二醇二曱基趟或二乙二醇二丁基醚等之二乙二醇 二炫基謎，或一丙一醇二甲基醚、二丙二酵二丁基趟等 之二丙二醇二烷基醚之例子。但是，由於二乙二醇二曱 基醚或二乙二醇二丁基醚等之二乙二醇二烷基醚係具有 生態毒性，故有不便使用之問題（非專利文獻丨）。 -4- 201224074 另一方面 組成物中，二 獻1 );於專 二丙二醇二丁 另外，於 元件、及電子 醇二甲基醚當 先前技術文獻 專利文獻 專利文獻1 專利文獻2 專利文獻3 專利文獻4 專利文獻5 非專利文獻 非專利文獻1 二醇二甲基g (2002 ) 【發明内容： 〔發明所欲解 得知二丙 由於二丙二醇 成太陽能電池 發光元件之元 有使元件劣化 ’習知於形成構成太陽能電池之元件的糊 丙二醇二烷基醚係當做溶劑使用（專利文 利文獻2中，尤其已記載使用親油性強的 基。 形成構成有機薄膜電晶體、有機電致發光 紙之元件的糊組成物中，習知係將二丙二 做溶劑所使用（專利文獻3、4、5)。 曰本特開2010-132736號公報 曰本特開2008-243600號公報 國際公開W02009-098996號公報 曰本特開2010-103 105號公報 曰本特開2009-090662號公報 國際化學物質簡潔評估文件No.4 1二乙 电（Diethylene Glycol Dimethyl Ether ) 決之問題〕 二醇二烷基醚係具優越之揮發性，但尤其 二甲基醚係親水性高且容易吸濕，若於形 、有機薄膜電晶體、電子紙、或有機電致 件圖案的糊組成物中當做溶劑使用時，將 之虞，另一方面’二丙二醇二丁基醚係覩 -5- 201224074 油性高且吸濕性低，但由於糊組成物中所含有的乙基纖 維素或丙烯酸樹脂等之黏著劑樹脂的溶解性低，難以當 做印刷用溶劑使用。 因而’本發明之目的係在於提供一種黏著劑樹脂等 之樹脂添加物之溶解性高且吸濕性低的太陽能電池、有 機薄膜電晶體、電子紙、或有機電致發光元件（例如顯 不器、照明等）圖案印刷用溶劑或溶劑組成物。 本發明之其他目的係提供一種含有該太陽能電池、 有機薄膜電晶體、電子紙、或有機電致發光元件之圖案 印刷用溶劑或溶劑組成物之太陽能電池、有機薄膜電晶 體、電子紙、或有機電致發光元件的圖案形成用糊組成 物。 另外’本發明之其他目的係在提供一種使用該太陽 能電池、有機薄膜電晶體、電子紙、或有機電致發光元 件的圖案形成用糊組成物而進行圖案形成之圖案形成方 法。 〔解決問題之手段〕 本發明人等係為了解決上述問題而鑽研探討之結果 發現：二丙二醇二烷基醚之一側末端烷基為曱基，且另 一側末端院基為直鏈狀或分枝鏈狀烷基之c35烷基的化 合物係具優異的樹脂添加物之溶解性、及吸濕性的均 衡；若於形成構成太陽能電池、有機薄膜電晶體、電子 紙、或有機電致發光元件之元件圖案之際，將該化合物 當做溶劑使用時，能夠藉印刷法而對進行元件圖案之形 成發揮充分之黏著劑樹脂溶解性；且能夠藉吸濕而形成 -6 - 201224074 難以劣化之元件。 者0 本發明係基於此等之見解而使其完成 後：二月係提供一種太陽能電池、有機薄膜電 曰曰體c以後有稱為「右媳TT7T + & y、 有機TFT」之情形）、電 有機電致發光元件（以後有稱為「有機EL元件」之情形) =印刷用溶劑或溶劑組成物（以後，有簡稱為「圖 案印刷用溶劑或溶劑組成物」之情形），其係用於藉印 刷法而形成構成太陽能電池、有機tft、電子紙、或有 機：L兀一件之兀件圖案之際的溶劑或溶劑組成物丨其特徵 ^含有-丙二醇二烧基喊之二個末端烧基之—側為甲 基，另一侧為碳數3 φ + ,,,, 人& 至5之直鏈狀或分枝鏈狀烷基的化 合物。 、汶印刷法較佳為由喷墨法、網板印刷法、凸版印刷 法膠版印刷法、照相凹版印刷法、微接觸印刷法、夺 米印跡法所構成之群組中所選出的至少一種方法。〃 另外’本發明更提供_種至少含有該圖案印刷用溶 劑或〉谷劑組成拍2 1¾ , 取物與黏者劑樹脂之太陽能電池、有機 TFT電子紙、或有機EL元件之圖案形成用糊組成物（以 後，有簡稱為「圖案形成用糊組成物」之情形）。 該黏著劑樹脂較佳為纖維素系樹脂及/或丙烯酸系 a f外，本發明更提供—種圖案形成方法，其係構成 太陽此電池、有機TFT、電子紙、或有機£L·元件之元件 的圖案形成方法；其特徵為具有：藉由利用印刷法將該 圖案形成用糊組成物塗布於基板上而形成圖案層之步 驟，與硬化或燒製該圖案層之步驟。 201224074 〔發明之效果〕 由於本發明之圖案印刷用溶劑或溶劑組成物係含有 上述一丙二醇一烧基鍵之一個末端烧基之一側為子基， 另一側為碳數3至5之直鏈狀或分枝鏈狀烷基的化合 物，具優越之黏著劑樹脂等之樹脂添加物的溶解性，男 外，吸濕性極低。 因此 本發明之含有圖案印 之圖案形成用糊組成物，即使對於大面積及/或可撓性3 基板，藉印刷法也能夠有效地均勻塗布，於構成太陽食 電池、有機TFT、電子紙、或有機EL元件之元件的製y 中，能夠高精確度地形成微細之元件圖案。另外，由方 難吸濕，錢㈣㈣氣所造成的元件之劣化。 【實施方式】 〔用於實施發明之形態〕 〔圖案印刷用溶劑或溶劑組成物〕 有關本發明之圖幸试丨 益c '、卩刷用〉谷劑或溶劑組成物係用旅 . 太除肊電池、有機TFT、電子紙、 或有機EL元件之元俥圓安 ^ n ^ 圖案之際的溶劑或溶劑組成物；其 ψ «. 一 "°基醚之二個末端烷基之一側為 Τ基，另一側為碳數3 化人物 ^之直鏈狀或分枝鏈狀烷基的 例如 版印刷法 法、奈米 ’ s玄印刷法可叛加.i 舉例.噴墨法、網板印刷法、凸 、膠版印刷法 Β3 α 、.、，'相凹版印刷法、微接觸印刷 印跡法等。 "8 - 201224074 在二丙二醇二烷基醚之末端烷基的碳數3至5之直 鏈狀或分枝鏈狀烷基，例如，可舉例：正丙基、正丁基、 正戊基等之直鏈狀烷基；異丙基、異丁基、二級丁基、 三級丁基、異戊基、二級戊基、三級戊基等之分枝鍵狀 烷基。於本發明中，其中較佳為碳數3至5的直鍵狀烧 基，尤其基於容易供應原料之觀點，較佳為正丙基、正 丁基、正戊基。 在本發明之二丙一醇二烧基縫之二個末端燒基之一 側為甲基，另一側為碳數3至5之直鏈狀或分枝鏈狀烧 基的化合物’例如，可舉例：二丙二醇甲基正丙基趟、 二丙二醇曱基正丁基醚、二丙二醇甲基正戊基醚等。此 等可單獨地使用’亦可混合二種以上而使用。 另外，有關本發明之圖案印刷用溶劑或溶劑組成物 較佳為採取親水性與親油性均衡者，例如含水率較佳為 3%以下（其中’更佳為15%以下）。若含水率超過上述 範圍時，將有使得使用有關本發明之圖案印刷用溶劑或 溶劑組成物所形成的元件變得容易劣化之傾向。 另外’有關本發明之圖案印刷用溶劑或溶劑組成物 較佳為乙基纖維素等之具優越之樹脂添加物的溶解性， 例如較佳為溶解5重量。/〇以上乙基纖維素。若乙基纖維 素等之樹脂添加物的溶解量低於上述範圍時，將有黏度 變得過低且觸變性及印刷物之形狀安定性不足之傾向。 除了上述二丙二醇二烷基醚以外，本發明之圖案印 刷用溶劑或溶劑組成物係在不損害親水性或親油性之均 衡的範圍内，視需要亦可混合其他溶劑後使用。其他溶 劑的摻合比例能夠適當選擇。 201224074 其他溶劑能夠使用在印刷用途一般所用之溶劑，例 如，可舉例：己酸、辛酸等之羧酸類；異丙醇、1 -辛醇、 1-壬醇、苄醇等之醇類；乙二醇單甲基醚、乙二醇單乙 基醚、乙二醇單丙基醚、乙二醇單丁基醚等之乙二醇單 烷基醚類；乙二醇單甲基醚乙酸酯、乙二醇單乙基醚乙 酸酯、乙二醇單丙基醚乙酸酯、乙二醇單丁基醚乙酸酯、 乙二醇單苯基醚乙酸酯等之乙二醇單烷基醚乙酸酯類； 二乙二醇單曱基醚、二乙二醇單乙基醚、二乙二醇單丙 基醚、二乙二醇單丁基醚等之二乙二醇單烷基醚類；二 乙二醇單乙基醚乙酸酯、二乙二醇單丁基醚乙酸酯等之 二乙二醇單烷基醚乙酸酯類；二乙二醇二曱基醚、二乙 二醇二乙基醚等之二乙二醇二烷基醚類；苄基乙基醚、 二己基醚、四氫呋喃等之其他醚類；丙二醇單甲基醚乙 酸酯、丙二醇單乙基醚乙酸酯、丙二醇單丁基醚乙酸酯 等之丙二醇單烷基醚乙酸酯類；二丙二醇甲基醚乙酸酯 等之二丙二醇單烷基醚乙酸酯類；丙二醇丙基醚、丙二 醇丁基醚等之丙二醇單烷基醚類；二丙二醇甲基醚、二 丙二醇丙基醚、二丙二醇丁基醚等之二丙二醇單烷基醚 類；三丙二醇曱基醚、三丙二醇丁基醚等之三丙二醇單 烷基醚類；丙二醇曱基丙基醚、丙二醇甲基丁基醚、丙 二醇甲基戊基醚等之丙二醇二烷基醚類；二丙二醇二甲 基醚、二丙二醇二乙基醚等之上述以外之二丙二醇二烧 基醚類；三丙二醇二甲基醚等之三丙二醇二烷基醚類； 丙二醇二乙酸酯、1，3-丁二醇二乙酸酯、1,6-己二醇二乙 酸酯、1，4- 丁二醇二乙酸酯等之二乙酸酯類；環己醇乙 -10- 201224074 酸酯、3 -曱氧基丁基乙酸酯、乳酸乙基乙酸酯、甘油三 乙酸酯、乙酸二氫萜品酯等之其他乙酸酯類；丙酮、甲 基乙基酮、甲基異丁基酮、丙_基丙®51、環己酮、異佛 酮、2-庚酮、3-庚酮等之酮類；2_羥基丙酸甲酯、2-輕基 丙酸乙酯、乙酸苄酯、乙基乙醯基乳酸酯、安息香酸乙 酯、草酸二乙酯、順丁烯一尿酸二乙酯、T- 丁内酯、碳 酸乙烯酯、碳酸丙烯酯、2-羥基-2_甲基丙酸乙酯、3_甲 氧基丙酸甲酯、3 -甲氧基丙酸乙醋、3_乙氧基丙酸甲略、 3-乙氧基丙酸乙酯、乙氧基乙酸乙醋、經基乙酸乙贿、 2 -經基-3-甲基丁酸甲醋、3 -甲基曱氧丁基乙酸g旨、心 甲氧丁基乙酸酯、3 -甲基-3 -甲氧丁基丙酸酯、乙酸乙顆、 乙酸丙S旨、乙酸丁自旨、甲酸戊醋、乙戊醋、内酸丁酸、 丁酸乙酯、丁酸丙酯、丁酸丁醋、丙_酸甲酯、丙_酸 乙酯、丙酮酸丙酯、乙醯乙酸甲酯、乙醯乙酸乙酯、2_ 羰基丁酸乙酯等之酯類；甲苯、二甲苯等之芳香族烴類； Ν-曱基吡咯啶酮、Ν，Ν·二甲基曱醯胺、Ν，Ν-二甲基乙酿 胺等之醯胺類；蔥品醇、二氫蔥品醇、丙酸二氫蔥品g旨、 檸檬烯、萜烷、薄荷腦等之萜烯類；礦油精、石油輕、、由 S -1 0 0、石油輕油S -1 5 0、四氫萘、松節油等之古、· A咖 J〜冋那點溶 劑等。 〔圖案形成用糊組成物〕 有關本發明之圖案形成用糊組成物，其特徵為至，丨、 含有上述圖案印刷用溶劑或溶劑組成物與黏著劑樹脂。 黏著劑樹脂並未予以特別限定，能夠使 能電池、有機TFT、電子 或有機EL元件的元件之形 201224074 成所使用的習用之樹脂’例如’可舉例：甲基纖維素、 乙基纖維素、羥基纖維素、甲基羥基纖維素等之纖維素 系樹脂；丙烯酸系樹脂、聚乙烯乙酸酯、聚乙烯醇等之 乙稀樹脂等。此等能夠單獨地或混合二種以上而使用。 於本發明中，其中基於塗布時之版剥離性佳且具優越之 觸變性及印刷物之形狀安定性之觀點，較佳為使用纖維 素糸樹脂。 圖案形成用糊組成物中之上述圖案印刷用溶劑或溶 劑組成物之含量，例如為】至99重量％左右，較佳為3 至75重量％左右。若圖案印刷用溶劑或溶劑組成物之含 量低於上述範圍時’將有圖案形成用糊組成物之黏度變 得過高且用於印刷用途變得困難之傾向。另一方面，若 圖案印刷用溶劑或溶劑組成物之含量超過上述範圍時， 將有乾燥費時、作業效率降低之傾向。 圖案形成用糊組成物中之黏著劑樹脂之含量，例如 ，至15重量％左右’較佳為i至ι〇重量％左右。若 . _ 、上这範圍時，將有觸變性及印刷 物之形狀安定性不足之傾向· 今& 貝向，另一方面，若黏著劑樹脂 之含量超過上述範圍時，腺女 將有黏度變得過高而當做印刷 用使用變得困難之傾向。 有關本發明之圖牵开彡士、m , Ά „ /、形成用糊組成物亦可為發現導彳 機忐、絕緣機能、半導體撼 千导體機忐中之任-種，除上述之外 也可以摻合其他添加物。 具他添加物，例如，可舉例 金屬氧化物、介電體扭粗您 TFT 枓4之金屬材料；顏色發光材料 ，機TFT材料、莫蛩敁人 電丨生同^刀子材料、離子導體材料、 分混攪、均勻分散而能夠調製。 由於有關本發明之圖案形成用糊組成物係藉由利 印刷法塗布於基材等之上而能夠形成圖案，故能夠容 201224074 機-無機混雜離子導體妯 消泡劑、安定劑、抗氧化、有機或無機顏料、分散齊 充劑、紫外線吸收劑、二硬化加速劑、增感劑、 换人旦炎 抗凝聚劑等。只要其他添加物 為不損害本發明之效果的範圍内即彳，例如整 圖案形成用糊組成物之0,至99重量％左右。 有關本發明之圖案形成用糊組成物係例如藉由使 混合搜拌機等之㈣裝置而摻合上述圖案印刷用溶劑 冷Μ，.且成物、黏著劑樹脂、及視需要之其他添加物後 而有效且廉價地在大面積且可撓性的基板表面上形成 件0 〔圖案形成方法〕 有關本發明之圖案形成方法係構成太陽能電池、 機TFT、電子紙、或有機EL元件之元件圖案形成方法 其特徵為具有藉由利用印刷法，將上述圖案形成用糊 成物塗布於基板上而形成圖案層之步驟（圖案印刷 驟）；及使該圖案層硬化或燒製之步驟（圖案硬化或 製步驟）。 