JP2019102672A - Sn層又はSn合金層を含む構造体 - Google Patents
Sn層又はSn合金層を含む構造体 Download PDFInfo
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- JP2019102672A JP2019102672A JP2017232888A JP2017232888A JP2019102672A JP 2019102672 A JP2019102672 A JP 2019102672A JP 2017232888 A JP2017232888 A JP 2017232888A JP 2017232888 A JP2017232888 A JP 2017232888A JP 2019102672 A JP2019102672 A JP 2019102672A
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- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
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- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/13138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/13147—Copper [Cu] as principal constituent
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12722—Next to Group VIII metal-base component
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Abstract
Description
11 アンダーバリアメタル(UBM)
12 Sn層(又はSn合金層)
13 金属間化合物
Claims (4)
- 基材と、
前記基材の上に形成されたSn層又はSn合金層と、
前記基材とSn層又はSn合金層との間に形成されたFe、Co、Ru、Rh及びPdのいずれかからなる単一金属層、又は2種以上からなる合金層であるアンダーバリアメタルとを備えていることを特徴とするSn層又はSn合金層を含む構造体。 - 前記アンダーバリアメタルは、Fe、Co、Ru及びRhの少なくとも2種からなる合金層であることを特徴とする請求項1に記載のSn層又はSn合金層を含む構造体。
- 前記アンダーバリアメタルは、Fe‐Co合金、Fe‐Ru合金又はFe‐Rh合金からなることを特徴とする請求項2に記載のSn層又はSn合金層を含む構造体。
- 前記アンダーバリアメタルは、Feを10%以上の質量比率で含むことを特徴とする請求項3に記載のSn層又はSn合金層を含む構造体。
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JP2017232888A JP7067766B2 (ja) | 2017-12-04 | 2017-12-04 | Sn層又はSn合金層を含む構造体 |
US16/769,545 US11052637B2 (en) | 2017-12-04 | 2018-11-27 | Structure containing Sn layer or Sn alloy layer |
KR1020207017573A KR102196730B1 (ko) | 2017-12-04 | 2018-11-27 | Sn층 또는 Sn합금층을 포함하는 구조체 |
PCT/JP2018/043613 WO2019111767A1 (ja) | 2017-12-04 | 2018-11-27 | Sn層又はSn合金層を含む構造体 |
TW107142781A TWI785157B (zh) | 2017-12-04 | 2018-11-29 | 含有錫層或錫合金層的結構體 |
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Cited By (2)
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WO2022249500A1 (ja) | 2021-05-27 | 2022-12-01 | 石原ケミカル株式会社 | アンダーバリアメタルとソルダー層とを含む構造体及び構造体の製造方法 |
JP7437057B2 (ja) | 2020-02-05 | 2024-02-22 | 石原ケミカル株式会社 | Sn層又はSn合金層を含む構造体 |
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KR102228404B1 (ko) * | 2020-11-24 | 2021-03-15 | 박종규 | 납 용출 방지를 위한 도금액 조성물 |
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EP2157668B9 (en) * | 2007-04-09 | 2016-02-17 | Furukawa Electric Co., Ltd. | Connector and metallic material for connector |
US9082762B2 (en) | 2009-12-28 | 2015-07-14 | International Business Machines Corporation | Electromigration-resistant under-bump metallization of nickel-iron alloys for Sn-rich solder bumps in Pb-free flip-clip |
TWI572436B (zh) * | 2014-12-19 | 2017-03-01 | 中原大學 | 一種銲接結構及其製造方法 |
JP7067766B2 (ja) | 2017-12-04 | 2022-05-16 | 石原ケミカル株式会社 | Sn層又はSn合金層を含む構造体 |
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JP2008028112A (ja) * | 2006-07-20 | 2008-02-07 | Toshiba Corp | 半導体装置の製造方法 |
JP2015046268A (ja) * | 2013-08-27 | 2015-03-12 | Jx日鉱日石金属株式会社 | 電子部品用金属材料及びその製造方法、それを用いたコネクタ端子、コネクタ及び電子部品 |
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JP7437057B2 (ja) | 2020-02-05 | 2024-02-22 | 石原ケミカル株式会社 | Sn層又はSn合金層を含む構造体 |
WO2022249500A1 (ja) | 2021-05-27 | 2022-12-01 | 石原ケミカル株式会社 | アンダーバリアメタルとソルダー層とを含む構造体及び構造体の製造方法 |
KR20240013746A (ko) | 2021-05-27 | 2024-01-30 | 이시하라 케미칼 가부시키가이샤 | 언더베리어 메탈과 솔더층을 포함하는 구조체 및 구조체의 제조 방법 |
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WO2019111767A1 (ja) | 2019-06-13 |
KR20200085878A (ko) | 2020-07-15 |
JP7067766B2 (ja) | 2022-05-16 |
US11052637B2 (en) | 2021-07-06 |
TWI785157B (zh) | 2022-12-01 |
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