TW201005063A - Adhesive encapsulating composition and electronic devices made therewith - Google Patents

Adhesive encapsulating composition and electronic devices made therewith Download PDF

Info

Publication number
TW201005063A
TW201005063A TW98115017A TW98115017A TW201005063A TW 201005063 A TW201005063 A TW 201005063A TW 98115017 A TW98115017 A TW 98115017A TW 98115017 A TW98115017 A TW 98115017A TW 201005063 A TW201005063 A TW 201005063A
Authority
TW
Taiwan
Prior art keywords
adhesive
composition
layer
substrate
weight
Prior art date
Application number
TW98115017A
Other languages
English (en)
Chinese (zh)
Inventor
Jun Fujita
Tamon Tadera
Fred Boyle Mccormick
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of TW201005063A publication Critical patent/TW201005063A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D165/00—Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04—Homopolymers or copolymers of ethene
    • C09J123/08—Copolymers of ethene
    • C09J123/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
    • C09J123/0815—Copolymers of ethene with aliphatic 1-olefins
    • C09J123/0823—Copolymers of ethene with aliphatic cyclic olefins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
    • H10F19/804—Materials of encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L43/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium or a metal; Compositions of derivatives of such polymers
    • C08L43/04—Homopolymers or copolymers of monomers containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L45/00—Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers
    • Y10T428/31699—Ester, halide or nitrile of addition polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31935—Ester, halide or nitrile of addition polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Thin Film Transistor (AREA)
  • Photovoltaic Devices (AREA)
TW98115017A 2008-06-02 2009-05-06 Adhesive encapsulating composition and electronic devices made therewith TW201005063A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US5806708P 2008-06-02 2008-06-02

Publications (1)

Publication Number Publication Date
TW201005063A true TW201005063A (en) 2010-02-01

Family

ID=41398750

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98115017A TW201005063A (en) 2008-06-02 2009-05-06 Adhesive encapsulating composition and electronic devices made therewith

Country Status (7)

Country Link
US (1) US20110073901A1 (enExample)
EP (1) EP2291479B1 (enExample)
JP (1) JP5270755B2 (enExample)
KR (1) KR20110020862A (enExample)
CN (1) CN102076803B (enExample)
TW (1) TW201005063A (enExample)
WO (1) WO2009148716A2 (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102947949A (zh) * 2010-04-22 2013-02-27 株式会社大赛璐 光半导体保护材料及其前体以及光半导体保护材料的制造方法
US9007538B2 (en) 2012-10-31 2015-04-14 Industrial Technology Research Institute Barrier functional film and manufacturing thereof, environmental sensitive electronic device, and display apparatus
TWI557964B (zh) * 2013-08-05 2016-11-11 Ｌｇ化學股份有限公司 壓敏性黏著膜及使用彼製造有機電子裝置之方法
TWI701778B (zh) * 2015-07-22 2020-08-11 美商英特爾公司 多層封裝總成及具有多層封裝總成之系統
TWI851874B (zh) * 2020-02-14 2024-08-11 日商住友電木股份有限公司 光硬化性黏接劑組成物、薄膜、及光學零件