另外，在圖案印刷步驟中之印刷法’可舉例：由 墨法、網板印刷法、凸版印刷法、膠版印刷法、照相 版印刷法、微接觸印刷法、奈米印跡法所構成之群組 所選出的至少一種方法。 填 之 體 用 或 充 用 易 元 有 組 步 燒 喷 凹 中 -13- 201224074 利用上述印刷法所形成的圖案層係藉由進行乾燥， 其後進行加熱處理及/或光照射而能夠使其硬化。另外乾 燥後，亦可不使其硬化而進行燒製。乾燥方法，例如， 可舉例：在8 0至2 0 〇它左右之溫度，例如加熱〇 · 1至3 小時左右之方法等。進行加熱處理之情形，其溫度係按 照供給反應之成分或觸媒之種類等而能夠適當調整，例 如為5 0至2 0 0 C左右。另外，加熱時間係例如〇. 5至3 小時左右。進行光照射之情形，其光源能夠使用例如水 銀燈、氣燈、碳弧燈、金屬鹵化物燈、陽光、電子線、 雷射光等。光照射時間例如為〇 5至3 〇分鐘左右。進行 燒製之情形，燒製溫度例如為2〇〇至15〇(rc左右。另外， 燒製時間例如為〇 · 1至5小時左右。 利用上述方法所獲得的圖案層厚度係按照用途而能 夠適當調整，例如為數nm至2〇〇 μιη左右。 形成圖案層之基板較佳為具有耐熱性及耐溶劑性， 例如，可舉例：聚對苯二曱酸乙二酯、聚萘二甲酸乙二 酉曰聚知、聚乙烯、聚丙烯、聚苯乙稀、聚醯胺、聚酿 亞胺、聚乙烯醇、聚乙烯縮丁醛、聚氯乙烯、聚偏二氣 乙稀、聚IL乙烯等之含氟樹脂；聚碳酸酯、丙烯酸樹脂、 曱基丙烯酸樹脂、環烯烴共聚物、導電性聚合物、耐綸、 纖維素、玻璃、ITO等。基板厚度例如為〇_1至50 mm 左右。 ^ 一般而言’太陽能電池（尤其’有機太陽能電池） 係具有包含η型半導體層與p型半導體層之光電轉換層 被光射入側電極（主線電極及指狀電極所構成）與背面 側電極所夾住之構造。 -14- 201224074 太陽能電池能夠利用例如下列方法而製造。若根據 有關本發明之圖案形成方法，能夠精確度佳地形成構成 太陽能電池之元件。 1 :藉印刷法而形成將B (硼原子）等當做雜質所添 加的p型半導體。 2:在所獲得的p型半導體表面實施紋理（凹凸）加 工之後，藉印刷法而積層將p (碟原子）等當做雜質所 添加的η型半導體。 3·在ρ型半導體表面形成氮化矽、氧化鈦等之抗反 射膜。 4 ·藉印刷法而在η型半導體表面形成主線電極與指 狀電極（光射入側電極）。 一般而言，有機TFT係由電極層（閘極層、源極層、 汲極層）及有機半導體層所構成。若根據有關本發明之 圖案形成方法的話，能夠精確度佳地形成構成有機τρτ 之元件。 -般而言’電子紙係具有顯示層與控制此顯示層之 驅動層被基板所夾住之構造。而且，藉由驅動層採用上 述有機TFT而能夠實現可撓性的顯示器。 -般而言’有機杜元件係具有—層至多層所構成的 發先層被一個電陽極、陰極）所夾住之構造。 有機EL·元件係例如經由 關本發明之圖案形成方法，能夠製造。若根據有 機ELM之元b 以精確度佳地形成構成有 201224074 1 :在玻璃等之基板上形成陽極。 2:在玻璃等之基板上之形成陽極之 形成隔壁。 3 :在陽極上’藉印刷法而形成紅、 之發光層後使其硬化。 4:在發光層及隔壁之上形成陰極。 由於有關本發明之圖案形成方法係 夠以非接觸之狀態而對基板形成圖案， 及/或可撓性基板也容易地進行圖案形成 構成太陽能電池、有機TFT、電子紙、今 元件的製造中’能夠高精確度地形成微 另外，不經由作成遮罩等之複雜的步驟 繪，無須使用微細之加工技術。而且， 環境下製造。因此’能夠大幅簡化製程 減製造成本。 〔實施例〕 以下，藉實施例而更具體說明本發 不受此等之實施例所限定。 實施例1 將二丙二醇甲基正丁基醚（商品名「 化學工業股份有限公司製，以後有稱為 形）20 g、蒸餾水20 g倒入5〇 燒瓶t 鐘後’靜置1 0分鐘’進行有機相之水 環境下之水分濃度為〇.9〇/。。201224074 VI. Description of the Invention: [Technical Field] The present invention relates to a solvent or a solvent composition which is difficult to absorb moisture and has excellent resin solubility and is used when forming a pattern by a printing method. [Prior Art] Conventional pattern formation of electronic components such as a wiring board or a display is often formed by a so-called photolithography method. Photolithography is a method in which a paste composition is applied onto a substrate, and a fine pattern is exposed and baked, and an unnecessary portion is removed by etching to form a pattern. However, in general, the problem is that the apparatus itself has a large amount of equipment investment due to the necessity of having an etching waste liquid processing apparatus, and the use efficiency of the material is also poor, resulting in poor productivity due to many manufacturing steps. In addition, it is difficult to form a pattern for a large-area substrate due to the limitation of the capacity of the device. Therefore, in recent years, the pattern forming method does not require a bulky device and the material is used efficiently, and it is also easy to correspond to a large-area substrate inkjet method, screen printing method, letterpress printing method, offset printing method, gravure printing method, The printing method such as the microcontact printing method and the nanoimprint method has been attracting attention. Most of the solvents used in the paste composition which can be used in the printing method are diethylene glycol diamyl radicals such as diethylene glycol dimercaptopurine or diethylene glycol dibutyl ether, or monopropyl alcohol Examples of dipropylene glycol dialkyl ethers such as alkyl ether, dipropylene glycol dibutyl hydrazine. However, since diethylene glycol dialkyl ethers such as diethylene glycol dimethyl ether or diethylene glycol dibutyl ether are ecotoxic, they are inconvenient to use (Non-Patent Document 丨). -4- 201224074 On the other hand, in the composition, two are given 1); in the second propylene glycol dibutyl, in the element, and the electronic alcohol dimethyl ether, the prior art document patent document patent document 1 patent document 2 patent document 3 patent Document 4 Patent Document 5 Non-Patent Document Non-Patent Document 1 Glycol Dimethyl G (2002) [Summary of the Invention] [The invention aims to understand that dipropylene has a component of a solar cell light-emitting element due to dipropylene glycol. It is known that a propylene glycol dialkyl ether which forms an element constituting a solar cell is used as a solvent. (Patent Document 2 discloses that a oleophilic group is particularly used. Forming an organic thin film transistor, an organic electroluminescent paper. In the paste composition of the device, it is conventionally used as a solvent for dipropylene (Patent Documents 3, 4, and 5). JP-A-2010-132736, JP-A-2008-243600, International Publication No. WO2009- 098996 曰本特开2010-103 105号曰本特开2009-090662号 International Chemical Substance Concise Evaluation Document No.4 1 Diethylene Glycol Dimethyl Ether The problem is that the diol dialkyl ether has superior volatility, but especially the dimethyl ether is highly hydrophilic and easily absorbs moisture, such as in shape, organic thin film transistor, electronic paper, or organic electro-transistor. When the solvent composition of the pattern is used as a solvent, it is rubbed. On the other hand, 'dipropylene glycol dibutyl ether system 覩-5- 201224074 is high in oiliness and low in hygroscopicity, but is contained in the ethyl ester