TW201035374A - Electroless tin or tin alloy plating solution and electronic element foemed with tin or tin alloy film by using electroless tin or tin alloy plating solution - Google Patents

Electroless tin or tin alloy plating solution and electronic element foemed with tin or tin alloy film by using electroless tin or tin alloy plating solution Download PDF

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Publication number
TW201035374A
TW201035374A TW98144664A TW98144664A TW201035374A TW 201035374 A TW201035374 A TW 201035374A TW 98144664 A TW98144664 A TW 98144664A TW 98144664 A TW98144664 A TW 98144664A TW 201035374 A TW201035374 A TW 201035374A
Authority
TW
Taiwan
Prior art keywords
group
tin
copper
substituted
lower alkyl
Prior art date
Application number
TW98144664A
Other languages
English (en)
Chinese (zh)
Inventor
Hironori Kobayashi
Rui Nanba
Takashi Ouchi
Original Assignee
Nippon Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co filed Critical Nippon Mining Co
Publication of TW201035374A publication Critical patent/TW201035374A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
TW98144664A 2008-12-24 2009-12-24 Electroless tin or tin alloy plating solution and electronic element foemed with tin or tin alloy film by using electroless tin or tin alloy plating solution TW201035374A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008327314 2008-12-24

Publications (1)

Publication Number Publication Date
TW201035374A true TW201035374A (en) 2010-10-01

Family

ID=42287676

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98144664A TW201035374A (en) 2008-12-24 2009-12-24 Electroless tin or tin alloy plating solution and electronic element foemed with tin or tin alloy film by using electroless tin or tin alloy plating solution

Country Status (3)

Country Link
JP (1) JP6029259B2 (ja)
TW (1) TW201035374A (ja)
WO (1) WO2010074067A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI553157B (zh) * 2015-06-26 2016-10-11 長興材料工業股份有限公司 金屬披覆積層板前處理組合物及其應用

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120004776A (ko) * 2010-07-07 2012-01-13 삼성전기주식회사 무전해 주석 환원 도금액 및 이를 이용한 무전해 주석 환원 도금방법
WO2017115701A1 (ja) * 2015-12-28 2017-07-06 三菱マテリアル株式会社 ＳｎＡｇ合金めっき液
JP6210148B2 (ja) 2015-12-28 2017-10-11 三菱マテリアル株式会社 ＳｎＡｇ合金めっき液
US10868383B2 (en) * 2017-01-30 2020-12-15 Jx Nippon Mining & Metals Corporation Surface-treated plated material, connector terminal, connector, FFC terminal, FFC, FPC and electronic part

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3419995B2 (ja) * 1996-05-10 2003-06-23 株式会社大和化成研究所 無電解錫−銀合金めっき浴
JP2009235565A (ja) * 2008-03-04 2009-10-15 Nippon Paint Co Ltd 銅の表面処理液および表面処理方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI553157B (zh) * 2015-06-26 2016-10-11 長興材料工業股份有限公司 金屬披覆積層板前處理組合物及其應用

Also Published As

Publication number Publication date
JPWO2010074067A1 (ja) 2012-06-21
JP6029259B2 (ja) 2016-11-24
WO2010074067A1 (ja) 2010-07-01

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