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9024455B2 (en) 2010-05-26 2015-05-05 Hitachi Chemical Company, Ltd. Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device
US8232350B2 (en) * 2008-06-02 2012-07-31 3M Innovative Properties Company Adhesive encapsulating composition and electronic devices made therewith
WO2011057005A2 (en) * 2009-11-04 2011-05-12 Klöckner Pentaplast Of America, Inc. Configuration of multiple thermoformable film layers for rigid packaging requiring moisture and oxygen protection
WO2011062851A1 (en) 2009-11-19 2011-05-26 3M Innovative Properties Company Pressure sensitive adhesive comprising blend of synthetic rubber and functionalized synthetic rubber bonded to an acylic polymer
CN102666764B (zh) 2009-11-19 2015-09-30 3M创新有限公司 包含与丙烯酸类聚合物氢键结合的官能化聚异丁烯的压敏粘合剂
JP2011151388A (ja) * 2009-12-24 2011-08-04 Mitsubishi Plastics Inc 太陽電池封止材及びそれを用いて作製された太陽電池モジュール
EP2637229B1 (en) 2010-11-02 2018-01-03 LG Chem, Ltd. Adhesive film and method for encapsulating organic electronic device using the same
CN103210035B (zh) 2010-11-16 2015-08-12 3M创新有限公司 可紫外线固化的酸酐改性聚(异丁烯)
US8663407B2 (en) 2010-11-17 2014-03-04 3M Innovative Properties Company Isobutylene (Co)polymeric adhesive composition
US8629209B2 (en) 2010-12-02 2014-01-14 3M Innovative Properties Company Moisture curable isobutylene adhesive copolymers
TWI552883B (zh) * 2011-07-25 2016-10-11 Lintec Corp Gas barrier film laminates and electronic components
KR101614631B1 (ko) 2011-09-29 2016-04-21 미쓰이 가가쿠 가부시키가이샤 접착성 조성물, 및 이것을 이용한 화상 표시 장치
CN103998238B (zh) * 2012-01-06 2016-08-24 Lg化学株式会社 封装薄膜
US8481626B1 (en) 2012-01-16 2013-07-09 Itron, Inc. Wax-based encapsulant/moisture barrier for use with electronics received in water meter pits
US8728568B2 (en) 2012-01-16 2014-05-20 Itron, Inc. Method for encapsulation of electronics received in water meter pits with an improved wax-based encapsulant/moisture barrier
JP5938514B2 (ja) * 2012-03-12 2016-06-22 エルジー・ケム・リミテッド 粘着剤組成物
WO2013146015A1 (ja) * 2012-03-28 2013-10-03 昭和電工株式会社 重合性組成物、重合物、粘着シート、画像表示装置の製造方法、及び画像表示装置
JP5788124B2 (ja) 2012-03-29 2015-09-30 スリーエム イノベイティブ プロパティズ カンパニー ペンダントフリーラジカル重合性四級アンモニウム置換基を含むポリ（イソブチレン）コポリマーを含む接着剤
US9422464B2 (en) 2012-05-11 2016-08-23 3M Innovative Properties Company Adhesives comprising reaction product of halogenated poly(isobutylene) copolymers and polyamines
EP2853574A4 (en) * 2012-05-22 2016-03-02 Sekisui Chemical Co Ltd SHEET SEALING ELEMENT AND HISTORED SHEET SEALING ELEMENT
TWI504507B (zh) 2012-08-03 2015-10-21 Lg Chemical Ltd 黏合膜及使用彼之有機電子裝置之封裝方法
EP2885363B1 (en) 2012-08-14 2018-02-07 3M Innovative Properties Company Adhesives comprising grafted isobutylene copolymer
US9269623B2 (en) 2012-10-25 2016-02-23 Rohm And Haas Electronic Materials Llc Ephemeral bonding
JP6244088B2 (ja) * 2012-11-29 2017-12-06 東京応化工業株式会社 接着剤組成物、接着フィルムおよび積層体
JP5914397B2 (ja) 2013-03-19 2016-05-11 富士フイルム株式会社 機能性フィルム
CN103436203B (zh) * 2013-07-08 2015-06-03 北京京东方光电科技有限公司 封框胶及其制备方法和显示装置
JP6460344B2 (ja) 2013-09-24 2019-01-30 エルジー・ケム・リミテッド 粘着性組成物
US9315696B2 (en) * 2013-10-31 2016-04-19 Dow Global Technologies Llc Ephemeral bonding
US20150166789A1 (en) * 2013-12-18 2015-06-18 Sabic Innovative Plastics Ip B.V. Poly(phenylene ether) fiber, method of forming, and articles therefrom
KR20150097359A (ko) * 2014-02-18 2015-08-26 주식회사 엘지화학 봉지 필름 및 이를 포함하는 유기전자장치
WO2015199164A1 (ja) * 2014-06-27 2015-12-30 富士フイルム株式会社 有機電子装置用封止部材
CN104282728B (zh) * 2014-10-10 2017-03-15 深圳市华星光电技术有限公司 一种白光oled显示器及其封装方法
CN104479574B (zh) * 2014-12-31 2017-03-08 广州鹿山新材料股份有限公司 一种增透的聚烯烃光伏组件封装胶膜及其制备方法
JP6621805B2 (ja) * 2015-03-25 2019-12-18 リケンテクノス株式会社 熱可塑性樹脂組成物、接着性塗料、及びこれを用いた積層体
JP6550275B2 (ja) * 2015-06-15 2019-07-24 東京応化工業株式会社 ナノインプリント用組成物、硬化物、パターン形成方法及びパターンを含む物品
DE102015222027A1 (de) * 2015-11-09 2017-05-11 Tesa Se Barriereklebemasse mit polymerem Gettermaterial
KR20180101599A (ko) * 2016-02-01 2018-09-12 쓰리엠 이노베이티브 프로퍼티즈 컴파니 배리어 복합재
KR102563022B1 (ko) * 2016-04-04 2023-08-07 덕산네오룩스 주식회사 유기전기발광소자용 봉지 화합물, 조성물 및 이를 포함하는 봉지화된 장치
US10121990B2 (en) * 2016-04-28 2018-11-06 Electronics And Telecommunications Research Institute Organic light emitting devices and methods of fabricating the same
CN109478520B (zh) * 2016-06-28 2023-04-21 日本瑞翁株式会社 半导体封装体制造用支承体、半导体封装体制造用支承体的使用及半导体封装体的制造方法
CN105938873A (zh) 2016-07-01 2016-09-14 武汉华星光电技术有限公司 一种柔性显示装置及其制造方法
CN107658231B (zh) * 2016-07-26 2019-08-02 中国科学院苏州纳米技术与纳米仿生研究所 电子器件的干法封装方法及电子器件封装结构
US11211513B2 (en) * 2016-07-29 2021-12-28 Trinamix Gmbh Optical sensor and detector for an optical detection
WO2018035103A1 (en) 2016-08-15 2018-02-22 Klockner Pentaplast Of Ameriva, Inc. Hot fill laminate
CN110536945B (zh) 2017-04-21 2022-04-29 3M创新有限公司 阻隔性粘合剂组合物和制品
KR102505265B1 (ko) 2017-06-23 2023-03-06 삼성디스플레이 주식회사 전자 장치
WO2019111182A1 (en) 2017-12-06 2019-06-13 3M Innovative Properties Company Barrier adhesive compositions and articles
US11349103B2 (en) * 2018-03-15 2022-05-31 Dell Products L.P. Display assembly apparatus and methods for information handling systems
DE102018112817A1 (de) 2018-05-29 2019-12-05 Klöckner Pentaplast Gmbh Transparente Polymerfolie mit Verfärbungskompensation
JP2021172812A (ja) * 2020-04-21 2021-11-01 Jsr株式会社 熱可塑性エラストマー組成物及び成形体
WO2022045204A1 (ja) * 2020-08-28 2022-03-03 Rimtec株式会社 酸素バリア性シクロオレフィン系樹脂硬化物
US11603432B2 (en) 2020-11-18 2023-03-14 Klöckner Pentaplast Of America, Inc. Thermoformed packaging and methods of forming the same
WO2022221874A1 (en) 2021-04-15 2022-10-20 H.B. Fuller Company Hot melt composition in the form of a film for use in thin film photovoltaic modules

