TW201212116A - A grinding tool for trapezoid grinding of a wafer - Google Patents

A grinding tool for trapezoid grinding of a wafer Download PDF

Info

Publication number
TW201212116A
TW201212116A TW100126843A TW100126843A TW201212116A TW 201212116 A TW201212116 A TW 201212116A TW 100126843 A TW100126843 A TW 100126843A TW 100126843 A TW100126843 A TW 100126843A TW 201212116 A TW201212116 A TW 201212116A
Authority
TW
Taiwan
Prior art keywords
wafer
grooves
grinding
groove
wheel
Prior art date
Application number
TW100126843A
Other languages
English (en)
Chinese (zh)
Inventor
Guoqiang David Zhang
Roland Vandamme
Peter D Albrecht
Original Assignee
Memc Electronic Materials
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Memc Electronic Materials filed Critical Memc Electronic Materials
Publication of TW201212116A publication Critical patent/TW201212116A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/14—Zonally-graded wheels; Composite wheels comprising different abrasives

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
TW100126843A 2010-07-30 2011-07-28 A grinding tool for trapezoid grinding of a wafer TW201212116A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/847,015 US20120028555A1 (en) 2010-07-30 2010-07-30 Grinding Tool For Trapezoid Grinding Of A Wafer

Publications (1)

Publication Number Publication Date
TW201212116A true TW201212116A (en) 2012-03-16

Family

ID=44674831

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100126843A TW201212116A (en) 2010-07-30 2011-07-28 A grinding tool for trapezoid grinding of a wafer

Country Status (8)

Country Link
US (1) US20120028555A1 (fr)
EP (1) EP2598286A2 (fr)
JP (1) JP2013532587A (fr)
KR (1) KR20130132388A (fr)
CN (1) CN103180098A (fr)
SG (1) SG187057A1 (fr)
TW (1) TW201212116A (fr)
WO (1) WO2012014137A2 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5926527B2 (ja) * 2011-10-17 2016-05-25 信越化学工業株式会社 透明ｓｏｉウェーハの製造方法
KR101871854B1 (ko) * 2016-05-31 2018-06-28 주식회사 케이엔제이 기판 가공장치
CN106239306B (zh) * 2016-08-01 2018-07-31 中国电子科技集团公司第四十六研究所 一种变r值晶片边缘倒角方法
US11450578B2 (en) * 2018-04-27 2022-09-20 Tokyo Electron Limited Substrate processing system and substrate processing method
CN109571183B (zh) * 2018-11-30 2024-02-20 温州市华晖汽摩配件厂(普通合伙) 一种镜片磨边机用自出水多弧度镜片玻璃倒边磨头
KR102195461B1 (ko) * 2019-03-28 2020-12-29 주식회사 케이엔제이 기판 연마장치
KR102199074B1 (ko) * 2019-05-28 2021-01-06 주식회사 케이엔제이 기판 연마장치
CN111390713B (zh) * 2020-04-09 2020-12-11 山东广域科技有限责任公司 一种电力绝缘子加工成型工艺

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61256621A (ja) 1985-05-08 1986-11-14 Toshiba Corp 接着型半導体基板の製造方法
JP2658135B2 (ja) 1988-03-08 1997-09-30 ソニー株式会社 半導体基板
JPH0485827A (ja) 1990-07-26 1992-03-18 Fujitsu Ltd 半導体装置の製造方法
JPH11320363A (ja) * 1998-05-18 1999-11-24 Tokyo Seimitsu Co Ltd ウェーハ面取り装置
JP3635200B2 (ja) 1998-06-04 2005-04-06 信越半導体株式会社 Ｓｏｉウェーハの製造方法
WO2001048752A1 (fr) * 1999-12-27 2001-07-05 3M Innovative Properties Company Procede pour assurer le poli optique du bord de la plaque brute d'un disque d'enregistrement
JP2001246536A (ja) * 1999-12-27 2001-09-11 Three M Innovative Properties Co 記録媒体ディスク原板の端部を鏡面仕上げする方法
US6482749B1 (en) * 2000-08-10 2002-11-19 Seh America, Inc. Method for etching a wafer edge using a potassium-based chemical oxidizer in the presence of hydrofluoric acid
JP4162892B2 (ja) * 2002-01-11 2008-10-08 日鉱金属株式会社 半導体ウェハおよびその製造方法
JP4441823B2 (ja) * 2003-11-26 2010-03-31 株式会社東京精密 面取り砥石のツルーイング方法及び面取り装置
JP4839818B2 (ja) 2005-12-16 2011-12-21 信越半導体株式会社 貼り合わせ基板の製造方法
CN201350598Y (zh) * 2008-12-30 2009-11-25 浙江水晶光电科技股份有限公司 晶片改圆加工磨轮

Also Published As

Publication number Publication date
JP2013532587A (ja) 2013-08-19
WO2012014137A2 (fr) 2012-02-02
WO2012014137A3 (fr) 2012-03-22
SG187057A1 (en) 2013-02-28
EP2598286A2 (fr) 2013-06-05
US20120028555A1 (en) 2012-02-02
CN103180098A (zh) 2013-06-26
KR20130132388A (ko) 2013-12-04

Similar Documents

Publication Publication Date Title
TW201212116A (en) A grinding tool for trapezoid grinding of a wafer
TWI609435B (zh) Composite substrate, semiconductor device and method for manufacturing semiconductor device
JP2010283371A5 (fr)
WO2016038800A1 (fr) Procédé de traitement de tranche de semi-conducteur, procédé de fabrication de tranche liée, et procédé de fabrication de plaquette épitaxiale
TWI327100B (en) Verfahren zur herstellung einer halbleiterscheibe mit einer profilierten kante
TW201216341A (en) Semiconductor and solar wafers and method for processing same
JP5521582B2 (ja) 貼り合わせウェーハの製造方法
JP3328193B2 (ja) 半導体ウエーハの製造方法
JP2009302409A5 (fr)
JP6737224B2 (ja) 多層膜ｓｏｉウェーハの製造方法
TWI601285B (zh) 半導體與太陽能晶圓
JP5623249B2 (ja) ウェーハの面取り方法
JP6016473B2 (ja) ウエーハの加工方法
JP6729471B2 (ja) 多層膜ｓｏｉウェーハの製造方法および多層膜ｓｏｉウェーハ
JP2007013012A (ja) 太陽電池用シリコンウェーハの端面の面取り加工方法
JP7339056B2 (ja) 貼り合わせウェーハ及びそれを用いた積層ウェーハの製造方法
JP2022127060A (ja) シリコンウェーハ及びそれを用いた積層ウェーハの製造方法
JP2018182145A (ja) 多層膜ｓｏｉウェーハ及びその製造方法