TW201039958A - Component having an overlapping laser track - Google Patents

Component having an overlapping laser track Download PDF

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Publication number
TW201039958A
TW201039958A TW099108082A TW99108082A TW201039958A TW 201039958 A TW201039958 A TW 201039958A TW 099108082 A TW099108082 A TW 099108082A TW 99108082 A TW99108082 A TW 99108082A TW 201039958 A TW201039958 A TW 201039958A
Authority
TW
Taiwan
Prior art keywords
laser
component
scope
trace
perforations
Prior art date
Application number
TW099108082A
Other languages
English (en)
Chinese (zh)
Inventor
Claus Peter Kluge
Thomas Karl
Kunibert Reiss
Original Assignee
Ceramtec Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ceramtec Ag filed Critical Ceramtec Ag
Publication of TW201039958A publication Critical patent/TW201039958A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/52—Ceramics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/56—Inorganic materials other than metals or composite materials being semiconducting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/15—Sheet, web, or layer weakened to permit separation through thickness

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Golf Clubs (AREA)
  • Conveying And Assembling Of Building Elements In Situ (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Producing Shaped Articles From Materials (AREA)
TW099108082A 2009-03-31 2010-03-19 Component having an overlapping laser track TW201039958A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102009015087 2009-03-31

Publications (1)

Publication Number Publication Date
TW201039958A true TW201039958A (en) 2010-11-16

Family

ID=42229244

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099108082A TW201039958A (en) 2009-03-31 2010-03-19 Component having an overlapping laser track

Country Status (18)

Country Link
US (1) US8822003B2 (https=)
EP (1) EP2414132B1 (https=)
JP (1) JP5661733B2 (https=)
KR (1) KR20120004498A (https=)
CN (1) CN102448659B (https=)
BR (1) BRPI1012662A2 (https=)
CA (1) CA2757229A1 (https=)
DE (1) DE102010003314A1 (https=)
DK (1) DK2414132T3 (https=)
ES (1) ES2625308T3 (https=)
IL (1) IL215452A0 (https=)
MX (1) MX2011010284A (https=)
MY (1) MY156815A (https=)
PT (1) PT2414132T (https=)
RU (1) RU2542056C2 (https=)
SG (1) SG174996A1 (https=)
TW (1) TW201039958A (https=)
WO (1) WO2010112412A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102848084B (zh) * 2012-09-28 2015-09-16 合肥彩虹蓝光科技有限公司 一种具有不同切割深度的发光原件切割方法
US20150364374A1 (en) * 2014-06-12 2015-12-17 Toshiba Corporation Semiconductor Device Die Singulation by Discontinuous Laser Scribe and Break
EP3023397A1 (de) * 2014-11-24 2016-05-25 Manz AG Verfahren zum Abtrennen eines Teils eines spröden Materials
CN106932944B (zh) 2017-04-28 2020-06-30 上海天马有机发光显示技术有限公司 一种显示面板及其制作方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3583279B2 (ja) * 1998-01-13 2004-11-04 三菱電機株式会社 穴あけ加工方法
US20050263854A1 (en) * 1998-10-23 2005-12-01 Shelton Bryan S Thick laser-scribed GaN-on-sapphire optoelectronic devices
JP2003002677A (ja) * 2001-06-22 2003-01-08 Seiko Epson Corp レーザ割断用支持テーブル、レーザ割断装置、レーザ割断方法、及び、液晶パネルの製造方法
JP2003320466A (ja) * 2002-05-07 2003-11-11 Disco Abrasive Syst Ltd レーザビームを使用した加工機
JP2004063803A (ja) * 2002-07-29 2004-02-26 Ngk Spark Plug Co Ltd プリント配線基板の製造方法、プリント配線基板製造用金属板、連結プリント配線基板
JP2005209719A (ja) * 2004-01-20 2005-08-04 Disco Abrasive Syst Ltd 半導体ウエーハの加工方法
JP3908236B2 (ja) 2004-04-27 2007-04-25 株式会社日本製鋼所 ガラスの切断方法及びその装置
JP2006319198A (ja) * 2005-05-13 2006-11-24 Disco Abrasive Syst Ltd ウエーハのレーザー加工方法およびレーザー加工装置
CN101341100A (zh) * 2005-12-29 2009-01-07 H2B光电技术有限公司 用于分离加工脆性材料构件的装置
TWI449137B (zh) * 2006-03-23 2014-08-11 製陶技術創新製陶工程股份公司 構件或電路用的攜帶體
WO2008062496A1 (en) * 2006-10-31 2008-05-29 Kyocera Corporation Ceramic member, method of forming groove in ceramic member, and substrate for electronic part
JP2008198905A (ja) * 2007-02-15 2008-08-28 Hitachi Metals Ltd セラミックス基板及びセラミックス回路基板の製造方法並びに集合基板と半導体モジュール
DE102008043539A1 (de) * 2007-11-07 2009-05-14 Ceramtec Ag Verfahren zum Laserritzen von spröden Bauteilen
JP5230240B2 (ja) * 2008-04-04 2013-07-10 芝浦メカトロニクス株式会社 レーザ加工装置

Also Published As

Publication number Publication date
RU2542056C2 (ru) 2015-02-20
WO2010112412A1 (de) 2010-10-07
MX2011010284A (es) 2011-12-08
US20120015129A1 (en) 2012-01-19
CA2757229A1 (en) 2010-10-07
JP5661733B2 (ja) 2015-01-28
SG174996A1 (en) 2011-11-28
RU2011143585A (ru) 2013-05-10
IL215452A0 (en) 2011-12-29
DE102010003314A1 (de) 2010-10-07
DK2414132T3 (en) 2017-06-26
ES2625308T3 (es) 2017-07-19
CN102448659B (zh) 2015-10-21
BRPI1012662A2 (pt) 2016-04-05
CN102448659A (zh) 2012-05-09
JP2012521895A (ja) 2012-09-20
KR20120004498A (ko) 2012-01-12
MY156815A (en) 2016-03-31
PT2414132T (pt) 2017-04-24
EP2414132B1 (de) 2017-03-22
US8822003B2 (en) 2014-09-02
EP2414132A1 (de) 2012-02-08

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