CN103180098A - 用于晶片的梯形磨削的磨削工具 - Google Patents

用于晶片的梯形磨削的磨削工具 Download PDF

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Publication number
CN103180098A
CN103180098A CN2011800376052A CN201180037605A CN103180098A CN 103180098 A CN103180098 A CN 103180098A CN 2011800376052 A CN2011800376052 A CN 2011800376052A CN 201180037605 A CN201180037605 A CN 201180037605A CN 103180098 A CN103180098 A CN 103180098A
Authority
CN
China
Prior art keywords
wafer
groove
grinding
grinding tool
ground
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011800376052A
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English (en)
Chinese (zh)
Inventor
G·D·张
R·旺达姆
P·D·阿尔布雷克特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SunEdison Inc
Original Assignee
SunEdison Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SunEdison Inc filed Critical SunEdison Inc
Publication of CN103180098A publication Critical patent/CN103180098A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/14—Zonally-graded wheels; Composite wheels comprising different abrasives

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
CN2011800376052A 2010-07-30 2011-07-22 用于晶片的梯形磨削的磨削工具 Pending CN103180098A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/847,015 2010-07-30
US12/847,015 US20120028555A1 (en) 2010-07-30 2010-07-30 Grinding Tool For Trapezoid Grinding Of A Wafer
PCT/IB2011/053282 WO2012014137A2 (fr) 2010-07-30 2011-07-22 Outil de meulage pour meulage trapézoïdal d'une tranche

Publications (1)

Publication Number Publication Date
CN103180098A true CN103180098A (zh) 2013-06-26

Family

ID=44674831

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011800376052A Pending CN103180098A (zh) 2010-07-30 2011-07-22 用于晶片的梯形磨削的磨削工具

Country Status (8)

Country Link
US (1) US20120028555A1 (fr)
EP (1) EP2598286A2 (fr)
JP (1) JP2013532587A (fr)
KR (1) KR20130132388A (fr)
CN (1) CN103180098A (fr)
SG (1) SG187057A1 (fr)
TW (1) TW201212116A (fr)
WO (1) WO2012014137A2 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106239306A (zh) * 2016-08-01 2016-12-21 中国电子科技集团公司第四十六研究所 一种变r值晶片边缘倒角方法
CN109571183A (zh) * 2018-11-30 2019-04-05 温州市华晖汽摩配件厂(普通合伙) 一种镜片磨边机用自出水多弧度镜片玻璃倒边磨头

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5926527B2 (ja) * 2011-10-17 2016-05-25 信越化学工業株式会社 透明ｓｏｉウェーハの製造方法
KR101871854B1 (ko) * 2016-05-31 2018-06-28 주식회사 케이엔제이 기판 가공장치
US11450578B2 (en) * 2018-04-27 2022-09-20 Tokyo Electron Limited Substrate processing system and substrate processing method
KR102195461B1 (ko) * 2019-03-28 2020-12-29 주식회사 케이엔제이 기판 연마장치
KR102199074B1 (ko) * 2019-05-28 2021-01-06 주식회사 케이엔제이 기판 연마장치
CN111390713B (zh) * 2020-04-09 2020-12-11 山东广域科技有限责任公司 一种电力绝缘子加工成型工艺

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001246536A (ja) * 1999-12-27 2001-09-11 Three M Innovative Properties Co 記録媒体ディスク原板の端部を鏡面仕上げする方法
US20010055863A1 (en) * 1998-06-04 2001-12-27 Masatake Nakano Methods for manufacturing soi wafer and soi wafer
US6431961B1 (en) * 1998-05-18 2002-08-13 Tokyo Seimitsu Co., Ltd. Apparatus and method for chamfering wafer
CN1502117A (zh) * 2002-01-11 2004-06-02 ��ʽ�������տ� 半导体晶片及其制造方法
CN1621200A (zh) * 2003-11-26 2005-06-01 株式会社东京精密 倒角磨石的修整方法及倒角装置
CN201350598Y (zh) * 2008-12-30 2009-11-25 浙江水晶光电科技股份有限公司 晶片改圆加工磨轮

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61256621A (ja) 1985-05-08 1986-11-14 Toshiba Corp 接着型半導体基板の製造方法
JP2658135B2 (ja) 1988-03-08 1997-09-30 ソニー株式会社 半導体基板
JPH0485827A (ja) 1990-07-26 1992-03-18 Fujitsu Ltd 半導体装置の製造方法
WO2001048752A1 (fr) * 1999-12-27 2001-07-05 3M Innovative Properties Company Procede pour assurer le poli optique du bord de la plaque brute d'un disque d'enregistrement
US6482749B1 (en) * 2000-08-10 2002-11-19 Seh America, Inc. Method for etching a wafer edge using a potassium-based chemical oxidizer in the presence of hydrofluoric acid
JP4839818B2 (ja) 2005-12-16 2011-12-21 信越半導体株式会社 貼り合わせ基板の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6431961B1 (en) * 1998-05-18 2002-08-13 Tokyo Seimitsu Co., Ltd. Apparatus and method for chamfering wafer
US20010055863A1 (en) * 1998-06-04 2001-12-27 Masatake Nakano Methods for manufacturing soi wafer and soi wafer
JP2001246536A (ja) * 1999-12-27 2001-09-11 Three M Innovative Properties Co 記録媒体ディスク原板の端部を鏡面仕上げする方法
CN1502117A (zh) * 2002-01-11 2004-06-02 ��ʽ�������տ� 半导体晶片及其制造方法
CN1621200A (zh) * 2003-11-26 2005-06-01 株式会社东京精密 倒角磨石的修整方法及倒角装置
CN201350598Y (zh) * 2008-12-30 2009-11-25 浙江水晶光电科技股份有限公司 晶片改圆加工磨轮

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106239306A (zh) * 2016-08-01 2016-12-21 中国电子科技集团公司第四十六研究所 一种变r值晶片边缘倒角方法
CN106239306B (zh) * 2016-08-01 2018-07-31 中国电子科技集团公司第四十六研究所 一种变r值晶片边缘倒角方法
CN109571183A (zh) * 2018-11-30 2019-04-05 温州市华晖汽摩配件厂(普通合伙) 一种镜片磨边机用自出水多弧度镜片玻璃倒边磨头
CN109571183B (zh) * 2018-11-30 2024-02-20 温州市华晖汽摩配件厂(普通合伙) 一种镜片磨边机用自出水多弧度镜片玻璃倒边磨头

Also Published As

Publication number Publication date
EP2598286A2 (fr) 2013-06-05
SG187057A1 (en) 2013-02-28
US20120028555A1 (en) 2012-02-02
JP2013532587A (ja) 2013-08-19
WO2012014137A3 (fr) 2012-03-22
KR20130132388A (ko) 2013-12-04
WO2012014137A2 (fr) 2012-02-02
TW201212116A (en) 2012-03-16

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C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20130626