TW201205099A - Tray unit and semiconductor device inspecting apparatus - Google Patents
Tray unit and semiconductor device inspecting apparatus Download PDFInfo
- Publication number
- TW201205099A TW201205099A TW100126932A TW100126932A TW201205099A TW 201205099 A TW201205099 A TW 201205099A TW 100126932 A TW100126932 A TW 100126932A TW 100126932 A TW100126932 A TW 100126932A TW 201205099 A TW201205099 A TW 201205099A
- Authority
- TW
- Taiwan
- Prior art keywords
- tray
- semiconductor
- semiconductor element
- test
- substrate
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 195
- 238000012360 testing method Methods 0.000 claims abstract description 110
- 239000000758 substrate Substances 0.000 claims description 93
- 238000007689 inspection Methods 0.000 claims description 56
- 230000007246 mechanism Effects 0.000 claims description 41
- 230000006837 decompression Effects 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 description 10
- 238000012546 transfer Methods 0.000 description 9
- 238000007667 floating Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- 230000002950 deficient Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000005484 gravity Effects 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 235000009827 Prunus armeniaca Nutrition 0.000 description 1
- 244000018633 Prunus armeniaca Species 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 210000003195 fascia Anatomy 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000013100 final test Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 239000005457 ice water Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010171857 | 2010-07-30 | ||
| JP2010292784A JP4765127B1 (ja) | 2010-07-30 | 2010-12-28 | トレーユニットおよび半導体デバイスの検査装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201205099A true TW201205099A (en) | 2012-02-01 |
| TWI414802B TWI414802B (enrdf_load_stackoverflow) | 2013-11-11 |
Family
ID=44693557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100126932A TW201205099A (en) | 2010-07-30 | 2011-07-29 | Tray unit and semiconductor device inspecting apparatus |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4765127B1 (enrdf_load_stackoverflow) |
| TW (1) | TW201205099A (enrdf_load_stackoverflow) |
| WO (1) | WO2012014899A1 (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI611192B (zh) * | 2015-11-27 | 2018-01-11 | 泰克元有限公司 | 電子部件測試用結合裝置 |
| TWI717595B (zh) * | 2017-04-28 | 2021-02-01 | 日商阿德潘鐵斯特股份有限公司 | 電子元件測試裝置用之載具 |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9656481B2 (en) | 2012-06-18 | 2017-05-23 | Cimpress Schweiz Gmbh | Integrated imprinting system and trays for selectively processing items on tray |
| US9156293B2 (en) | 2012-06-18 | 2015-10-13 | Cimpress Schweiz Gmbh | Manufacturing tray with customized inlays for processing different types of articles of manufacture |
| US9114645B2 (en) | 2012-06-18 | 2015-08-25 | Cimpress Schweiz Gmbh | System and method for printing on multiple different articles of manufacture by the same printing system in a conveyor system |
| EP2871059A1 (en) * | 2013-11-07 | 2015-05-13 | Vistaprint Schweiz GmbH | Conveyance printing system and method for printing on multiple different types of articles of manufacture |
| KR101611922B1 (ko) * | 2014-05-12 | 2016-04-14 | 참엔지니어링(주) | 기판 검사 장치 및 기판 검사 방법 |
| US10031178B2 (en) * | 2015-04-21 | 2018-07-24 | Keysight Technologies, Inc. | Portable vacuum chamber and an associated automated test system and method for the testing of electronic devices |
| JP6178969B1 (ja) * | 2016-08-19 | 2017-08-16 | 合同会社Pleson | トレー交換式バーンイン試験ユニット |
| JP6471401B1 (ja) * | 2017-10-31 | 2019-02-20 | 合同会社Pleson | 半導体ウエハーの試験ユニット |
| TWI694263B (zh) * | 2019-03-07 | 2020-05-21 | 雍智科技股份有限公司 | 老化測試電路板模組 |
| JP7506922B2 (ja) * | 2019-12-18 | 2024-06-27 | 株式会社クオルテック | パワーサイクル試験装置 |
| JP7523794B2 (ja) * | 2020-01-29 | 2024-07-29 | 株式会社クオルテック | 半導体素子試験装置 |
| KR102837279B1 (ko) * | 2020-07-24 | 2025-07-23 | 삼성전자주식회사 | 반도체 패키지 테스트 시스템 및 이를 이용한 반도체 패키지 제조방법 |
| KR102716715B1 (ko) * | 2021-07-22 | 2024-10-11 | 세메스 주식회사 | 테스트 핸들러의 트레이 승강 장치 |
| CN116679183A (zh) * | 2023-08-03 | 2023-09-01 | 深圳市诺泰芯装备有限公司 | 一种igbt产品的测试方法及装置 |
| CN118549781B (zh) * | 2024-04-16 | 2025-02-14 | 南通华隆微电子股份有限公司 | 一种封装二极管老化试验夹具 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2709990B2 (ja) * | 1991-09-10 | 1998-02-04 | 日立電子エンジニアリング株式会社 | Ｉｃテスターの測定治具 |
| JPH07260879A (ja) * | 1994-03-25 | 1995-10-13 | Advantest Corp | Ｉｃ試験装置のテストヘッド用インターフェイス |
| JP3825504B2 (ja) * | 1996-07-12 | 2006-09-27 | 株式会社日本マイクロニクス | 集積回路チップ用トレー |
| JP2000304808A (ja) * | 1999-04-23 | 2000-11-02 | Matsushita Electric Ind Co Ltd | 半導体装置の検査装置 |
| JP2005345262A (ja) * | 2004-06-03 | 2005-12-15 | Niigata Seimitsu Kk | 半導体検査装置およびこれに用いる被検査部品トレー |
| JP4715601B2 (ja) * | 2006-04-07 | 2011-07-06 | 住友電気工業株式会社 | 電気接続部品 |
| JP4832207B2 (ja) * | 2006-08-09 | 2011-12-07 | 富士通セミコンダクター株式会社 | プローバ装置用搬送トレイ |
| WO2008050443A1 (fr) * | 2006-10-27 | 2008-05-02 | Advantest Corporation | Plateau client et appareil de test de composant électronique |
| WO2010021038A1 (ja) * | 2008-08-20 | 2010-02-25 | 株式会社アドバンテスト | 電子部品ハンドリング装置および電子部品試験システム |
-
2010
- 2010-12-28 JP JP2010292784A patent/JP4765127B1/ja not_active Expired - Fee Related
-
2011
- 2011-07-26 WO PCT/JP2011/066981 patent/WO2012014899A1/ja active Application Filing
- 2011-07-29 TW TW100126932A patent/TW201205099A/zh not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI611192B (zh) * | 2015-11-27 | 2018-01-11 | 泰克元有限公司 | 電子部件測試用結合裝置 |
| TWI717595B (zh) * | 2017-04-28 | 2021-02-01 | 日商阿德潘鐵斯特股份有限公司 | 電子元件測試裝置用之載具 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI414802B (enrdf_load_stackoverflow) | 2013-11-11 |
| JP4765127B1 (ja) | 2011-09-07 |
| WO2012014899A1 (ja) | 2012-02-02 |
| JP2012047717A (ja) | 2012-03-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |