TW201100347A - Thin-film solar cell - Google Patents

Thin-film solar cell Download PDF

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Publication number
TW201100347A
TW201100347A TW099114914A TW99114914A TW201100347A TW 201100347 A TW201100347 A TW 201100347A TW 099114914 A TW099114914 A TW 099114914A TW 99114914 A TW99114914 A TW 99114914A TW 201100347 A TW201100347 A TW 201100347A
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TW
Taiwan
Prior art keywords
solar cell
substrate glass
glass
substrate
less
Prior art date
Application number
TW099114914A
Other languages
English (en)
Inventor
Burkhard Speit
Eveline Rudigier-Voigt
Wolfgang Mannstadt
Silke Wolff
Original Assignee
Schott Ag
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Filing date
Publication date
Application filed by Schott Ag filed Critical Schott Ag
Publication of TW201100347A publication Critical patent/TW201100347A/zh

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    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/36Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
    • C03C17/3602Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
    • C03C17/3605Coatings of the type glass/metal/inorganic compound
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/36Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
    • C03C17/3602Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
    • C03C17/3649Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer made of metals other than silver
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/36Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
    • C03C17/3602Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
    • C03C17/3668Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating having electrical properties
    • C03C17/3678Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating having electrical properties specially adapted for use in solar cells
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/04Glass compositions containing silica
    • C03C3/076Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/11Glass compositions containing silica with 40% to 90% silica, by weight containing halogen or nitrogen
    • C03C3/112Glass compositions containing silica with 40% to 90% silica, by weight containing halogen or nitrogen containing fluorine
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C4/00Compositions for glass with special properties
    • C03C4/0092Compositions for glass with special properties for glass with improved high visible transmittance, e.g. extra-clear glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/036Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
    • H01L31/0392Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/036Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
    • H01L31/0392Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
    • H01L31/03923Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate including AIBIIICVI compound materials, e.g. CIS, CIGS
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/036Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
    • H01L31/0392Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
    • H01L31/03925Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate including AIIBVI compound materials, e.g. CdTe, CdS
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
    • H01L31/072Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type
    • H01L31/0749Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type including a AIBIIICVI compound, e.g. CdS/CulnSe2 [CIS] heterojunction solar cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/0352Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
    • H01L31/035272Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions characterised by at least one potential jump barrier or surface barrier
    • H01L31/035281Shape of the body
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/541CuInSe2 material PV cells

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  • Chemical & Material Sciences (AREA)
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  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Sustainable Energy (AREA)
  • Sustainable Development (AREA)
  • Photovoltaic Devices (AREA)
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201100347 六、發明說明: 【發明所屬之技術領域】 本發明係有關於一種薄膜太陽能電池。 【先前技術】 电ti、J个 光生伏打裝置尤其係連接至電網之光生伏打發 來市場發展關鍵取決於太陽能電池生產的成本降低潛能。在 溥膜太陽能電池生產中見到極大潛能’因為較之習知基於結 晶石夕之太陽能電池的情況,將陽光有效轉換為電力所需的光 敏f生材料顯著更少。在薄膜太陽能電池中,將光敏性半導體 材料尤其係間接半導體(諸如基於石夕的材料(此處在非晶石夕 或微晶梦或其層與結晶錢其層之間進行區 直接 體(諸如元素週絲中之II至VI _彳如CdTeg i i i VI2族(例如Cu(Ini xGax)(Sei_A)2 (α卿的高吸收性化合 物半導體)沈積於便宜且充分_的基板(例如厚度為若干 1;^層/丄时佈❼目之基板玻璃)上。成本降低潛能尤其存 低半導體材料消耗及自動化生產的高能力中。然而, ==?