KR20120004498A - 겹쳐지는 레이저 트랙을 가지는 부품, 및 이 같은 부품을 생산하기 위한 방법 - Google Patents

겹쳐지는 레이저 트랙을 가지는 부품, 및 이 같은 부품을 생산하기 위한 방법 Download PDF

Info

Publication number
KR20120004498A
KR20120004498A KR1020117025967A KR20117025967A KR20120004498A KR 20120004498 A KR20120004498 A KR 20120004498A KR 1020117025967 A KR1020117025967 A KR 1020117025967A KR 20117025967 A KR20117025967 A KR 20117025967A KR 20120004498 A KR20120004498 A KR 20120004498A
Authority
KR
South Korea
Prior art keywords
laser
track
parts
laser track
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020117025967A
Other languages
English (en)
Korean (ko)
Inventor
쿠니베르트 라이스
토마스 카를
클라우스 페터 크루게
Original Assignee
세람테크 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세람테크 게엠베하 filed Critical 세람테크 게엠베하
Publication of KR20120004498A publication Critical patent/KR20120004498A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/52—Ceramics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/56—Inorganic materials other than metals or composite materials being semiconducting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/15—Sheet, web, or layer weakened to permit separation through thickness

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Golf Clubs (AREA)
  • Conveying And Assembling Of Building Elements In Situ (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Producing Shaped Articles From Materials (AREA)
KR1020117025967A 2009-03-31 2010-03-26 겹쳐지는 레이저 트랙을 가지는 부품, 및 이 같은 부품을 생산하기 위한 방법 Ceased KR20120004498A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009015087 2009-03-31
DE102009015087.0 2009-03-31

Publications (1)

Publication Number Publication Date
KR20120004498A true KR20120004498A (ko) 2012-01-12

Family

ID=42229244

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117025967A Ceased KR20120004498A (ko) 2009-03-31 2010-03-26 겹쳐지는 레이저 트랙을 가지는 부품, 및 이 같은 부품을 생산하기 위한 방법

Country Status (18)

Country Link
US (1) US8822003B2 (https=)
EP (1) EP2414132B1 (https=)
JP (1) JP5661733B2 (https=)
KR (1) KR20120004498A (https=)
CN (1) CN102448659B (https=)
BR (1) BRPI1012662A2 (https=)
CA (1) CA2757229A1 (https=)
DE (1) DE102010003314A1 (https=)
DK (1) DK2414132T3 (https=)
ES (1) ES2625308T3 (https=)
IL (1) IL215452A0 (https=)
MX (1) MX2011010284A (https=)
MY (1) MY156815A (https=)
PT (1) PT2414132T (https=)
RU (1) RU2542056C2 (https=)
SG (1) SG174996A1 (https=)
TW (1) TW201039958A (https=)
WO (1) WO2010112412A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102848084B (zh) * 2012-09-28 2015-09-16 合肥彩虹蓝光科技有限公司 一种具有不同切割深度的发光原件切割方法
US20150364374A1 (en) * 2014-06-12 2015-12-17 Toshiba Corporation Semiconductor Device Die Singulation by Discontinuous Laser Scribe and Break
EP3023397A1 (de) * 2014-11-24 2016-05-25 Manz AG Verfahren zum Abtrennen eines Teils eines spröden Materials
CN106932944B (zh) 2017-04-28 2020-06-30 上海天马有机发光显示技术有限公司 一种显示面板及其制作方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3583279B2 (ja) * 1998-01-13 2004-11-04 三菱電機株式会社 穴あけ加工方法
US20050263854A1 (en) * 1998-10-23 2005-12-01 Shelton Bryan S Thick laser-scribed GaN-on-sapphire optoelectronic devices
JP2003002677A (ja) * 2001-06-22 2003-01-08 Seiko Epson Corp レーザ割断用支持テーブル、レーザ割断装置、レーザ割断方法、及び、液晶パネルの製造方法
JP2003320466A (ja) * 2002-05-07 2003-11-11 Disco Abrasive Syst Ltd レーザビームを使用した加工機
JP2004063803A (ja) * 2002-07-29 2004-02-26 Ngk Spark Plug Co Ltd プリント配線基板の製造方法、プリント配線基板製造用金属板、連結プリント配線基板
JP2005209719A (ja) * 2004-01-20 2005-08-04 Disco Abrasive Syst Ltd 半導体ウエーハの加工方法
JP3908236B2 (ja) 2004-04-27 2007-04-25 株式会社日本製鋼所 ガラスの切断方法及びその装置
JP2006319198A (ja) * 2005-05-13 2006-11-24 Disco Abrasive Syst Ltd ウエーハのレーザー加工方法およびレーザー加工装置
CN101341100A (zh) * 2005-12-29 2009-01-07 H2B光电技术有限公司 用于分离加工脆性材料构件的装置
TWI449137B (zh) * 2006-03-23 2014-08-11 製陶技術創新製陶工程股份公司 構件或電路用的攜帶體
WO2008062496A1 (en) * 2006-10-31 2008-05-29 Kyocera Corporation Ceramic member, method of forming groove in ceramic member, and substrate for electronic part
JP2008198905A (ja) * 2007-02-15 2008-08-28 Hitachi Metals Ltd セラミックス基板及びセラミックス回路基板の製造方法並びに集合基板と半導体モジュール
DE102008043539A1 (de) * 2007-11-07 2009-05-14 Ceramtec Ag Verfahren zum Laserritzen von spröden Bauteilen
JP5230240B2 (ja) * 2008-04-04 2013-07-10 芝浦メカトロニクス株式会社 レーザ加工装置