contained in the paste composition. The adhesive resin such as cellulose or acrylic resin has low solubility and is difficult to use as a solvent for printing. Therefore, the object of the present invention is to provide a resin additive such as an adhesive resin which has high solubility and low hygroscopicity. A solvent or a solvent composition for pattern printing of a solar cell, an organic thin film transistor, an electronic paper, or an organic electroluminescence device (for example, a display, illumination, etc.). Another object of the present invention is to provide a solar cell, an organic film, and the like. A solar cell, an organic thin film transistor, an electronic paper, or an organic solvent or solvent composition for pattern printing of a transistor, an electronic paper, or an organic electroluminescence device Further, the other object of the present invention is to provide a paste composition for pattern formation using the solar cell, the organic thin film transistor, the electronic paper, or the organic electroluminescence device. The method of forming a pattern is formed. [Means for Solving the Problem] The inventors of the present invention have intensively studied to solve the above problems and found that one terminal alkyl group of dipropylene glycol dialkyl ether is a mercapto group and the other end is The compound having a linear or branched chain alkyl c35 alkyl group has an excellent balance of solubility and hygroscopicity of the resin additive; if the solar cell, the organic thin film transistor, and the electron are formed When the film or the element pattern of the organic electroluminescence device is used as a solvent, it is possible to exhibit sufficient solubility of the adhesive resin by the printing method to form the element pattern; and it can be formed by moisture absorption- 6 - 201224074 Components that are difficult to degrade. The present invention is based on the findings of the above-mentioned inventions: in February, a solar cell, an organic thin film, and an organic thin film electro-cylinder c are referred to as "right-handed TT7T + & y, organic TFT". Electro-organic electroluminescent device (hereinafter referred to as "organic EL device") = solvent or solvent composition for printing (hereinafter, simply referred to as "solvent or solvent composition for pattern printing") A solvent or solvent composition for forming a solar cell, an organic tft, an electronic paper, or an organic: L兀 piece by a printing method, characterized in that it contains two-propylene glycol dialkyl The terminal group is a methyl group on the side, and the other side is a compound having a carbon number of 3 φ + , , , , a human or a straight chain or a branched chain alkyl group of 5. And the printing method is preferably at least one selected from the group consisting of an inkjet method, a screen printing method, a letterpress printing offset printing method, a gravure printing method, a microcontact printing method, and a rice blotting method. . 〃 In addition, the present invention further provides a pattern forming paste for a solar cell, an organic TFT electronic paper, or an organic EL element, which contains at least the solvent for pattern printing or the composition of the granules. The composition (hereinafter, referred to simply as "the composition for forming a paste"). The adhesive resin is preferably a cellulose resin and/or an acrylic af. The present invention further provides a pattern forming method for forming a solar cell, an organic TFT, an electronic paper, or an organic component. A pattern forming method comprising the steps of: forming a pattern layer by applying the pattern forming paste composition onto a substrate by a printing method, and curing or firing the pattern layer. 201224074 [Effects of the Invention] The solvent or solvent composition for pattern printing of the present invention contains one of the terminal groups of the above-mentioned one propylene glycol-alkyl group as a subgroup, and the other side has a carbon number of 3 to 5. The compound of a chain or branched chain alkyl group has a solubility of a resin additive such as a superior adhesive resin, and is extremely low in hygroscopicity. Therefore, the paste composition for pattern formation containing the pattern printing of the present invention can be uniformly applied uniformly by a printing method even for a large-area and/or flexible three-substrate, thereby constituting a solar food cell, an organic TFT, an electronic paper, In the y of the element of the organic EL element, a fine element pattern can be formed with high precision. In addition, it is difficult to absorb moisture, and the deterioration of components caused by money (4) (4) gas. [Embodiment] [Formation for Carrying Out the Invention] [Solvent or Solvent Composition for Pattern Printing] About the drawings of the present invention, it is a good idea to use c', brushing, gluten or solvent composition. a solvent or a solvent composition of a tantalum battery, an organic TFT, an electronic paper, or an organic EL element, and a side of the two terminal alkyl groups of the «. one " It is a thiol group, and the other side is a linear or branched chain alkyl group having a carbon number of 3, for example, a