成之商用薄膜太陽能電池的效率仍然顯著落 ;5;二曰曰矽之太陽能電池的效率(薄膜太陽能電池:約 10 15/ί>的效率,包括石夕曰甘+人2丄口 約m8%的效率)。 基―㈣太陽能電池: 除了包括鹼石灰漂浮麵作為用於薄膜光生伏打應用之 基板玻璃的太陽能電池料,具有其他基板破_型或據稱 099114914 201100347 適合於光生伏打I置之其他基板玻璃卖員型的太陽能電池亦 為已知的。 . 加699 16 683 1'2揭露在50。〇至350。(:之溫度範圍内具有 ,6.〇 X 10 /κ至7.4 X 10·6/Κ之熱膨脹係數的用於VDu之 基板玻璃,其據稱亦適合於太陽能電池。 在ΕΡ 0879 800 Α1中揭露有作為用於太陽能集極之基板 的具有8至小於17%重量比2Ca〇、Sr〇及㈣總含量之 〇 曝曬穩定鋁矽酸鹽玻璃。 包括熱膨脹係數為6 X l〇-6/K至10 χ ι〇-6/κ之玻璃基板 的薄膜太陽能電池,尤其係基於化合物半導體之薄膜太陽能 電池在JP 1Μ35819 Α中揭露。此處之玻璃基板具有以下以 重量百分比計的組分:50至80的Si02、5至15的Al2〇3、 1 至 15 的 Na20、1 至 15 的 κ20、1 至 10 的 MgO、1 至 1〇 的 CaO、1 至 1〇 的 SrO、1 至 1〇 的 BaO、1 至 10 的 Zr02, Ο 且特徵在於大於550°C的「退火點」(在1〇13 dPas之玻璃黏 度下的溫度)。 用於薄膜光生伏打裝置尤其係基於化合物半導體的薄膜 光生伏打裝置之基板玻璃在DE 100 05 088 C1中揭露。該等 ' 玻璃之B2〇3含量為1至8%重量比,且鹼土金屬氧化物 • (MgO、CaO、SrO及BaO)之總含量為1〇至25%重量比。 【發明内容】 本發明之一目標係找到相對於先前技術而改良的薄膜太 099114914 5 201100347 陽能電池。本發明之太陽能電池亦應能夠借助於已知製程而 以較低成本生產,並且具有較高效率。 此目標係藉由包括至少一種含Na20之多組分基板玻璃的 薄膜太陽能電池達成。該含Na20之多組分基板玻璃(基板玻 璃)須至少具有以下全部特徵: -基板玻璃組分之含量為:小於1%重量比之B2〇3,小於 1%重量比之BaO’及總共小於3%重量比之CaO+SrO+ZnO, -基板玻璃組分(Na20 + K20)/(Mg0 + CaO + SrO + BaO)之 莫耳比大於0.95(即,基板玻璃含有至少Na20或K20及至 少 MgO 或 CaO 或 SrO 或 BaO), -基板玻璃組分SiCVAhO3之莫耳比小於7(即,基板玻璃 含有 Si〇2 及 AL2〇3), -基板玻璃之玻璃轉變溫度Tg(根據DIN 52324,在1014·5 dPas之玻璃黏度下的溫度)大於55〇°c,尤其大於600〇C。 出於簡單考慮,下文中,包含在隨附申請專利範圍中,薄 膜太1¼此電池將稱為太陽能電池。出於本專利申請案的目 的,術語基板玻璃亦可涵蓋頂置板玻璃。 出於本發明的目的,含NaW之多組分基板玻璃之表達方 式意謂基板玻璃可不僅含有NaaO,且亦含有其他組成組分 如 B2〇3、BaO、CaO、SrO、Ζη〇、κ2〇、MgO、Si02 及 Al2〇3, 且亦含有非氧化組分,例如陰離子束缚組分如F、p、N。 根據本發明之此類太陽能電池可借助已知製程生產,其中 099114914 6 201100347 製程參數可能必須經過調整。舉例而言,用於在基板玻璃或 在先前經塗佈之基板玻璃上生產半導體層的已知製程為依 序製程(金屬層在硫族氛圍内之反應)、共同汽化(個別元素或 元素化合物之幾乎同時汽化)及液體塗佈製程繼之以硫族氛 圍内之加熱步驟。已令人吃驚地發現,特別是在沈積半導體 層時’可使用較習知鹼石灰基板玻璃之情況下遠為更高的處 理溫度’且基板玻璃不會對於稍後之疊層製程變得不利地變 〇 形,且本發明之太陽能電池的效率較具有鹼石灰基板玻璃之 已知太陽能電池的效率高出超過2%的絕對值。 本發明人已認識到,基板玻璃之B2〇3含量若大於1%重量 比,則對太陽能電池之效率具有負面影響。硼原子估計可能 借助於汽化或擴散而自基板玻璃進入半導體内。此可能在半 導體層内引起缺陷,該等缺陷具有電活性且會導致重組增 加,因此太陽能電池之效能降低。 Ο 另一方面,在太陽能電池生產期間,小於1%重量比之BaO 含量及小於3%重量比之以下基板玻璃組分CaO、SrO及/ 或ZnO中之一者或全部(CaO + SrO + ZnO之總和<3%重量 比,較佳小於0.5%重量比)的含量對基板玻璃内之納離子的 •遷移率具有正面影響,此使得太陽能電池之效率提高。在此 * 背景下,重要的是基板玻璃組分 (Na20+K20)/(Mg0+Ca0+Sr0+Ba0)之莫耳比必須大於 0.95,較佳自>0.95至6.5,以便較已知太陽能電池提高本發 099114914 7 201100347 明之太陽能電池的效率。 本發明之太陽能電池較佳包括含有小於〇 5%重量比之 B2〇3的基板玻璃,尤其除不可避免的微量以外不包括 B2〇3。此外,本發明之太陽能電池較佳包括含有小於〇 5% 重里比之BaO的基板玻璃’尤其除不可避免的微量以外不 包括BaO。對於特定太陽能電池,基板玻璃除不可避免的微 量以外不含匕〇3及/或Ba0是有利的,尤其存在小於1〇〇〇 ppm之Ββ3及/或小於1000 ppm之Ba〇是有利的。 在本發明之另-較佳具體例中,太陽能電池包括在基板玻 璃組分内含有總共小於2%重量比之Ca〇 +⑽+ Zn〇的基 板玻璃,此在生產太陽能電池期間使得基板玻璃内之驗金屬 離子的遷移率較高,且因此帶來較有效的太陽能電池。 太陽能電池較佳包括含有至少5%重量比之叫〇、尤其含 有至少8%重量比之NazO的基板破璃。 在另-較佳具體例中,太陽能電池包括含不大於18%重量 比之Na2〇及較佳不大於16%重量比之他2〇的基板玻璃。 基板玻璃組分SKVA⑽之莫耳比較佳小於6且大於5。 減本發明’太陽能電池較佳具有_酸鹽基板玻璃,特 定言之玻璃轉變溫度Tg> 550。(:的—酸鹽基板玻璃,其包 括以下組成組分(以mol%計): 099114914 8 201100347
