JP6606812B2 - Sn層又はSn合金層を含む構造体 - Google Patents
Sn層又はSn合金層を含む構造体 Download PDFInfo
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- JP6606812B2 JP6606812B2 JP2019133337A JP2019133337A JP6606812B2 JP 6606812 B2 JP6606812 B2 JP 6606812B2 JP 2019133337 A JP2019133337 A JP 2019133337A JP 2019133337 A JP2019133337 A JP 2019133337A JP 6606812 B2 JP6606812 B2 JP 6606812B2
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- layer
- acid
- alloy
- ubm
- salt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
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- Electroplating Methods And Accessories (AREA)
- Non-Insulated Conductors (AREA)
Description
11 アンダーバリアメタル(UBM)
12 Sn層(又はSn合金層)
13 金属間化合物
Claims (2)
- 基材と、
前記基材の上に形成されたSn層又はSn合金層と、
前記基材とSn層又はSn合金層との間に形成されたFe‐Co合金からなるアンダーバリアメタルとを備えていることを特徴とするSn層又はSn合金層を含む構造体。 - 前記アンダーバリアメタルは、Feを10%以上の質量比率で含むことを特徴とする請求項1に記載のSn層又はSn合金層を含む構造体。
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JP2019133337A JP6606812B2 (ja) | 2019-07-19 | 2019-07-19 | Sn層又はSn合金層を含む構造体 |
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JP2019133337A JP6606812B2 (ja) | 2019-07-19 | 2019-07-19 | Sn層又はSn合金層を含む構造体 |
Related Parent Applications (1)
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JP2017232888A Division JP7067766B2 (ja) | 2017-12-04 | 2017-12-04 | Sn層又はSn合金層を含む構造体 |
Publications (2)
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JP6606812B2 true JP6606812B2 (ja) | 2019-11-20 |
JP2019199651A JP2019199651A (ja) | 2019-11-21 |
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JP2019133337A Active JP6606812B2 (ja) | 2019-07-19 | 2019-07-19 | Sn層又はSn合金層を含む構造体 |
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Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP7197933B2 (ja) * | 2021-05-27 | 2022-12-28 | 石原ケミカル株式会社 | アンダーバリアメタルとソルダー層とを含む構造体 |
Family Cites Families (2)
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JP2008028112A (ja) * | 2006-07-20 | 2008-02-07 | Toshiba Corp | 半導体装置の製造方法 |
JP2015046268A (ja) * | 2013-08-27 | 2015-03-12 | Jx日鉱日石金属株式会社 | 電子部品用金属材料及びその製造方法、それを用いたコネクタ端子、コネクタ及び電子部品 |
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