TW201208076A - Self-aligned semiconductor devices with reduced gate-source leakage under reverse bias and methods of making - Google Patents
Self-aligned semiconductor devices with reduced gate-source leakage under reverse bias and methods of making Download PDFInfo
- Publication number
- TW201208076A TW201208076A TW100118051A TW100118051A TW201208076A TW 201208076 A TW201208076 A TW 201208076A TW 100118051 A TW100118051 A TW 100118051A TW 100118051 A TW100118051 A TW 100118051A TW 201208076 A TW201208076 A TW 201208076A
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- source
- range
- semiconductor device
- convex
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/80—FETs having rectifying junction gate electrodes
- H10D30/83—FETs having PN junction gate electrodes
- H10D30/831—Vertical FETs having PN junction gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/01—Manufacture or treatment
- H10D12/031—Manufacture or treatment of IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/051—Manufacture or treatment of FETs having PN junction gates
- H10D30/0512—Manufacture or treatment of FETs having PN junction gates of FETs having PN homojunction gates
- H10D30/0515—Manufacture or treatment of FETs having PN junction gates of FETs having PN homojunction gates of vertical FETs having PN homojunction gates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/202—FETs having static field-induced regions, e.g. static-induction transistors [SIT] or permeable base transistors [PBT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/343—Gate regions of field-effect devices having PN junction gates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
- H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
- H10D62/8325—Silicon carbide
Landscapes
- Junction Field-Effect Transistors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US34792810P | 2010-05-25 | 2010-05-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201208076A true TW201208076A (en) | 2012-02-16 |
Family
ID=45004680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100118051A TW201208076A (en) | 2010-05-25 | 2011-05-24 | Self-aligned semiconductor devices with reduced gate-source leakage under reverse bias and methods of making |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US8659057B2 (enExample) |
| EP (1) | EP2577735A4 (enExample) |
| JP (1) | JP2013530527A (enExample) |
| CN (1) | CN103038886A (enExample) |
| TW (1) | TW201208076A (enExample) |
| WO (1) | WO2011149768A2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI556322B (zh) * | 2014-03-28 | 2016-11-01 | 英特爾股份有限公司 | 使用選擇性再生的頂部接點的半導體裝置及其製造方法 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7977713B2 (en) * | 2008-05-08 | 2011-07-12 | Semisouth Laboratories, Inc. | Semiconductor devices with non-punch-through semiconductor channels having enhanced conduction and methods of making |
| US9006800B2 (en) * | 2011-12-14 | 2015-04-14 | Avogy, Inc. | Ingan ohmic source contacts for vertical power devices |
| US20140145201A1 (en) * | 2012-11-29 | 2014-05-29 | Avogy, Inc. | Method and system for gallium nitride vertical jfet with separated gate and source |
| US9935102B1 (en) | 2016-10-05 | 2018-04-03 | International Business Machines Corporation | Method and structure for improving vertical transistor |
| US11245027B2 (en) * | 2020-03-10 | 2022-02-08 | International Business Machines Corporation | Bottom source/drain etch with fin-cut-last-VTFET |
| US20230327026A1 (en) * | 2022-03-25 | 2023-10-12 | Wolfspeed, Inc. | Power semiconductor device with shallow conduction region |
| DE102023208539A1 (de) | 2023-08-10 | 2025-02-13 | Infineon Technologies Austria Ag | Transistorvorrichtung und verfahren |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2984752A (en) | 1953-08-13 | 1961-05-16 | Rca Corp | Unipolar transistors |
| JPS53121581A (en) | 1977-03-31 | 1978-10-24 | Seiko Instr & Electronics Ltd | Logical element of electrostatic inductive transistor |
| US4364072A (en) | 1978-03-17 | 1982-12-14 | Zaidan Hojin Handotai Kenkyu Shinkokai | Static induction type semiconductor device with multiple doped layers for potential modification |
| US4262296A (en) | 1979-07-27 | 1981-04-14 | General Electric Company | Vertical field effect transistor with improved gate and channel structure |
| IT1138998B (it) * | 1980-03-17 | 1986-09-17 | Gte Laboratories Inc | Transistor a induzione statica con strutture di porta perfezionate |
| US4403396A (en) | 1981-12-24 | 1983-09-13 | Gte Laboratories Incorporated | Semiconductor device design and process |
| US4587540A (en) | 1982-04-05 | 1986-05-06 | International Business Machines Corporation | Vertical MESFET with mesa step defining gate length |
| CH670173A5 (enExample) * | 1986-06-03 | 1989-05-12 | Bbc Brown Boveri & Cie | |
| DE4423068C1 (de) * | 1994-07-01 | 1995-08-17 | Daimler Benz Ag | Feldeffekt-Transistoren aus SiC und Verfahren zu ihrer Herstellung |
| US5429956A (en) | 1994-09-30 | 1995-07-04 | United Microelectronics Corporation | Method for fabricating a field effect transistor with a self-aligned anti-punchthrough implant channel |
| US5592005A (en) | 1995-03-31 | 1997-01-07 | Siliconix Incorporated | Punch-through field effect transistor |
| JP4027447B2 (ja) * | 1996-04-24 | 2007-12-26 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
| US5903020A (en) | 1997-06-18 | 1999-05-11 | Northrop Grumman Corporation | Silicon carbide static induction transistor structure |
| US5945701A (en) | 1997-12-19 | 1999-08-31 | Northrop Grumman Corporation | Static induction transistor |
| US6362062B1 (en) * | 1999-09-08 | 2002-03-26 | Texas Instruments Incorporated | Disposable sidewall spacer process for integrated circuits |
| US6816294B2 (en) | 2001-02-16 | 2004-11-09 | Electro Scientific Industries, Inc. | On-the-fly beam path error correction for memory link processing |
| US6967372B2 (en) | 2001-04-10 | 2005-11-22 | Silicon Storage Technology, Inc. | Semiconductor memory array of floating gate memory cells with vertical control gate sidewalls and insulation spacers |
| US6891262B2 (en) | 2001-07-19 | 2005-05-10 | Sony Corporation | Semiconductor device and method of producing the same |
| US6855970B2 (en) | 2002-03-25 | 2005-02-15 | Kabushiki Kaisha Toshiba | High-breakdown-voltage semiconductor device |
| JP4122880B2 (ja) | 2002-07-24 | 2008-07-23 | 住友電気工業株式会社 | 縦型接合型電界効果トランジスタ |
| JP2004134547A (ja) * | 2002-10-10 | 2004-04-30 | Hitachi Ltd | 半導体装置 |
| US7138685B2 (en) * | 2002-12-11 | 2006-11-21 | International Business Machines Corporation | Vertical MOSFET SRAM cell |
| JP4524735B2 (ja) | 2003-06-20 | 2010-08-18 | ルネサスエレクトロニクス株式会社 | 半導体記憶装置 |
| US20050067630A1 (en) | 2003-09-25 | 2005-03-31 | Zhao Jian H. | Vertical junction field effect power transistor |
| US7187021B2 (en) | 2003-12-10 | 2007-03-06 | General Electric Company | Static induction transistor |
| US7407837B2 (en) | 2004-01-27 | 2008-08-05 | Fuji Electric Holdings Co., Ltd. | Method of manufacturing silicon carbide semiconductor device |
| US7202528B2 (en) * | 2004-12-01 | 2007-04-10 | Semisouth Laboratories, Inc. | Normally-off integrated JFET power switches in wide bandgap semiconductors and methods of making |
| CA2576960A1 (en) | 2004-07-08 | 2007-01-04 | Semisouth Laboratories, Inc. | Monolithic vertical junction field effect transistor and schottky barrier diode fabricated from silicon carbide and method for fabricating the same |
| US7279368B2 (en) | 2005-03-04 | 2007-10-09 | Cree, Inc. | Method of manufacturing a vertical junction field effect transistor having an epitaxial gate |