Also Published As

Publication number Publication date
RU2542056C2 (ru) 2015-02-20
WO2010112412A1 (de) 2010-10-07
MX2011010284A (es) 2011-12-08
US20120015129A1 (en) 2012-01-19
CA2757229A1 (en) 2010-10-07
JP5661733B2 (ja) 2015-01-28
SG174996A1 (en) 2011-11-28
RU2011143585A (ru) 2013-05-10
IL215452A0 (en) 2011-12-29
TW201039958A (en) 2010-11-16
DE102010003314A1 (de) 2010-10-07
DK2414132T3 (en) 2017-06-26
ES2625308T3 (es) 2017-07-19
CN102448659B (zh) 2015-10-21
BRPI1012662A2 (pt) 2016-04-05
CN102448659A (zh) 2012-05-09
JP2012521895A (ja) 2012-09-20
MY156815A (en) 2016-03-31
PT2414132T (pt) 2017-04-24
EP2414132B1 (de) 2017-03-22
US8822003B2 (en) 2014-09-02
EP2414132A1 (de) 2012-02-08

Similar Documents

Publication Publication Date Title
KR101432952B1 (ko) 다수개 취득 배선기판 및 그 제조방법
JP6006474B2 (ja) 配線基板、多数個取り配線基板、およびその製造方法
TWI495403B (zh) 配線基板、多片式配線基板、及其製造方法
TW200602144A (en) Laser processing method and semiconductor chip
TWI739878B (zh) 玻璃物品之製造方法及玻璃物品
WO2009108752A3 (en) Laser-induced structuring of substrate surfaces
KR20120004498A (ko) 겹쳐지는 레이저 트랙을 가지는 부품, 및 이 같은 부품을 생산하기 위한 방법
JP2022078155A (ja) パッケージ用基板
WO2012144114A1 (ja) 配線基板、多数個取り配線基板、およびその製造方法
JP2004276386A (ja) 分割用セラミック基板およびその製造方法
KR20150018359A (ko) 적층 세라믹스 기판의 분단 방법
JP5637845B2 (ja) チップ抵抗器基板
TWI434640B (zh) Electronic parts and their construction methods
JP2012521895A5 (https=)
TWI282717B (en) Circuit-plates with several circuit-carriers, circuit-carrier and method to separate circuit-carriers from a circuit-plate
CN102372426A (zh) 借助于激光将由易脆裂的材料制成的圆的平板分割成多个矩形单板的方法
TWI583522B (zh) Disassembly method of laminated ceramic substrate
JP2006013004A (ja) 板状部材の分割方法および該分割方法を用いて製造された基板
JP2014007235A (ja) セラミック基板の製造方法
JP2005086131A (ja) セラミック電子部品の製造方法
JP2015191999A (ja) シリコン基板の分断方法
TWI766993B (zh) 多層脆性材料基板的製作方法及製作系統
CN103153524A (zh) 利用激光射线接合两个接合伙伴、即陶瓷与金属/陶瓷的方法
JP2015034112A (ja) 積層セラミックス基板の分断方法
JP2016113309A (ja) 複合基板のスクライブ方法及びスクライブ装置

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T13-X000 Administrative time limit extension granted

St.27 status event code: U-3-3-T10-T13-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000