CN102448659B - 带有重叠的激光迹的构件和用于制造这种构件的方法 - Google Patents

带有重叠的激光迹的构件和用于制造这种构件的方法 Download PDF

Info

Publication number
CN102448659B
CN102448659B CN201080024963.5A CN201080024963A CN102448659B CN 102448659 B CN102448659 B CN 102448659B CN 201080024963 A CN201080024963 A CN 201080024963A CN 102448659 B CN102448659 B CN 102448659B
Authority
CN
China
Prior art keywords
component
laser
fracture
laser mark
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201080024963.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN102448659A (zh
Inventor
K·雷斯
T·卡尔
C·P·克卢格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ceramtec GmbH
Original Assignee
Ceramtec GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ceramtec GmbH filed Critical Ceramtec GmbH
Publication of CN102448659A publication Critical patent/CN102448659A/zh
Application granted granted Critical
Publication of CN102448659B publication Critical patent/CN102448659B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/52—Ceramics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/56—Inorganic materials other than metals or composite materials being semiconducting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/15—Sheet, web, or layer weakened to permit separation through thickness

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Golf Clubs (AREA)
  • Conveying And Assembling Of Building Elements In Situ (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Producing Shaped Articles From Materials (AREA)
CN201080024963.5A 2009-03-31 2010-03-26 带有重叠的激光迹的构件和用于制造这种构件的方法 Expired - Fee Related CN102448659B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009015087 2009-03-31
DE102009015087.0 2009-03-31
PCT/EP2010/053972 WO2010112412A1 (de) 2009-03-31 2010-03-26 Bauteil mit einer überlappendenden laserspur; verfahren zur herstellung eines solchen bauteils

Publications (2)

Publication Number Publication Date
CN102448659A CN102448659A (zh) 2012-05-09
CN102448659B true CN102448659B (zh) 2015-10-21

Family

ID=42229244

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080024963.5A Expired - Fee Related CN102448659B (zh) 2009-03-31 2010-03-26 带有重叠的激光迹的构件和用于制造这种构件的方法

Country Status (18)

Country Link
US (1) US8822003B2 (https=)
EP (1) EP2414132B1 (https=)
JP (1) JP5661733B2 (https=)
KR (1) KR20120004498A (https=)
CN (1) CN102448659B (https=)
BR (1) BRPI1012662A2 (https=)
CA (1) CA2757229A1 (https=)
DE (1) DE102010003314A1 (https=)
DK (1) DK2414132T3 (https=)
ES (1) ES2625308T3 (https=)
IL (1) IL215452A0 (https=)
MX (1) MX2011010284A (https=)
MY (1) MY156815A (https=)
PT (1) PT2414132T (https=)
RU (1) RU2542056C2 (https=)
SG (1) SG174996A1 (https=)
TW (1) TW201039958A (https=)
WO (1) WO2010112412A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10290695B2 (en) 2017-04-28 2019-05-14 Shanghai Tianma AM-OLED Co., Ltd. Display panel and fabrication method thereof

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102848084B (zh) * 2012-09-28 2015-09-16 合肥彩虹蓝光科技有限公司 一种具有不同切割深度的发光原件切割方法
US20150364374A1 (en) * 2014-06-12 2015-12-17 Toshiba Corporation Semiconductor Device Die Singulation by Discontinuous Laser Scribe and Break
EP3023397A1 (de) * 2014-11-24 2016-05-25 Manz AG Verfahren zum Abtrennen eines Teils eines spröden Materials