| US20070029573A1 (en) * | 2005-08-08 | 2007-02-08 | Lin Cheng | Vertical-channel junction field-effect transistors having buried gates and methods of making |
| JP4939797B2 (ja) | 2005-11-01 | 2012-05-30 | ルネサスエレクトロニクス株式会社 | スイッチング半導体装置 |
| US20070148939A1 (en) | 2005-12-22 | 2007-06-28 | International Business Machines Corporation | Low leakage heterojunction vertical transistors and high performance devices thereof |
| US8058683B2 (en) | 2007-01-18 | 2011-11-15 | Samsung Electronics Co., Ltd. | Access device having vertical channel and related semiconductor device and a method of fabricating the access device |
| US7982239B2 (en) * | 2007-06-13 | 2011-07-19 | Northrop Grumman Corporation | Power switching transistors |
| US7763506B2 (en) * | 2007-09-10 | 2010-07-27 | Infineon Technologies Austria Ag | Method for making an integrated circuit including vertical junction field effect transistors |
| US7977713B2 (en) * | 2008-05-08 | 2011-07-12 | Semisouth Laboratories, Inc. | Semiconductor devices with non-punch-through semiconductor channels having enhanced conduction and methods of making |
| US7994548B2 (en) | 2008-05-08 | 2011-08-09 | Semisouth Laboratories, Inc. | Semiconductor devices with non-punch-through semiconductor channels having enhanced conduction and methods of making |
| JP5735429B2 (ja) * | 2008-11-05 | 2015-06-17 | パワー・インテグレーションズ・インコーポレーテッド | スロープの側壁を有する垂直接合型電界効果トランジスタ、及びその製造方法 |
-
2011
- 2011-05-20 WO PCT/US2011/037275 patent/WO2011149768A2/en not_active Ceased
- 2011-05-20 CN CN2011800367015A patent/CN103038886A/zh active Pending
- 2011-05-20 US US13/112,075 patent/US8659057B2/en active Active
- 2011-05-20 EP EP11787156.6A patent/EP2577735A4/en not_active Withdrawn
- 2011-05-20 JP JP2013512093A patent/JP2013530527A/ja active Pending
- 2011-05-24 TW TW100118051A patent/TW201208076A/zh unknown
-
2012
- 2012-09-13 US US13/613,453 patent/US20130011979A1/en not_active Abandoned
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI556322B (zh) * | 2014-03-28 | 2016-11-01 | 英特爾股份有限公司 | 使用選擇性再生的頂部接點的半導體裝置及其製造方法 |
| US10727339B2 (en) | 2014-03-28 | 2020-07-28 | Intel Corporation | Selectively regrown top contact for vertical semiconductor devices |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011149768A3 (en) | 2012-04-05 |
| US8659057B2 (en) | 2014-02-25 |
| WO2011149768A2 (en) | 2011-12-01 |
| JP2013530527A (ja) | 2013-07-25 |
| CN103038886A (zh) | 2013-04-10 |
| US20110291107A1 (en) | 2011-12-01 |
| EP2577735A2 (en) | 2013-04-10 |
| EP2577735A4 (en) | 2014-07-02 |
| US20130011979A1 (en) | 2013-01-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW201208076A (en) | Self-aligned semiconductor devices with reduced gate-source leakage under reverse bias and methods of making | |
| CN110518070B (zh) | 一种适用于单片集成的碳化硅ldmos器件及其制造方法 | |
| JP6707498B2 (ja) | シールドゲートを有する炭化珪素装置を形成する方法 | |
| CN101960606B (zh) | 碳化硅半导体器件及其制造方法 | |
| CN102820338B (zh) | 半导体装置 | |
| CN104241348B (zh) | 一种低导通电阻的SiC IGBT及其制备方法 | |
| JP6271309B2 (ja) | 半導体基板の製造方法、半導体基板および半導体装置 | |
| CN106067415A (zh) | 碳化硅半导体装置的制造方法 | |
| CN115241270A (zh) | 针对碳化硅超结功率装置的有源区设计 | |
| CN110473911B (zh) | 一种SiC MOSFET器件及其制作方法 | |
| CN1304546A (zh) | 通过受控退火制造碳化硅功率器件的方法 | |
| TW201108388A (en) | Insulated gate field effect transistor | |
| CN105047721A (zh) | 一种碳化硅沟槽栅功率MOSFETs器件及其制备方法 | |
| WO2010098076A1 (ja) | 蓄積型絶縁ゲート型電界効果型トランジスタ | |
| JP5677330B2 (ja) | 炭化珪素半導体装置およびその製造方法 | |
| JP2002025931A (ja) | 半導体素子の製造方法 | |
| JP7107284B2 (ja) | 半導体装置とその製造方法 | |
| CN105895511A (zh) | 一种基于自对准工艺的SiC MOSFET制造方法 | |
| CN111463120B (zh) | 一种碳化硅mosfet的沟道倾斜注入制备方法 | |
| JP5802492B2 (ja) | 半導体素子及びその製造方法 | |
| JP2019004010A (ja) | 半導体装置およびその製造方法 | |
| JP2011091125A (ja) | 炭化珪素半導体装置及びその製造方法 | |
| JPWO2009104299A1 (ja) | 半導体装置および半導体装置の製造方法 | |
| JP2013187291A (ja) | トンネル電界効果トランジスタの製造方法及びトンネル電界効果トランジスタ | |
| WO2019000703A1 (zh) | 一种叠层电场调制高压mosfet结构及其制作方法 |