Si〇2 63 - 67.5 B203 0 AL203 10-12.5 Na20 8.5-15.5 K2〇 2.5-4.0 MgO 3.0-9.0 BaO 0 CaO + SrO + ZnO 0-2.5 Ti02 + Zr02 0.5-1.5 Ce02 0.02 - 0.5 AS2O3+ Sb2〇3 0-0.4 Sn02 0-1.5 F 0.05-2.6 其中以下之基板玻璃組分之莫耳比適用 Si02/Al203 5.0-6.8 Na20/K20 2.1-6.2 A1203/K20 2.5-5.0 AI2O3/N3.2O 0.6-1.5 (Na20+K20)/(Mg0+Ca0+Sr0) 0.95-6.5 此外,本發明之太陽能電池較佳具有包括以下組成組分 (以mol%計)的鋁矽酸鹽基板玻璃: 099114914 9 201100347
Si02 63-67.5 B2O3 0 Al2〇3 10-12.5 Na2〇 8.5-17 K20 2.5-4.0 MgO 3.0-9.0 BaO 0 CaO + SrO + ZnO 0-2.5 MgO + CaO + SrO + BaO 大於或等於3 T1O2 + Zr02 〇-5 ’ 特別是 〇_4,較佳 0.25-1.5 Cc〇2 0-0.5 ’ 特別是 0.02-0.5 AS2O3+ Sb2〇3 0-0.4 Sn02 0-1.5 F 〇-3 ’ 特別是 0.05-2.6 其中以下之基板玻璃組分之莫耳比適用: S1O2/AI2O3 >5 Na20/K20 2.1-6.2 al2o3/k2o 2.5-5.0 Al203/Na2〇 0.6-1.5 (Na2〇+K2〇)/(Mg〇+CaO+SrO) >0.95 除了此等較佳組合物以外’基板玻璃可另外含有玻璃生產 中常見的其他組分’例如常規量的其他精製劑,特定言之高 099114914 10 201100347 達1.5%重量比之硫酸鹽及/或高達i%重量比之氯化物。 此外’太陽能電池必須具有熱膨脹係數处⑽⑻在 3〇〇°C之溫度範圍内大於7.5 X 1〇_6/Κ(尤其自8.0 X 1〇-6欠 至9.5 X ΐ〇·6/κ)的基板玻璃。因此,已發現使基板破螭之熟 膨脹係數與光敏性半導體層(舉例而言,CiGS層)之熱膨胳 係數匹配是有利的。 在本發明之特定具體例中,太陽能電池具有在25。〇下導 〇電率大於17 x l〇_12S/cm的基板玻璃,其中基板破螭在 25〇C下之導電率較基板玻璃在25〇C下之導電率大1〇4倍, 較佳大105倍,且特佳大1〇6倍。 若根據本發明生產基於矽或基於CdTe的薄膜太陽能電 池’則所描述之基板玻璃較佳尤其適合,因為在此等基板玻 璃之情況下’離子可交換,較铺由化學途徑錢。因此, 在此等情況下不合意的納離子可容易由其它離子(例如,裡 Ο離子或鉀料)#代。目此,料基板柄亦適合於其中添 力Na作為摻雜劑(例如作為獅2)的特殊c⑽太陽能電 池因為其歸因於離子交換表面而具有内在的⑽障壁,而 .無須施力^另-層作為障壁層。出於此目的,舉例而言,將基 板玻璃浸至鉀鹽炼融物内(例如,彻。C至別。^下的 溶融物)達特疋時間,該特定時間本質上取決於基板内之交 換層的厚度,例而言,若在彻。CT執行浸人達料時, 表面木又為至夕20 μιη且在納離子位點上具有卸離子的 099114914 11 201100347 幾乎不含納離子的表面層在基板坡璃之表面上形成。 離子交換之此等性㈣可用於對根據本發明之此等太陽 能電池之防斷裂覆蓋玻璃的使用’其中藉由以較大鉀離子取 代較小娜子而在表面中產生賴應力,且此在透明度不變 的情況下顯著改良覆蓋玻璃的機械強度。 在本發明之太陽能電池中,基板玻璃至20解之表面深度 之納離子因此較佳至少部分地由其他陽離子(特別是卸離子) 取代’從而使得表㈣内之鈉離子含量較基板玻璃之總納離 子含量減小。 根據本發明之太陽能電池之基板玻璃較佳塗佈有至少一 層鉬層,該鉬層較佳具有0.25 μηι至3 〇 Mm的厚度,特佳 0.5 μηι 至 1.5 μιη 的厚度。 該太陽能電池較佳為基於矽的薄膜太陽能電池,或基於化 合物半導體材料(舉例而言,CdTe、CIS或CIGS)的薄膜太 陽能電池。 此外,已發現該太陽能電池可為平面、彎曲、球形或圓柱 形薄膜太陽能電池。 本發明之太陽能電池較佳為基本上平面(平坦)的太陽能 電池或基本上管狀的太陽能電池,較佳使用平坦的基板玻璃 或管狀的基板玻璃。本發明之太陽能電池原則上在其形狀方 面或基板玻璃之形狀方面不受任何限制。 在管狀太陽能電池之情況下,太陽能電池之管狀基板玻璃 099114914 12 201100347 之外直徑較佳為5至100 mm,且管狀基板玻璃之壁厚度較 佳為0.5至1〇 mm。 在本發明之另一較佳具體例中,太陽能電池具有功能層。 太陽能電池之功能層較佳包括傳導且透明傳導材料、感光性 化合物半導體材料、緩衝材料及/或金屬後部觸點材料。若 至少兩個太陽能電池串列連接,則形成薄膜光生伏打模組, 且其藉由囊封’特別是藉由以si〇2、塑膠及薄膜(例如 O EVA(乙烯醋酸乙烯醋))、表面塗層或/及其他基板玻璃囊封 而保護該模組免受環境影響。