SG187057A1 - Grinding tool for trapezoid grinding of a wafer - Google Patents
Grinding tool for trapezoid grinding of a wafer Download PDFInfo
- Publication number
- SG187057A1 SG187057A1 SG2013002647A SG2013002647A SG187057A1 SG 187057 A1 SG187057 A1 SG 187057A1 SG 2013002647 A SG2013002647 A SG 2013002647A SG 2013002647 A SG2013002647 A SG 2013002647A SG 187057 A1 SG187057 A1 SG 187057A1
- Authority
- SG
- Singapore
- Prior art keywords
- wafer
- grinding
- groove
- grooves
- wheel
- Prior art date
Links
- 238000000227 grinding Methods 0.000 title claims abstract description 100
- 230000002093 peripheral effect Effects 0.000 claims description 30
- 229910003460 diamond Inorganic materials 0.000 claims description 8
- 239000010432 diamond Substances 0.000 claims description 8
- 235000012431 wafers Nutrition 0.000 description 121
- 238000000034 method Methods 0.000 description 22
- 239000000758 substrate Substances 0.000 description 22
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005498 polishing Methods 0.000 description 6
- 230000032798 delamination Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 241001050985 Disco Species 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/14—Zonally-graded wheels; Composite wheels comprising different abrasives
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/847,015 US20120028555A1 (en) | 2010-07-30 | 2010-07-30 | Grinding Tool For Trapezoid Grinding Of A Wafer |
| PCT/IB2011/053282 WO2012014137A2 (fr) | 2010-07-30 | 2011-07-22 | Outil de meulage pour meulage trapézoïdal d'une tranche |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG187057A1 true SG187057A1 (en) | 2013-02-28 |
Family
ID=44674831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2013002647A SG187057A1 (en) | 2010-07-30 | 2011-07-22 | Grinding tool for trapezoid grinding of a wafer |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20120028555A1 (fr) |
| EP (1) | EP2598286A2 (fr) |
| JP (1) | JP2013532587A (fr) |
| KR (1) | KR20130132388A (fr) |
| CN (1) | CN103180098A (fr) |
| SG (1) | SG187057A1 (fr) |
| TW (1) | TW201212116A (fr) |
| WO (1) | WO2012014137A2 (fr) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5926527B2 (ja) * | 2011-10-17 | 2016-05-25 | 信越化学工業株式会社 | 透明ｓｏｉウェーハの製造方法 |
| KR101871854B1 (ko) * | 2016-05-31 | 2018-06-28 | 주식회사 케이엔제이 | 기판 가공장치 |
| CN106239306B (zh) * | 2016-08-01 | 2018-07-31 | 中国电子科技集团公司第四十六研究所 | 一种变r值晶片边缘倒角方法 |
| US11450578B2 (en) * | 2018-04-27 | 2022-09-20 | Tokyo Electron Limited | Substrate processing system and substrate processing method |
| CN109571183B (zh) * | 2018-11-30 | 2024-02-20 | 温州市华晖汽摩配件厂(普通合伙) | 一种镜片磨边机用自出水多弧度镜片玻璃倒边磨头 |
| KR102195461B1 (ko) * | 2019-03-28 | 2020-12-29 | 주식회사 케이엔제이 | 기판 연마장치 |
| KR102199074B1 (ko) * | 2019-05-28 | 2021-01-06 | 주식회사 케이엔제이 | 기판 연마장치 |
| CN111390713B (zh) * | 2020-04-09 | 2020-12-11 | 山东广域科技有限责任公司 | 一种电力绝缘子加工成型工艺 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61256621A (ja) | 1985-05-08 | 1986-11-14 | Toshiba Corp | 接着型半導体基板の製造方法 |
| JP2658135B2 (ja) | 1988-03-08 | 1997-09-30 | ソニー株式会社 | 半導体基板 |
| JPH0485827A (ja) | 1990-07-26 | 1992-03-18 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPH11320363A (ja) * | 1998-05-18 | 1999-11-24 | Tokyo Seimitsu Co Ltd | ウェーハ面取り装置 |
| JP3635200B2 (ja) * | 1998-06-04 | 2005-04-06 | 信越半導体株式会社 | Ｓｏｉウェーハの製造方法 |
| WO2001048752A1 (fr) * | 1999-12-27 | 2001-07-05 | 3M Innovative Properties Company | Procede pour assurer le poli optique du bord de la plaque brute d'un disque d'enregistrement |
| JP2001246536A (ja) * | 1999-12-27 | 2001-09-11 | Three M Innovative Properties Co | 記録媒体ディスク原板の端部を鏡面仕上げする方法 |
| US6482749B1 (en) * | 2000-08-10 | 2002-11-19 | Seh America, Inc. | Method for etching a wafer edge using a potassium-based chemical oxidizer in the presence of hydrofluoric acid |
| JP4162892B2 (ja) * | 2002-01-11 | 2008-10-08 | 日鉱金属株式会社 | 半導体ウェハおよびその製造方法 |
| JP4441823B2 (ja) * | 2003-11-26 | 2010-03-31 | 株式会社東京精密 | 面取り砥石のツルーイング方法及び面取り装置 |
| JP4839818B2 (ja) | 2005-12-16 | 2011-12-21 | 信越半導体株式会社 | 貼り合わせ基板の製造方法 |
| CN201350598Y (zh) * | 2008-12-30 | 2009-11-25 | 浙江水晶光电科技股份有限公司 | 晶片改圆加工磨轮 |
-
2010
- 2010-07-30 US US12/847,015 patent/US20120028555A1/en not_active Abandoned
-
2011
- 2011-07-22 SG SG2013002647A patent/SG187057A1/en unknown
- 2011-07-22 KR KR1020137002424A patent/KR20130132388A/ko not_active Application Discontinuation
- 2011-07-22 CN CN2011800376052A patent/CN103180098A/zh active Pending
- 2011-07-22 JP JP2013521270A patent/JP2013532587A/ja not_active Withdrawn
- 2011-07-22 EP EP11760557.6A patent/EP2598286A2/fr not_active Withdrawn
- 2011-07-22 WO PCT/IB2011/053282 patent/WO2012014137A2/fr active Application Filing
- 2011-07-28 TW TW100126843A patent/TW201212116A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP2598286A2 (fr) | 2013-06-05 |
| US20120028555A1 (en) | 2012-02-02 |
| CN103180098A (zh) | 2013-06-26 |
| JP2013532587A (ja) | 2013-08-19 |
| WO2012014137A3 (fr) | 2012-03-22 |
| KR20130132388A (ko) | 2013-12-04 |
| WO2012014137A2 (fr) | 2012-02-02 |
| TW201212116A (en) | 2012-03-16 |
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