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040164061A1 (en) * 2002-05-07 2004-08-26 Masaya Takeuchi Finishing machine using laser beam
US20050155954A1 (en) * 2004-01-20 2005-07-21 Disco Corporation Semiconductor wafer processing method
US20050263854A1 (en) * 1998-10-23 2005-12-01 Shelton Bryan S Thick laser-scribed GaN-on-sapphire optoelectronic devices
US20060255022A1 (en) * 2005-05-13 2006-11-16 Hitoshi Hoshino Wafer laser processing method and laser beam processing machine
CN101043809A (zh) * 2006-03-23 2007-09-26 创新陶瓷工程技术公司 用于元件或电路的承载体
WO2008062496A1 (en) * 2006-10-31 2008-05-29 Kyocera Corporation Ceramic member, method of forming groove in ceramic member, and substrate for electronic part
CN101341100A (zh) * 2005-12-29 2009-01-07 H2B光电技术有限公司 用于分离加工脆性材料构件的装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3583279B2 (ja) * 1998-01-13 2004-11-04 三菱電機株式会社 穴あけ加工方法
JP2003002677A (ja) * 2001-06-22 2003-01-08 Seiko Epson Corp レーザ割断用支持テーブル、レーザ割断装置、レーザ割断方法、及び、液晶パネルの製造方法
JP2004063803A (ja) * 2002-07-29 2004-02-26 Ngk Spark Plug Co Ltd プリント配線基板の製造方法、プリント配線基板製造用金属板、連結プリント配線基板
JP3908236B2 (ja) 2004-04-27 2007-04-25 株式会社日本製鋼所 ガラスの切断方法及びその装置
JP2008198905A (ja) * 2007-02-15 2008-08-28 Hitachi Metals Ltd セラミックス基板及びセラミックス回路基板の製造方法並びに集合基板と半導体モジュール
DE102008043539A1 (de) * 2007-11-07 2009-05-14 Ceramtec Ag Verfahren zum Laserritzen von spröden Bauteilen
JP5230240B2 (ja) * 2008-04-04 2013-07-10 芝浦メカトロニクス株式会社 レーザ加工装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050263854A1 (en) * 1998-10-23 2005-12-01 Shelton Bryan S Thick laser-scribed GaN-on-sapphire optoelectronic devices
US20040164061A1 (en) * 2002-05-07 2004-08-26 Masaya Takeuchi Finishing machine using laser beam
US20050155954A1 (en) * 2004-01-20 2005-07-21 Disco Corporation Semiconductor wafer processing method
US20060255022A1 (en) * 2005-05-13 2006-11-16 Hitoshi Hoshino Wafer laser processing method and laser beam processing machine
CN101341100A (zh) * 2005-12-29 2009-01-07 H2B光电技术有限公司 用于分离加工脆性材料构件的装置
CN101043809A (zh) * 2006-03-23 2007-09-26 创新陶瓷工程技术公司 用于元件或电路的承载体
WO2008062496A1 (en) * 2006-10-31 2008-05-29 Kyocera Corporation Ceramic member, method of forming groove in ceramic member, and substrate for electronic part

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10290695B2 (en) 2017-04-28 2019-05-14 Shanghai Tianma AM-OLED Co., Ltd. Display panel and fabrication method thereof

Also Published As

Publication number Publication date
RU2542056C2 (ru) 2015-02-20
WO2010112412A1 (de) 2010-10-07
MX2011010284A (es) 2011-12-08
US20120015129A1 (en) 2012-01-19
CA2757229A1 (en) 2010-10-07
JP5661733B2 (ja) 2015-01-28
SG174996A1 (en) 2011-11-28
RU2011143585A (ru) 2013-05-10
IL215452A0 (en) 2011-12-29
TW201039958A (en) 2010-11-16
DE102010003314A1 (de) 2010-10-07
DK2414132T3 (en) 2017-06-26
ES2625308T3 (es) 2017-07-19
BRPI1012662A2 (pt) 2016-04-05
CN102448659A (zh) 2012-05-09
JP2012521895A (ja) 2012-09-20
KR20120004498A (ko) 2012-01-12
MY156815A (en) 2016-03-31
PT2414132T (pt) 2017-04-24
EP2414132B1 (de) 2017-03-22
US8822003B2 (en) 2014-09-02
EP2414132A1 (de) 2012-02-08

Similar Documents

Publication Publication Date Title
CN103444270B (zh) 布线基板、多连片布线基板及其制造方法
US9232643B2 (en) Ceramic wiring board, multi-piece ceramic wiring board, and method for producing same
US9049793B2 (en) Multi-piece-array and method of manufacturing the same
EP2712281B1 (en) Wiring substrate, multi-pattern wiring substrate, and manufacturing method therefor
CN102448659B (zh) 带有重叠的激光迹的构件和用于制造这种构件的方法
KR20120008332A (ko) 페라이트 시트 복합체 및 그 제조방법
JP2018116963A (ja) パッケージ用基板、およびその製造方法
WO2012144114A1 (ja) 配線基板、多数個取り配線基板、およびその製造方法
JP2011218689A (ja) フェライト基板
JP2017092289A (ja) 多数個取り用パッケージおよびセラミックパッケージおよびこれらの製造方法
JP2017098390A (ja) 配線基板の製造方法
JP2016201434A (ja) セラミック配線基板およびその製造方法
JP5511603B2 (ja) 多数個取り配線基板
TWI282717B (en) Circuit-plates with several circuit-carriers, circuit-carrier and method to separate circuit-carriers from a circuit-plate
JP2018018886A (ja) マスク及び配線基板の製造方法
JP2003273272A (ja) セラミック基板及びその製造方法
JP2007243088A (ja) 多層セラミック基板及びその製造方法
JP2016149419A (ja) 多数個取り配線基板の製造方法
EP3361499B1 (en) Wiring structure and method for producing wiring structure
JP2013214667A (ja) セラミック配線基板の製造方法
JP2007042768A (ja) 配線基板集合体
JP2012227451A (ja) 電子部品モジュール、その製造方法、およびｄｃ−ｄｃコンバータ
JP2015026685A (ja) 多数個取り配線基板
JP2014209562A (ja) 配線基板の製造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20151021