該其他基板玻璃可為與太陽能 電池内已存在的基板玻璃相同的基板玻璃,或者可為另一基 板玻璃’例如已藉由離子交換而被預加應力的基板玻璃。 太陽能電池較佳具有至少一個光敏性半導體,其已在 >550 C之溫度下施加於基板玻璃或先前塗佈之基板玻璃。此 度較佳低於基板玻璃之玻璃轉變溫度。 Ο 如下文將舉例說明,太陽能電池較佳為基於化合物半導體 的薄膜太陽能電池。 根據本發明之基於II-VI或I-III-VI化合物半導體(例如 CdTe或通式為Cu(Ini-xGaX)(Si-ySey)2的CIGS)之薄膜太陽能 電池較先前技術具有較佳結晶度,且因此具有增加之開路電 - 壓及較高效率。 以薄層/多層之封裝的形式施加於基板玻璃之此等化合物 半導體滿足重要先決條件,諸如在CIGS的情況下,藉由使 099114914 13 201100347 三元化合物混合而與陽光之光譜極佳匹配的之能帶隙(1.0 < Eg < 2.0 eV)以及入射光之高吸收率(吸收係數> 2χ lOYm·1),以使其用於太陽能電池。 容易可變之CuGnkGaxXS^ySeyh組合物的薄多晶層/多層 之封裝原則上可藉由一系列製程(例如,元素之同時氣相沈 積、藏鏟繼之以反應氣體步驟、CVD、MOCVD、共同汽化、 電沈積或液體沈積繼之以硫族氛圍内之加熱步驟等)在多個 階段中生產。由此,CIGS層/多層之封裝具有内在p傳導。 隨後,此類材料系統中之p/n接面藉由引入薄缓衝層(例如, 具有若干奈米之厚度的CdS層或類似層)及隨後沈積之η傳 導透明氧化物(TCO=透明傳導氧化物,例如ζη〇或ζη〇(Α1)) 而形成。為避免寄生吸收,緩衝層製造得非常薄,而TC〇 層另外必須具有高導電率,以便確保電流之幾乎沒有損失的 輸出。 以實驗規模或生產規模生產的Cu(Ini你撕丨為)2單元 的效率目前在10%至15%的範圍内。由以單體積體方式串 列連接之個別太陽能電池組成的常規模組結構具有大約60 X 120 cm2的尺寸,同時確保整個模組區域上各層的均質性 (厚度、組成)。 【實施方式】 圖1舉例展示根據本發明之具有基於 CuCIiM—xGaxXSi-ySey)2之pn異質接面之平面薄膜太陽能電池 099114914 14 201100347 的示意結構。 在圖1所示之一個具體例中,藉由漂浮製程(fl0atpr〇cess) 生產具有玻璃2之組成及632T:之Tg的基板玻璃(見表2), 且借助於燒結碳化物切割工具將該基板玻璃切割成片。以標 準工業製程清潔以此方式獲得之基板玻璃板,且用以下層系 統塗佈該基板玻璃板:基板玻璃/後部觸點(鉬,經由濺鍍技 術)/吸收劑(CIGS,已借助於濺鐘施加金屬層,且隨後借助 〇 於「快速熱處理」(簡稱MP,T退火> 550。〇在含硫族元素之 氛圍中反應)/緩衝層(CdS,經由化學浸泡沈積)/窗口層 (i-Zn〇/ZnO: A卜經由濺鍍技術)。依據具體例(模組或太陽能 電池),經由各種中間構造步驟或藉由網版印刷施加之前網 格達成積體串列連接。與習知鹼石灰玻璃基板上之太陽能電 池相比,以此方式達成高出15%的效率(具有鹼石灰玻璃基 板之太陽能電池的效率=15.5%,具有玻璃2作為基板玻璃 °之太陽能電池的效率=18%)。借助於太陽模擬器經由電流一 電位曲線判定效率。 圖2基本上展示圖1之結構,其中由複數個串列連接之薄 層太陽能電池構成之薄膜太陽能模組藉由囊封受到免於環 . 境影響的保護。在特定具體例中,障壁層(舉例而言,SiN, — 經由濺鍍技術)可施加於基板玻璃與後部觸點層之間,而且 含Na之中間層(舉例而言,NaF,經由氣相沈積)可施加於後 部觸點層與吸收劑層之間;後者在圖2中未展示。圖2中之 099114914 15 201100347 另外之層對應於圖1之另外層。為執行囊封,將叠層薄膜(兴 例而言,EVA薄膜)及硬化市售覆蓋玻璃(舉例而言,低鐵鹼 石灰玻璃)定位於具有積體串列連接之模組上,且在熱固化 步驟中敷設並隨後疊層。典型疊層溫度在5〇至2〇(rc的範 圍内。 圖3原則上展示與圖1中相同之化合物半導體的層結構, 但位於作為基板玻璃之内玻璃管(管直徑約為15_18 mm)的 表面上,該表面上隨後塗佈有位於具有較大直徑(约25mm) 之另一外部玻璃管内的太1%能電池,該内部管與外部管之間 具有合適的填充液體(例如,聚矽氧油),且安裝於外部管 中。為了提高效率,在陰影中可能必須有位於管後方的反射 白表面。 如例如根據文件DE 196 16 633 C1及DE 196 16 679 C1 已知,基板玻璃較佳包括鋁矽酸鹽玻璃,只要其滿足申請專 利範圍第1項之特徵,且其熱膨脹係數α20/300與半導體的熱 膨脹係數匹配。將觸點層(此處為金屬鉬)施加於基板玻璃。 實際光敏性半導體位於其上^在此之上施加(舉例而言)Cds 之緩衝層’且在此之上施加窗口(此處為透明傳導層 (TCO)),陽光可穿過此窗口到達半導體。 合適基板玻璃必須滿足之一重要要求源自在塗佈製程中 常用的溫度。為了達成高沈積速率或非常良好的層結晶品 質’ Cup^-xGaxXS^ySey)2之相位圖指示必須有高於至少 099114914 201100347 550°C的溫度。較高溫度(特定言之’高於咖。c的溫度)在沈 魏料㈣果。由於待塗佈之 基板玻璃大體上位置非常靠近輻㈣,在特定频例中懸浮 於塗佈製程中使用之汽化源上,所以基板破璃應具 • 的耐熱性,即,作為大概的準則,玻璃之根據DIN 52 324 的玻璃轉變溫度(Tg)相應地應高於至少55(rc ^ τ愈高,其 板玻璃在接近於Tg之溫度下之塗佈期 〇 低於&之處理溫度亦防止因快速冷卻而將應力引入至基板 玻璃内,且因此引入至層系統内,通常在CIGS塗佈製程中 會出現此情況。 