JP4765127B1 - トレーユニットおよび半導体デバイスの検査装置 - Google Patents

トレーユニットおよび半導体デバイスの検査装置 Download PDF

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Publication number
JP4765127B1
JP4765127B1 JP2010292784A JP2010292784A JP4765127B1 JP 4765127 B1 JP4765127 B1 JP 4765127B1 JP 2010292784 A JP2010292784 A JP 2010292784A JP 2010292784 A JP2010292784 A JP 2010292784A JP 4765127 B1 JP4765127 B1 JP 4765127B1
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JP
Japan
Prior art keywords
semiconductor device
tray
contact substrate
mounting
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2010292784A
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English (en)
Japanese (ja)
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JP2012047717A (ja
Inventor
末晴 宮川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pleson
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Pleson
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Publication date
Application filed by Pleson filed Critical Pleson
Priority to JP2010292784A priority Critical patent/JP4765127B1/ja
Priority to PCT/JP2011/066981 priority patent/WO2012014899A1/ja
Priority to TW100126932A priority patent/TW201205099A/zh
Application granted granted Critical
Publication of JP4765127B1 publication Critical patent/JP4765127B1/ja
Publication of JP2012047717A publication Critical patent/JP2012047717A/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2010292784A 2010-07-30 2010-12-28 トレーユニットおよび半導体デバイスの検査装置 Expired - Fee Related JP4765127B1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010292784A JP4765127B1 (ja) 2010-07-30 2010-12-28 トレーユニットおよび半導体デバイスの検査装置
PCT/JP2011/066981 WO2012014899A1 (ja) 2010-07-30 2011-07-26 トレーユニットおよび半導体デバイスの検査装置
TW100126932A TW201205099A (en) 2010-07-30 2011-07-29 Tray unit and semiconductor device inspecting apparatus

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010171857 2010-07-30
JP2010171857 2010-07-30
JP2010292784A JP4765127B1 (ja) 2010-07-30 2010-12-28 トレーユニットおよび半導体デバイスの検査装置

Publications (2)

Publication Number Publication Date
JP4765127B1 true JP4765127B1 (ja) 2011-09-07
JP2012047717A JP2012047717A (ja) 2012-03-08

Family

ID=44693557

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010292784A Expired - Fee Related JP4765127B1 (ja) 2010-07-30 2010-12-28 トレーユニットおよび半導体デバイスの検査装置

Country Status (3)

Country Link
JP (1) JP4765127B1 (enrdf_load_stackoverflow)
TW (1) TW201205099A (enrdf_load_stackoverflow)
WO (1) WO2012014899A1 (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019087720A (ja) * 2017-10-31 2019-06-06 合同会社Ｐｌｅｓｏｎ 半導体ウエハーの試験ユニット
JP2021117216A (ja) * 2020-01-29 2021-08-10 株式会社クオルテック 半導体試験装置および半導体素子の試験方法
JP2024107246A (ja) * 2019-12-18 2024-08-08 株式会社クオルテック 半導体試験装置

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9656481B2 (en) 2012-06-18 2017-05-23 Cimpress Schweiz Gmbh Integrated imprinting system and trays for selectively processing items on tray
US9156293B2 (en) 2012-06-18 2015-10-13 Cimpress Schweiz Gmbh Manufacturing tray with customized inlays for processing different types of articles of manufacture
US9114645B2 (en) 2012-06-18 2015-08-25 Cimpress Schweiz Gmbh System and method for printing on multiple different articles of manufacture by the same printing system in a conveyor system
EP2871059A1 (en) * 2013-11-07 2015-05-13 Vistaprint Schweiz GmbH Conveyance printing system and method for printing on multiple different types of articles of manufacture
KR101611922B1 (ko) * 2014-05-12 2016-04-14 참엔지니어링(주) 기판 검사 장치 및 기판 검사 방법
US10031178B2 (en) * 2015-04-21 2018-07-24 Keysight Technologies, Inc. Portable vacuum chamber and an associated automated test system and method for the testing of electronic devices
KR102393040B1 (ko) * 2015-11-27 2022-05-03 (주)테크윙 전자부품 테스트용 결합장치
JP6178969B1 (ja) * 2016-08-19 2017-08-16 合同会社Pleson トレー交換式バーンイン試験ユニット
JP6842355B2 (ja) * 2017-04-28 2021-03-17 株式会社アドバンテスト 電子部品試験装置用のキャリア
TWI694263B (zh) * 2019-03-07 2020-05-21 雍智科技股份有限公司 老化測試電路板模組
KR102837279B1 (ko) * 2020-07-24 2025-07-23 삼성전자주식회사 반도체 패키지 테스트 시스템 및 이를 이용한 반도체 패키지 제조방법
KR102716715B1 (ko) * 2021-07-22 2024-10-11 세메스 주식회사 테스트 핸들러의 트레이 승강 장치
CN116679183A (zh) * 2023-08-03 2023-09-01 深圳市诺泰芯装备有限公司 一种igbt产品的测试方法及装置
CN118549781B (zh) * 2024-04-16 2025-02-14 南通华隆微电子股份有限公司 一种封装二极管老化试验夹具