printing method, a nano's printing method, a rebellion, an example, an inkjet method, Screen printing method, convex, offset printing method Β 3 α , . , , 'phase gravure printing method, micro contact printing and printing method. "8 - 201224074 A linear or branched chain alkyl group having a carbon number of 3 to 5 at the terminal alkyl group of dipropylene glycol dialkyl ether, for example, n-propyl group, n-butyl group, n-pentyl group a linear alkyl group; a branched alkyl group such as an isopropyl group, an isobutyl group, a secondary butyl group, a tertiary butyl group, an isopentyl group, a second pentyl group or a tertiary pentyl group. In the present invention, among them, a direct bond-shaped alkyl group having a carbon number of 3 to 5 is preferable, and a n-propyl group, a n-butyl group or a n-pentyl group is preferred, in particular, from the viewpoint of easily supplying a raw material. In the dipropyl alcohol dialkyl base of the present invention, one of the two terminal alkyl groups is a methyl group, and the other side is a compound having a linear or branched chain alkyl group having a carbon number of 3 to 5, for example, For example, dipropylene glycol methyl n-propyl fluorene, dipropylene glycol decyl n-butyl ether, dipropylene glycol methyl n-pentyl ether, and the like can be given. These may be used singly or in combination of two or more. Further, the solvent or solvent composition for pattern printing of the present invention preferably has a balance of hydrophilicity and lipophilicity, and for example, the water content is preferably 3% or less (wherein 'more preferably 15% or less). When the water content exceeds the above range, there is a tendency that the element formed by using the solvent or solvent composition for pattern printing of the present invention is easily deteriorated. Further, the solvent or solvent composition for pattern printing of the present invention is preferably a solubility of a superior resin additive such as ethyl cellulose. For example, it is preferably dissolved in 5 parts by weight. / 乙基 above ethyl cellulose. When the amount of the resin additive such as ethyl cellulose is less than the above range, the viscosity tends to be too low, and the thixotropic property and the shape stability of the printed matter tend to be insufficient. In addition to the above-mentioned dipropylene glycol dialkyl ether, the solvent or solvent composition for pattern printing of the present invention may be used in an amount which does not impair the balance of hydrophilicity or lipophilicity, and may be mixed with other solvents as needed. The blending ratio of other solvents can be appropriately selected. 201224074 Other solvents can be used in the solvent generally used for printing purposes, for example, carboxylic acids such as caproic acid and caprylic acid; alcohols such as isopropanol, 1-octanol, 1-nonanol and benzyl alcohol; Ethylene glycol monoalkyl ethers such as alcohol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether; ethylene glycol monomethyl ether acetate Ethylene glycol monoethyl ether acetate, ethylene glycol monopropyl ether acetate, ethylene glycol monobutyl ether acetate, ethylene glycol monophenyl ether acetate, etc. Alkyl ether acetates; diethylene glycol monoalkane such as diethylene glycol monodecyl ether, diethylene glycol monoethyl ether, diethylene glycol monopropyl ether, diethylene glycol monobutyl ether, etc. Diethyl glycol monoalkyl ether acetates such as diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate; diethylene glycol didecyl ether, Diethylene glycol dialkyl ethers such as diethylene glycol diethyl ether; other ethers such as benzyl ethyl ether, dihexyl ether, tetrahydrofuran, etc.; propylene glycol monomethyl ether acetate, propylene glycol monoethyl Ether acetate, a propylene glycol monoalkyl ether acetate such as propylene glycol monobutyl ether acetate; a dipropylene glycol monoalkyl ether acetate such as dipropylene glycol methyl ether acetate; propylene glycol propyl ether, propylene glycol butyl ether or the like a propylene glycol monoalkyl ether; a dipropylene glycol monoalkyl ether such as dipropylene glycol methyl ether, dipropylene glycol propyl ether or dipropylene glycol butyl ether; a tripropylene glycol single such as tripropylene glycol decyl ether or tripropylene glycol butyl ether; Alkane ethers; propylene glycol dialkyl ethers such as propylene glycol decyl propyl ether, propylene glycol methyl butyl ether, propylene glycol methyl amyl ether; dipropylene glycol dimethyl ether, dipropylene glycol diethyl ether, etc. a dipropylene glycol dialkyl ether; a tripropylene glycol dialkyl ether such as tripropylene glycol dimethyl ether; propylene glycol diacetate, 1,3-butanediol diacetate, 1,6-hexane Diacetate such as alcohol diacetate or 1,4-butanediol diacetate; cyclohexanol B-10-201224074 acid ester, 3-methoxybutyl butyl acetate, ethyl lactate Other acetates such as acid esters, triacetin, dihydrofurfuryl acetate; acetone, methyl Ketones such as ethyl ketone, methyl isobutyl ketone, propyl propyl acrylate 51, cyclohexanone, isophorone, 2-heptanone, 3-heptanone, etc.; 2-hydroxypropyl propionate, 2- Ethyl light propionate, benzyl acetate, ethyl ethyl lactate, ethyl benzoate, diethyl oxalate, diethyl urethane, T-butyrolactone, ethylene carbonate, carbonic acid Propylene ester, ethyl 2-hydroxy-2-methylpropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, 3-methoxypropionic acid, 3-ethoxy Ethyl propyl propionate, ethoxyacetic acid ethyl vinegar, transacetic acid ethyl brie, 2-methoxy-3-methylbutyric acid methyl vinegar, 3-methyl methoxy butyl acetate, g-methoxybutyl Acetate, 3-methyl-3-methoxybutylpropionate, ethyl acetate, acetonitrile acetate, butyl acetate, valeric acid, ethyl acetate, butyric acid, ethyl butyrate , esters of butyl butyrate, butyric acid butyrate, methyl acrylate, ethyl acrylate, propyl pyruvate, methyl acetate, ethyl acetoacetate, ethyl 2-carbonyl carboxylate An aromatic hydrocarbon such as toluene or xylene; Ν-decyl pyrrolidone, hydrazine, hydrazine dimethyl decylamine醯, Ν-dimethyl ethamine and other guanamines; onion alcohol, dihydro onion alcohol, propionic acid dihydro onion product, limonene, decane, menthol, etc. terpenes; mineral oil Fine, oil light, from S -1 0 0, petroleum light oil S -1 50, tetrahydronaphthalene, turpentine and other ancient, · A coffee J ~ 冋 point solvent. [Pattern-forming composition for pattern formation] The paste composition for pattern formation of the present invention is characterized in that it contains the solvent or solvent composition for pattern printing and an adhesive resin. The adhesive resin is not particularly limited, and a conventional resin which can be used for a battery, an organic TFT, an electronic or organic EL element, for example, 201224074 can be exemplified by methyl cellulose, ethyl cellulose, A cellulose resin such as hydroxy cellulose or methyl hydroxy cellulose; an ethylene resin such as an acrylic resin, polyvinyl acetate or polyvinyl alcohol. These can be used individually or in mixture of 2 or more types. In the present invention, it is preferred to use a cellulose enamel resin from the viewpoint of excellent peelability at the time of coating and excellent thixotropy and shape stability of a printed matter. The content of the solvent or solvent composition for pattern printing in the pattern forming paste composition is, for example, about 99% by weight, preferably about 3 to 75% by weight. When the content of the solvent or solvent composition for pattern printing is less than the above range, the viscosity of the paste composition for pattern formation becomes too high and it tends to be difficult for printing applications. On the other hand, when the content of the solvent or solvent composition for pattern printing exceeds the above range, drying and time consuming tend to be lowered. The content of the adhesive resin in the paste composition for pattern formation is, for example, about 15% by weight or less, preferably about i to ι by weight. If _, above this range, there will be a tendency for thixotropy and the shape stability of the printed matter to be insufficient. Now & Beifang, on the other hand, if the content of the adhesive resin exceeds the above range, the glandular woman will have viscosity change. It is a tendency to become difficult to use for printing. The drawing relating to the present invention retracts the gentleman, m, Ά „, and the composition for forming the paste may also be any one of the founding enthalpy, the insulating function, and the semiconductor 撼 导体 导体 , , , It is also possible to blend other additives. For example, metal oxides, dielectric materials for twisting your TFT 枓4 metal materials, color luminescent materials, TFT materials, Mohs electricians ^Knife material, ionic conductor material, sub-mixing, and uniform dispersion can be prepared. Since the paste composition for pattern formation according to the present invention can be formed by patterning on a substrate or the like by a printing method, it is possible to accommodate 201224074. Machine-inorganic hybrid ionic conductor 妯 defoamer, stabilizer, antioxidant, organic or inorganic pigment, dispersing agent, UV absorber, two hardening accelerator, sensitizer, substitution of anti-coagulant, etc. Other additives are in the range which does not impair the effect of the present invention, for example, from 0 to 99% by weight of the paste composition for forming a whole pattern. The paste composition for pattern formation of the present invention is made, for example, by (4) The device is mixed with the solvent for the pattern printing, and the substrate, the adhesive resin, and other additives as needed are effectively and inexpensively used in a large-area and flexible substrate. Forming member 0 on the surface [Pattern forming method] The pattern forming method of the present invention is a method of forming an element pattern of a solar cell, a TFT, an electronic paper, or an organic EL element, which is characterized in that the pattern is formed by a printing method. a step of forming a pattern layer by applying a paste on a substrate (pattern printing step); and a step of hardening or firing the pattern layer (pattern hardening or manufacturing step). Further, printing method in the pattern printing step 'Examples: at least one method selected from the group consisting of ink method, screen printing method, letterpress printing method, offset printing method, photographic printing method, microcontact printing method, and nanoprinting method. Use or use the Yi Yuan to have a group of step-burning concave -13 - 201224074 The pattern layer formed by the above printing method is dried by drying, and then heat treated And/or it can be hardened by light irradiation. After drying, it can be fired without hardening. The drying method, for example, can be exemplified by a temperature of about 80 to 20 Torr, for example, heating 〇·1 In the case of heat treatment, the temperature may be appropriately adjusted according to the type of the component to be reacted or the type of the catalyst, and the like, for example, is about 50 to 200 C. The heating time is, for example, 5. 