不僅須考慮到玻璃轉變溫度(Tg),而且須考慮到直至軟化 溫度(ST)(根據画52 3 i2將其定義為破璃在i 〇7.6心之玻 璃黏度下的溫度)之黏度表現’ Tg# ST之間非常大的差異 (「長玻璃」)減少了基板在高於6G()t:之塗佈溫度下熱變形 〇 的風險。 為了防止在塗佈製程之後在冷卻時層㈣分裂,基板玻璃 亦必須與後部觸點的熱膨脹(舉例而言,鉬,約5 X 1〇_6/κ) 匹配,且甚至更佳與沈積於其上的半導體層(舉例而言,對 於CIGS約為8.5 χ 10-6/κ)匹配。此外,已知可將納併入於 半導體内1便隨改良之硫族元讀人半導體之晶體結構 内而提高太陽能電池的效率。因此,基板_不僅應充當支 撐材料’而且具有額外功能:即在時間及鋼之實體位置(在 099114914 17 201100347 塗佈區域上同質地)兩方面之目標性釋放。玻璃應在約Tg之 溫度下釋放鈉離子/原子,此需要玻璃中之鈉離子之增高的 遷移率。作為替代方案,在以鉬塗佈之前,可將徹底防止鈉 離子擴散的障壁層(例如,Al2〇3層)施加於玻璃表面。隨後 必須在進一步的製程步驟中單獨添加納離子(例如,以NaF2 形式),此增加處理時間及成本。此外,必須注意針對因太 陽能電池之通常選址(戶外)之環境影響(特定言之,水(濕 氣、潮濕、雨))的足夠耐化學性,以及針對生產製程中可能 使用之其他侵蝕性試劑的足夠耐化學性。藉由以Si02、塑 膠、表面塗佈及/或覆蓋玻璃之囊封而保護層本身免受環境 影響。 下表1展示與先前技術相比用於CIGS薄膜太陽能電池之 基板玻璃的性質,該等基板玻璃適合於本發明之太陽能電 池。 099114914 18 201100347 [表1] 性質 P'----- 單位/量測 參數 基板玻璃 先前技術, 鹼石灰基板 玻璃 相對於先前技術 之優點 熱膨服係數α2〇/300 xlO'6/K 7.5-9.5 7.3 與Mo之熱膨脹 匹配(aciGSe= 8.5) 玻璃轉變溫度Tg °c >600 儘可能高 555 根據相位圖與熱 沈積製程匹配 軟化溫度ST °c 900-1000 850 防止在約Tg之溫 度下變形 塗佈期間最大基板 玻璃溫度 °c >600 530 半導體之晶體生 長條件的改良 玻璃之鈉離子含量 重量百分比 >10 >11 高含量及高納離 子遷移率 水解類(DIN) 盹每g之Na20 均等物 <2 <3 優於鹼石灰玻璃 B2O3、CaO、BaO、 AS2O3、Fe2〇3 之含量 重量百分比 不含B、Ba、 As、Fe 含 B ' Ca、Fe 製程中無半導體 毒物 令人吃驚的是,不含硼及鋇的鋁矽酸鹽玻璃尤其符合用作 薄膜光生伏打裝置之基板玻璃的要求,因為(舉例而言)在高 溫CIGS生產技術中,在塗佈期間到達高達7〇〇。〇之基板玻 璃溫度。特定言之,借助於基板玻璃之根據本發明的性質, Q 達成較先前技術之薄膜太陽能電池效率高2%絕對值之 CIGS薄膜太陽能電池效率,即,達成14%之效率,而非(舉 例而言)使用習知基板玻璃之12〇/0的效率。 亦已令人吃驚地發現,當使用驗金屬及/或驗土金屬組分 之硝酸鹽(例如,KNO3、Ca(N03)2)時’此等玻璃在氧化條件 下溶化時在氣泡含量方面具有高均質性。 借助於肉眼在邊緣長度為10 cm之拋光玻璃立方體内計 算較大氣泡(即’肉眼可看見的氣泡(直徑>80 μηι))。借助於 099114914 19 201100347 顯微鏡在榻测倍之放大率下在具有良好表面拋光之ι〇 cmXl〇cmx0.lcm玻璃板上量測/計算較小氣泡之尺寸及數目。 可在下表2中找到實例(玻璃之組成以福%計)。該等玻 璃由習知原始材料(即組分之碳酸鹽、硝酸鹽、I化物及氧 化物)在4公升朗銷内溶化而來。在158〇t:之溶融溫度下 在8小時之期間内引人原始材料,且隨後在此溫度下維持 14小時。隨後’將玻璃炼融物在8小時之期間内邊擾摔邊 冷部至14G0°C ’且隨後洗鑄入預熱至則。〇的石墨模具内。 將此也鑄模具在洗鑄之後立即引人至已預熱至㈣。c之冷 部爐内’且在5°C/min下冷卻至室溫。隨後自此塊内切除量 測時所必需的玻螭試樣。 除了判定典型玻璃性質之已知方法以外,對於導電率之列 定在此特別重要。使用Firma N〇v〇c〇ntr〇1, Umburg出品之 阻抗質譜儀α分析器及相關溫度控制單元執行介電量測。在 量測中’在具有傳導銀觸點之兩侧上提供直徑為通常40 mm 且厚度為約0·5至2 mm之玻璃試樣的通常為圓形的板。借 助於試樣固持器内之鑛金銅觸點自上方及下方夾緊試樣,且 將其置放於m溫器内。隨後,可藉由橋接器之平衡而作 為頻率及溫度之函數量測該配置的電阻及電容。在已知幾何 形狀之情況下’隨後可判定材料的導電率及介電常數。 表2 :適合於本發明之太陽能電池之基板玻璃之以m〇1% 計的玻璃組成、莫耳比及性質的實例。 