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0572269A (ja) * 1991-09-10 1993-03-23 Hitachi Electron Eng Co Ltd Ｉｃテスターの測定治具
JPH07260879A (ja) * 1994-03-25 1995-10-13 Advantest Corp Ｉｃ試験装置のテストヘッド用インターフェイス
JPH1024986A (ja) * 1996-07-12 1998-01-27 Nippon Maikuronikusu:Kk 集積回路チップ用トレー
JP2000304808A (ja) * 1999-04-23 2000-11-02 Matsushita Electric Ind Co Ltd 半導体装置の検査装置
JP2007278901A (ja) * 2006-04-07 2007-10-25 Sumitomo Electric Ind Ltd 電気接続部品
JP2008039666A (ja) * 2006-08-09 2008-02-21 Fujitsu Ltd プローバ装置用搬送トレイ
WO2008050443A1 (fr) * 2006-10-27 2008-05-02 Advantest Corporation Plateau client et appareil de test de composant électronique
WO2010021038A1 (ja) * 2008-08-20 2010-02-25 株式会社アドバンテスト 電子部品ハンドリング装置および電子部品試験システム

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005345262A (ja) * 2004-06-03 2005-12-15 Niigata Seimitsu Kk 半導体検査装置およびこれに用いる被検査部品トレー

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0572269A (ja) * 1991-09-10 1993-03-23 Hitachi Electron Eng Co Ltd Ｉｃテスターの測定治具
JPH07260879A (ja) * 1994-03-25 1995-10-13 Advantest Corp Ｉｃ試験装置のテストヘッド用インターフェイス
JPH1024986A (ja) * 1996-07-12 1998-01-27 Nippon Maikuronikusu:Kk 集積回路チップ用トレー
JP2000304808A (ja) * 1999-04-23 2000-11-02 Matsushita Electric Ind Co Ltd 半導体装置の検査装置
JP2007278901A (ja) * 2006-04-07 2007-10-25 Sumitomo Electric Ind Ltd 電気接続部品
JP2008039666A (ja) * 2006-08-09 2008-02-21 Fujitsu Ltd プローバ装置用搬送トレイ
WO2008050443A1 (fr) * 2006-10-27 2008-05-02 Advantest Corporation Plateau client et appareil de test de composant électronique
WO2010021038A1 (ja) * 2008-08-20 2010-02-25 株式会社アドバンテスト 電子部品ハンドリング装置および電子部品試験システム

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019087720A (ja) * 2017-10-31 2019-06-06 合同会社Ｐｌｅｓｏｎ 半導体ウエハーの試験ユニット
WO2019176238A1 (ja) * 2017-10-31 2019-09-19 合同会社Ｐｌｅｓｏｎ 半導体ウエハーの試験ユニット
JP2024107246A (ja) * 2019-12-18 2024-08-08 株式会社クオルテック 半導体試験装置
JP7668590B2 (ja) 2019-12-18 2025-04-25 株式会社クオルテック 半導体試験装置
JP2021117216A (ja) * 2020-01-29 2021-08-10 株式会社クオルテック 半導体試験装置および半導体素子の試験方法
JP7523794B2 (ja) 2020-01-29 2024-07-29 株式会社クオルテック 半導体素子試験装置

Also Published As

Publication number Publication date
TW201205099A (en) 2012-02-01
TWI414802B (enrdf_load_stackoverflow) 2013-11-11
WO2012014899A1 (ja) 2012-02-02
JP2012047717A (ja) 2012-03-08

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