5 to 3 hours or so. In the case of light irradiation, the light source can use, for example, a mercury lamp, a gas lamp, a carbon arc lamp, a metal halide lamp, sunlight, an electron beam, a laser light, etc. The light irradiation time is, for example, 〇5 to 3 minutes or so. In the case of firing, the firing temperature is, for example, about 2 〇〇 to 15 〇 (about rc). Further, the firing time is, for example, about 1 to 5 hours. The thickness of the pattern layer obtained by the above method can be appropriately adjusted depending on the use, for example, from several nm to about 2 μm. The substrate on which the pattern layer is formed is preferably heat-resistant and solvent-resistant, and examples thereof include polyethylene terephthalate, polyethylene naphthalate, polyethylene, polypropylene, and polyphenylene. Fluorine resin such as ethylene, polyamine, polyaniline, polyvinyl alcohol, polyvinyl butyral, polyvinyl chloride, polyvinylidene chloride, poly-vinyl acetate, etc.; polycarbonate, acrylic resin, hydrazine A base acrylic resin, a cyclic olefin copolymer, a conductive polymer, nylon, cellulose, glass, ITO, or the like. The thickness of the substrate is, for example, about 〇_1 to 50 mm. ^ Generally, a solar cell (especially an 'organic solar cell) has a photoelectric conversion layer including an n-type semiconductor layer and a p-type semiconductor layer, and is incident on a side electrode (main line electrode and a finger electrode) and a back side electrode. The structure that is clamped. -14- 201224074 The solar cell can be manufactured by, for example, the following method. According to the pattern forming method of the present invention, the elements constituting the solar cell can be formed with high precision. 1 : A p-type semiconductor to which B (boron atom) or the like is added as an impurity is formed by a printing method. 2: After the texture (concavity and convexity) is applied to the surface of the obtained p-type semiconductor, an n-type semiconductor to which p (disc atom) or the like is added as an impurity is laminated by a printing method. 3. An anti-reflection film such as tantalum nitride or titanium oxide is formed on the surface of the p-type semiconductor. 4. The main line electrode and the finger electrode (light incident side electrode) are formed on the surface of the n-type semiconductor by a printing method. Generally, an organic TFT is composed of an electrode layer (a gate layer, a source layer, a drain layer) and an organic semiconductor layer. According to the pattern forming method of the present invention, the elements constituting the organic τρτ can be formed with high precision. In general, an electronic paper has a configuration in which a display layer and a driving layer for controlling the display layer are sandwiched by a substrate. Further, a flexible display can be realized by using the organic TFT as the driving layer. In general, the 'organo Du element has a structure in which a layer of a layer to a plurality of layers is sandwiched by an electric anode and a cathode. The organic EL element can be produced, for example, by the pattern forming method of the present invention. According to the element EL of the organic ELM, the composition is formed with high precision. 201224074 1 : An anode is formed on a substrate such as glass. 2: A partition wall is formed on the substrate of glass or the like to form an anode. 3: On the anode, a red light-emitting layer is formed by a printing method and then hardened. 4: A cathode is formed on the light-emitting layer and the partition wall. The pattern forming method according to the present invention is capable of patterning a substrate in a non-contact state, and/or the flexible substrate is also easily patterned to constitute a solar cell, an organic TFT, an electronic paper, and a device for manufacturing today. The micro-fabrication can be formed with high precision, without complicated steps such as making a mask, without using a fine processing technique. Moreover, it is manufactured under the environment. Therefore, it can greatly simplify the process and reduce manufacturing costs. [Examples] Hereinafter, the present invention will be more specifically described by way of Examples. Example 1 20 g of dipropylene glycol methyl n-butyl ether (trade name "manufactured by Chemical Industry Co., Ltd., later called") and 20 g of distilled water were poured into a 5 〇 flask for t minutes and then allowed to stand for 10 minutes. The water concentration in the aqueous environment in which the organic phase is carried out is 〇.9〇/.