099114914 20 201100347 組成 玻璃1 玻璃2 破璃3 玻璃4 玻璃5 玻璃6 玻璃7 Si02 65.04 67.32 63.6 63.67 66.26 66.83 66.36 ai2o3 10.1 11.18 11.91 9.94 10.91 10.91 12.28 Na2〇 8.66 13.58 12.49 15.82 11.3 11.3 12.82 K20 2.68 3.17 3.48 2.89 3.82 3.82 3.82 MgO 8.62 3.29 6.51 3.97 3.25 3.25 3.25 BaO 0 0 0 0 0 0 0 B2〇3 0 0 0 0 0 0 0 CaO + SrO + BaO + ZnO 1.25 0.24 0.47 0.14 0.12 0.12 0.24 Sn〇2 1.0 0 0 0.15 0 0 0.15 Ti〇2+Zr〇2 1.19 0.54 0.66 0.64 1.23 0.66 0.54 〇 Ce〇2 0.06 0.46 0.02 0.15 0.19 0.19 0.15 f2 1.41 0.09 0.51 2.53 2.59 2.59 0.22 AS2O3 + Sb2〇3 0 0.17 0.35 0.05 0.33 0.33 0.17 Si02/Al203 6.44 6.02 5.34 6.41 6.07 6.13 5.40 (Na20+K20)/(Mg0+Ca0+ SrO+BaO) 1.15 4.75 2.3 4.55 4.5 4.5 4.75 性質 玻璃1 玻璃2 玻璃3 玻璃4 玻璃5 玻璃6 玻璃7 α20/30〇Χ l〇 6 /K) 8.2 8.9 9.1 9.5 9.1 9.1 8.9 Tg(°C) 595 632 618 565 573 579 626 ST (°C) 832 863 845 811 821 822 860 Δ ST-Tg 237 231 227 246 248 243 234 〇 導電率(S/cmxl(T12,25t:) 16.8 2.1 4.6 0.71 5.9 4,9 3.8 導電率(S/cmxlO·6,250°C) 9.7 2.8 2.3 1.2 3.2 3.4 2.9 在所有說明性玻璃上量測之室溫(典型玻璃值在25¾下在 10·14至l(T17S/cm之範圍内)下相對高導電率、導電率之高溫 依賴性及<1 eV的低活化能是此等基板材料之高鈉離子遷 移率的度量。此外,自阿瑞尼曲線圖(圖4,實例2 =玻璃2, 實例3 =玻璃3)中之導電率之溫度依賴性之線性表現可看 出,雖然亦存在大量K+ ’但僅一種物質(即Na+)決定導電率。 099114914 21 201100347 該等玻璃不僅優於先前技術可在約l〇〇°C-i5〇°c之溫度下 不變形地使用,而且據發現歸因於納離子遷移率提高,該等 玻璃對於例如I-III-V〗2化合物半導體(如ciGS)之結晶製程 而言是可靠的摻雜劑來源,此等化合物半導體因此可在約高 出100C-150C之溫度範圍内生長至較高之完整度。 :¾考慮到鋼離子在到達結晶區域之前必須擴散穿過基板 玻璃上之0.5-1 μηι厚的鉬層,及/或必須作為鈉原子自氣相 行進至生長中之半導體層内,則此高遷移率是化合物半導體 層(特定言之,CIGS層)之結晶生長及隨後可達成之光生伏 打性質的先決條件。 鈉離子對於半導體晶體内之硫族元素之併入的正面影響 不僅產生改良之結晶結構,而且晶體密度影響結晶尺寸及導 向。納離子尤其併人至系統之晶界内,且尤其可有助於減少 晶界處之電荷載流子重組。此等現象自動產生顯著改良之半 導體性質’尤其,引起塊材内之重組的減少,且因此引起開 路電位提高。特定言之,此自紐示出太陽光譜可轉換為; 力之效率的提高。 基板玻璃内之此離子遷移率進而可以正面方式較佳為至 酸性溶液或鹼性溶液内之表面處理的影響, 二 1 . ^ 干巧肉s,以以 式受到影響:離子遷移率在相對高溫下較早發生 在納離子自表面之均—擴散或鈉自表面之更均—I發或存 此外,已令人吃驚地發現,當太陽能電池且 '、3生少一個含 099114914 22 201100347
NaaO之多組分基板玻璃時,可以簡單方式達咸薄臈太陽能 電池之效率的顯者提面’該基板玻璃具有申請專利範圍第1 項之特徵且未經相位反混合,且具有25至8〇 mM〇1/i之 β-ΟΗ含量。如申請專利範圍第【項之特徵:含Na2〇之多 • 組分基板玻璃含小於1%重量比之^〇3、小於1%重量比之 BaO及總共小於3%重量比之Ca〇 + Sr〇 + Zn〇 ;基板玻璃 組分(Na20+K20)/(Mg0+Ca0+Sr0+Ba0)之莫耳比大於 〇 0.95 ;基板玻璃組分SKVAhO3之莫耳比小於7 ;且基板玻 璃之玻璃轉變溫度Tg大於550°c,尤其大於600t:。 當基板玻璃在調節實驗之後在100 X 100 nm2之表面區域 内具有少於10個且較佳少於5個表面缺陷時’出於本發明 之目的’基板玻璃未經相位反混合。調節實驗如下執行: 待檢驗之基板玻璃表面在500-600X:下在5至20分鐘之時 間内經受15至50ml/min之範圍内之壓縮空氣流及5至 O 25ml/mm之範圍内之二氧化硫氣體(so2)流。無論玻璃類型 如何’此引起在基板玻璃上形成結晶塗層。在洗掉該結晶塗 層(例如’借助於水或酸性或鹼性水溶液,使得表面不再受 知:姓)之後,錯由顯微法判定每早位面積之基板玻璃表面的 • 表面缺陷。若在100 X 100 nm2之表面區域内存在少於10 • 個’尤其是少於5個表面缺陷,則認為基板玻璃未經相位反 混合。計算所有直徑大於5 nm的表面缺陷。 如下判定基板玻璃之β-OH含量。用於經由2700 nm下之 099114914 23 201100347 OH拉伸振動對水作出定量判定的裝置為具有附帶電腦評價 之商用Nicolet FTIR質譜儀。首先量測2500-6500 nm之波 長範圍内的吸收率,且判定2700 nm下之吸收率最大值。隨 後根據試樣厚度d、純透射率乃及反射因數P計算吸收係数 a= l/dlgG/Ti) [cm·1],其中 Ti = T/P,T 為透射率。
U〇 rank 此外,根據c = α/e計算水含量,其中e為實際 [Pmorkcm·1],且對於上述評價範圍用作e l*mol kcm·1的恆定值(基於H20之mol)。e值取自η. p
及 H. Scholze 在「GlastechnischenBerichten」(第 36 卷, 9期,第350頁)中的著作。 【圖式簡單說明】 圖1 舉例展不根據本發明之具有我
Cu(Ini_xGax)(Si-ySey)2之Pn異質接面之平面薄膜太陽能曾、 的不意結構。 圖2基本上展示圖1之結構,其中由複數個串列連接< ★ 層太1%能電池構成之薄膜太陽能模組藉由囊封受到免於如 境影響的保護。 圖3原則上展示與圖!中相同之化合物半導體的層結構 但位於作為基板玻璃之内玻璃管(管直徑約為15_18 * ^ , 录面上。 圖4為玻璃2和玻璃3之阿瑞尼曲線圖。 099114914 24

Claims (1)

  1. 201100347 七、申請專利範圍: 1· 一種薄膜太陽能電池,其包括至少一含Na2〇的多組分 基板玻璃, 其中’該基板玻璃含小於l〇/Q重量比之B2〇3,小於1%重 罝比之Ba〇及總共小於3%重量比之CaO + SrO + ZnO, 基板玻璃組分(Na20+K20)/(Mg0+Ca0+Sr0+Ba0)之莫耳 比大於0.95, 0 基板玻璃組分Si02/Al203之莫耳比小於7,且 該基板玻璃之玻璃轉變溫度Tg大於55CTC,尤其大於 600〇C。 2. 如申請專利範圍第1項之太陽能電池,其中, 該基板玻璃含小於0.5%重量比之^2〇3,尤其除不可避免 的微量外不含b2o3。 3. 如申請專利範圍第1項之太陽能電池,其中, 〇 該基板玻璃含小於〇·5%重量比之Ba〇,尤其除不可避免 的微1外不含BaO。 4. 如申請專利範圍第1項之太陽能電池,其中, 該基板玻璃含總共小於2%重量比之Ca〇 + Sr〇 + Zn〇。 < 5.如申請專利範圍第1項之太陽能電池,其中, - 該基板玻璃含至少5%重量比之Nko,尤其含至少8%重 量比之Na20。 6.如申請專利範圍第1項之太陽能電池,其中, 099114914 25 201100347 該等基板玻璃組分(Na20+K20)/(Mg0+Ca0+Sr0+Ba0)之 莫耳比小於6.5。 7. 如申請專利範圍第1項之太陽能電池,其中, 該等基板玻璃組分Si02/Al203之莫耳比小於6且大於5。 8. 如申請專利範圍第1項之太陽能電池,其中, 該基板玻璃在2CTC至300。(:之溫度範圍内之熱膨脹係數 〇t2〇/3〇。大於 7.5 X ΐ(Τ6/κ,尤其為 8.0 X 1〇·6/Κ 至 9.5 X 10-6/Κ。 9.如申請專利範圍第丨項之太陽能電池,其中, 該基板玻璃在25°C下之導電率大於i7xl(T12s/cm,且該基 板玻璃在25(TC下之導電率較該基板玻璃在25。〇下之導電 率大1〇4倍,較佳大105倍,且特佳大106倍。 10.如申請專利範圍第1項之太陽能電池,其中, δ亥基板玻璃内至20 μιη之表面深度之鈉離子至少部分地 由其他陽離子特別Μ離子取代,從而使得表面層内之納離 子含量較該基板破璃之總鈉離子含量減小。 11.如申請專利範圍第丨項之太陽能電池,其中, 該基板玻璃包括以下以m〇l%計的組成組分: Si02 ai2o3 Na20 K20 MgO 63 - 67.5 10-12.5 8.5- 15.5 2.5- 4.0 3.0-9.0 099114914 26 201100347
    CaO + SrO + ZnO 0-2.5 Ti02 + Zr02 0.5-1.5 Ce02 0.02 ~ 〇>5 AS2O3+ Sb2〇3 0-0.4 Sn02 0-1.5 F 0.05-2.6 其中以下之基板玻璃組分之莫耳比適用: Si02/Al203 5-〇-6.8 Na20/K20 2-1-6.2 ai2o3/k2o 2.5-5.0 Al203/Na20 Ο.6-Ι.5 (Na20+K20)/(Mg0+Ca0+Sr0) 0.95-6.5 . 12.如申請專利範圍第i項之太陽能電池,发 該基板玻璃塗佈有至少一層顧層, μπι厚’且特佳為0 5至1 5 μηι厚。 該層較佳為〇 2s .0 13.如申請專利範圍第1項之太陽能電池,其中, % 該太陽能電池為基於矽的薄膜太陽能電池,或基於 Ο 半導體材料諸如CdTe、CIS或CIGS的薄臈太陽能=各 14·如申請專利範圍第1項之太陽能電池,其中, 該太陽能電池為平面、彎曲'球形或圓柱形薄膜太陽能電 池0 15. 如申睛專利範圍第1項之太陽能電池,其中, 該太陽能電池具有包括傳導且透明傳導材料、感光性化合 物半導體材料、緩衝材料及/或金屬後部觸點材料的功能層。 16. 如申睛專利範圍第丨項之太陽能電池,其中, 099114914 27 201100347 至少兩個太陽能電池串列連接以形成光生伏打模組,且藉 由特別是以Si02、塑膠、尤其是EVA(乙烯醋酸乙烯酯)、表 面塗層及/或其他基板玻璃囊封而受到免於環境影響的保 護。 17. 如申請專利範圍第1項之太陽能電池,其中, 該太陽能電池具有至少一光敏性半導體,該光敏性半導體 已在大於550°C之溫度下施加於該基板玻璃或先前塗佈之 基板玻璃。 18. 如申請專利範圍第1項之太陽能電池,其中, 該基板玻璃未經相位反混合,且具有25至80 mMol/1之 β-ΟΗ含量。 099114914 28
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KR20100122466A (ko) 2010-11-22
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JP4944977B2 (ja) 2012-06-06
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