部分以外的部分 綠、藍、或白色 利用印刷法，能 故能夠在大面積 。因此，尤其在 *有機EL元件之 細之元件圖案。 而能夠直接地描 能夠在常溫常壓 、簡化設備、削 明，但本發明並 DPMNB」、Daicel 「DPMNB」之情 卜，攪拌約10分 分測定，在25°C -16- 201224074 將該DPMNB各20.00 g分別置入4個50 ml燒瓶中， 分別追加 1. 〇 5 g ( 5 % 溶液）、1 · 2 8 g ( 6 % 溶液）、1 · 5 1 g (7%溶液）、1.74 g ( 8%溶液）之商品名「ETHOCEL」 (註冊商標）（乙基纖維素、DOW股份有限公司製）。 之後，在65°C攪捽後靜置，自然冷卻至25 °C止之後，以 目視確認乙基纖維素之溶解性，依照下列基準進行評估。 評估基準 乙基纖維素完全溶解··〇 乙基纖維素一部分不溶、或完全不溶：X 實施例2 將二丙二醇曱基正丙基醚（商品名「DPMNP」、Daicel 化學工業股份有限公司製，以後有稱為「DPMNP」之情 形）2 0 g、蒸餾水2 0 g倒入5 0 m 1燒瓶中，攪拌約1 〇分 鐘後’靜置10分鐘，進行有機相之水分測定，在2 5 °C 環境下之水分濃度為1.3%。 除了使用該DPMNP以取代DPMNB以外，進行與實 施例1同樣方式而評估乙基纖維素之溶解性。 比較例1 將二丙二醇二甲基醚（商品名「DMM」、Daicel化 學工業股份有限公司製，以後有稱為「DMM」之情形） 20 g、蒸鶴水20 g倒入50 ml燒瓶中，攪拌約1 〇分鐘後， 靜置1 0分鐘，進行有機相之水分測定，在251環境下之 水分濃度為4.7 %。 除了使用該DMM以取代DPMNB以外’進行與實施 例1同樣方式而評估乙基纖維素之溶解性。 201224074 比較例2 將依照「第5版實驗科學講座14」（丸善股份有限 公司出版、P239-241)記載之方法所合成的二丙二醇二 丁基醚（以後有稱為「DPDB」之情形）20 g、蒸餾水20 g倒入5 0 ml燒瓶中，攪拌約1 0分鐘後，靜置1 0分鐘， 進行有機相之水分測定，在2 5 °C環境下之水分濃度為 0.1%。 除了使用該DPDB以取代DPMNB以外，進行與實 施例1同樣方式而評估乙基纖維素之溶解性。 將上述結果彙整而顯示於下表中。 表1Parts other than the part Green, blue, or white can be printed on a large area. Therefore, especially in the thin component pattern of the organic EL element. However, it is possible to directly describe the normal temperature and pressure, simplify the equipment, and sharpen, but the present invention and DPMNB", Daicel "DPMNB", stir about 10 minutes, and the DPNNB at 25 ° C -16 - 201224074 Each 20.00 g was placed in four 50 ml flasks, respectively 1. 〇5 g (5 % solution), 1 · 2 8 g (6 % solution), 1 · 5 1 g (7% solution), 1.74 g (8% solution), the trade name "ETHOCEL" (registered trademark) (ethyl cellulose, manufactured by DOW Co., Ltd.). Thereafter, the mixture was allowed to stand at 65 ° C, and after standing to cool at 25 ° C, the solubility of ethyl cellulose was visually confirmed and evaluated according to the following criteria. Evaluation of Ethyl Cellulose Completely Dissolved · · Ethylcellulose is partially insoluble or completely insoluble: X Example 2 Dipropylene glycol decyl n-propyl ether (trade name "DPMNP", manufactured by Daicel Chemical Industry Co., Ltd., In the future, there is a case called "DPMNP". 20 g, distilled water 20 g is poured into a 50 m 1 flask, stirred for about 1 〇 minutes, and then allowed to stand for 10 minutes to measure the moisture of the organic phase at 25 ° The water concentration in the C environment is 1.3%. The solubility of ethyl cellulose was evaluated in the same manner as in Example 1 except that this DPMNP was used instead of DPMNB. Comparative Example 1 20 g of dipropylene glycol dimethyl ether (trade name "DMM", manufactured by Daicel Chemical Industry Co., Ltd., and later referred to as "DMM"), 20 g of steamed crane water, and poured into a 50 ml flask, and stirred. After about 1 minute, it was allowed to stand for 10 minutes, and the moisture of the organic phase was measured. The water concentration in the 251 environment was 4.7%. The solubility of ethyl cellulose was evaluated in the same manner as in Example 1 except that the DMM was used instead of DPMNB. 201224074 Comparative Example 2 Dipropylene glycol dibutyl ether synthesized in accordance with the method described in "The 5th Edition of Experimental Science Lecture 14" (Maruzen Co., Ltd., P239-241) (hereinafter referred to as "DPDB") 20 g. 20 g of distilled water was poured into a 50 ml flask, stirred for about 10 minutes, and allowed to stand for 10 minutes, and the moisture of the organic phase was measured, and the water concentration at 25 ° C was 0.1%. The solubility of ethyl cellulose was evaluated in the same manner as in Example 1 except that the DPDB was used instead of DPMNB. The above results are summarized and shown in the table below. Table 1
二丙二醇二烷基醚 含水率（％) 乙基纖維素溶解性 5% 6% 7% 8% 實施例1 DPMNB 0.9 〇 〇 〇 〇 實施例2 DPMNP 1.3 〇 〇 〇 〇 比較例1 DMM 4.7 〇 〇 〇 〇 比較例2 DPDB 0.1 X X X X 【圖式簡單說明】 無0 【主要元件符號說明】 無0Dipropylene glycol dialkyl ether moisture content (%) Ethyl cellulose solubility 5% 6% 7% 8% Example 1 DPMNB 0.9 〇〇〇〇 Example 2 DPMNP 1.3 〇〇〇〇 Comparative Example 1 DMM 4.7 〇〇 〇〇Comparative example 2 DPDB 0.1 XXXX [Simple description of the diagram] No 0 [Description of main component symbols] No 0
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010239264 | 2010-10-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201224074A true TW201224074A (en) | 2012-06-16 |
Family
ID=46037088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100138570A TW201224074A (en) | 2010-10-26 | 2011-10-25 | Solvent or solvent composition for printing |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2012107206A (en) |
| KR (1) | KR20120043647A (en) |
| CN (1) | CN102453377A (en) |
| TW (1) | TW201224074A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5871720B2 (en) * | 2011-06-16 | 2016-03-01 | 株式会社ダイセル | Solvent for printing or solvent composition |
| JP5886591B2 (en) * | 2011-08-09 | 2016-03-16 | 株式会社ダイセル | Solvent for printing and paste composition |
| JP5670924B2 (en) * | 2012-01-10 | 2015-02-18 | 株式会社ノリタケカンパニーリミテド | Conductive bonding material, method of bonding ceramic electronic material using the same, and ceramic electronic device |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB9208955D0 (en) * | 1992-04-24 | 1992-06-10 | Dow Europ Sa | Dicyandiamide solution |
| US5922109A (en) * | 1997-03-11 | 1999-07-13 | The Dow Chemical Company | Gas drying process using glycol solution solubility suppressants |
| TWI383271B (en) * | 2004-03-03 | 2013-01-21 | Daicel Chem | Detergent and rinsing solution for lithography |
| TW200604226A (en) * | 2004-03-31 | 2006-02-01 | Zeon Corp | Radiation-sensitive composition, multilayer body and method for producing same, and electronic component |
| JP2006195175A (en) * | 2005-01-13 | 2006-07-27 | Hitachi Chem Co Ltd | Radiation-curing composition, method for storing the same, method for forming cured film, pattern forming method, pattern using method, electronic component, and optical waveguide |
| JP2006278071A (en) * | 2005-03-29 | 2006-10-12 | Toyo Aluminium Kk | Paste composition, electrode, and solar battery element equipped with the same |
| WO2008123388A1 (en) * | 2007-03-26 | 2008-10-16 | Jsr Corporation | Curable resin composition, protective film, and method for forming protective film |
| TWI370552B (en) * | 2007-06-08 | 2012-08-11 | Gigastorage Corp | Solar cell |
| JP2009086292A (en) * | 2007-09-28 | 2009-04-23 | Fujifilm Corp | Coloring composition for color filter, color filter and display apparatus |
| JP5051371B2 (en) * | 2007-11-26 | 2012-10-17 | Ｊｓｒ株式会社 | Radiation-sensitive resin composition, spacer and protective film for liquid crystal display element, and liquid crystal display element |
| JP2009192974A (en) * | 2008-02-18 | 2009-08-27 | Seiko Epson Corp | Ink for color filter, ink set for color filter, color filter, image display, and electronic equipment |
| JP2010072031A (en) * | 2008-09-16 | 2010-04-02 | Seiko Epson Corp | Color filter ink, color filter, image display device, and electronic apparatus |
| JP2010070724A (en) * | 2008-09-22 | 2010-04-02 | Showa Denko Kk | Removing liquid for curable composition |
| WO2010106980A1 (en) * | 2009-03-17 | 2010-09-23 | 積水化学工業株式会社 | Inorganic microparticle-dispersed paste composition |
| JP2011064770A (en) * | 2009-09-15 | 2011-03-31 | Sumitomo Chemical Co Ltd | Photosensitive resin composition |
| JP2011233480A (en) * | 2010-04-30 | 2011-11-17 | Ricoh Co Ltd | Forming method of laminate structure and manufacturing method of organic electroluminescent device |
| JP5703674B2 (en) * | 2010-10-12 | 2015-04-22 | 日立化成株式会社 | P-type diffusion layer forming composition, method for producing p-type diffusion layer, and method for producing solar battery cell |
-
2011
- 2011-10-04 JP JP2011219850A patent/JP2012107206A/en active Pending
- 2011-10-25 KR KR20110109076A patent/KR20120043647A/en not_active Application Discontinuation
- 2011-10-25 TW TW100138570A patent/TW201224074A/en unknown
- 2011-10-26 CN CN2011103293640A patent/CN102453377A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR20120043647A (en) | 2012-05-04 |
| CN102453377A (en) | 2012-05-16 |
| JP2012107206A (en) | 2012-06-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5871720B2 (en) | Solvent for printing or solvent composition | |
| JP4653716B2 (en) | Highly conductive ink composition and method for producing metal conductive pattern | |
| JP6698147B2 (en) | Silicon-containing resin composition | |
| JP5671157B2 (en) | Conductive ink composition for offset or reverse offset printing | |
| US20120097059A1 (en) | Nanowire ink compositions and printing of same | |
| KR101285162B1 (en) | Conducting polymer ink composition and organic solar cell comprising the same | |
| WO2012014481A1 (en) | Conductive paste for offset printing | |
| DE102015209342A1 (en) | CONNECTION, DRYER, SEALING STRUCTURE AND ORGANIC EL-ELEMENT | |
| TWI594079B (en) | Negative photosensitive siloxane composition | |
| JP2009260324A (en) | Composition, and photoelectric converting element using it | |
| CN109642069A (en) | Composition epoxy resin and the excellent low curing shrinkage hardening of resin film of adhesion | |
| TW201224074A (en) | Solvent or solvent composition for printing | |
| TW201526735A (en) | Conducting substrate and method for preparing the same | |
| JP5940790B2 (en) | Solvent for printing or solvent composition | |
| JP5366071B2 (en) | Primer composition | |
| TW200537217A (en) | Printable transparent electrodes | |
| JP5886591B2 (en) | Solvent for printing and paste composition | |
| KR20200013652A (en) | Manufacturing method of charge transport thin film | |
| JP2012092071A (en) | Dipropylene glycol dialkyl ether and solvent composition for forming pattern of electronic part | |
| TW201224073A (en) | Solvent or solvent composition for printing | |
| CN102925004A (en) | Solvent for printing and paste composition | |
| CN105408986B (en) | The manufacturing method of mask paste composition, the semiconductor element obtained using it and semiconductor element | |
| KR20220027970A (en) | charge transport varnish | |
| KR101064846B1 (en) | Paste composition for offset printing and flat panel display device using the smae | |
| JP2011037915A (en) | Ink composition for laying fine pattern |