Family Cites Families (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3657159A (en) * 1968-10-14 1972-04-18 Hercules Inc Epoxide polymerization catalysts comprising complex organoaluminate compounds of silicon tin or phosphorus
US3657149A (en) * 1968-10-14 1972-04-18 Hercules Inc Catalyst compositions
DE3669996D1 (de) * 1985-01-30 1990-05-10 Kao Corp Absorptionsartikel.
JPH0329291A (ja) * 1989-06-27 1991-02-07 Sumitomo Bakelite Co Ltd 有機分散型ｅｌランプ用捕水フィルム
ATE124561T1 (de) * 1989-08-25 1995-07-15 Mitsui Petrochemical Ind Medium für informationsaufzeichnung und dazu verwendbares klebemittel.
US5238519A (en) * 1990-10-17 1993-08-24 United Solar Systems Corporation Solar cell lamination apparatus
US5252694A (en) * 1992-01-22 1993-10-12 Minnesota Mining And Manufacturing Company Energy-polymerization adhesive, coating, film and process for making the same
JPH05306311A (ja) * 1992-04-30 1993-11-19 Mitsubishi Petrochem Co Ltd グラフト変性共重合体の製造法
US5721289A (en) * 1994-11-04 1998-02-24 Minnesota Mining And Manufacturing Company Stable, low cure-temperature semi-structural pressure sensitive adhesive
AU700404B2 (en) * 1994-11-17 1999-01-07 Ciba Specialty Chemicals Holding Inc. Monomers and composition which can be crosslinked and croslinked polymers
JP3222361B2 (ja) * 1995-08-15 2001-10-29 キヤノン株式会社 太陽電池モジュールの製造方法及び太陽電池モジュール
AU731869B2 (en) * 1998-11-12 2001-04-05 Kaneka Corporation Solar cell module
US6226890B1 (en) * 2000-04-07 2001-05-08 Eastman Kodak Company Desiccation of moisture-sensitive electronic devices
KR20030075153A (ko) * 2001-01-31 2003-09-22 제온 코포레이션 도광판 및 조명유닛
DE10141379A1 (de) * 2001-08-23 2003-04-30 Tesa Ag Oberflächenschutzfolie für lackierte Flächen mit einem Kleber auf Basis von hydrierten Blockcopolymeren
US6946676B2 (en) * 2001-11-05 2005-09-20 3M Innovative Properties Company Organic thin film transistor with polymeric interface
WO2003106582A1 (ja) * 2002-01-10 2003-12-24 積水化学工業株式会社 有機エレクトロルミネッセンス素子封止用接着剤及びその応用
US6835950B2 (en) * 2002-04-12 2004-12-28 Universal Display Corporation Organic electronic devices with pressure sensitive adhesive layer
US20040253464A1 (en) * 2002-07-30 2004-12-16 Thorsten Krawinkel Surface protection film for painted surfaces with an adhesive based on hydrogenated block copolymers
EP1308084A1 (en) * 2002-10-02 2003-05-07 Ciba SC Holding AG Synergistic UV absorber combination
US6790914B2 (en) * 2002-11-29 2004-09-14 Jsr Corporation Resin film and applications thereof
US6975067B2 (en) * 2002-12-19 2005-12-13 3M Innovative Properties Company Organic electroluminescent device and encapsulation method
US7018713B2 (en) * 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier
US7279777B2 (en) * 2003-05-08 2007-10-09 3M Innovative Properties Company Organic polymers, laminates, and capacitors
US20040238846A1 (en) * 2003-05-30 2004-12-02 Georg Wittmann Organic electronic device
US7535017B2 (en) * 2003-05-30 2009-05-19 Osram Opto Semiconductors Gmbh Flexible multilayer packaging material and electronic devices with the packaging material
US20050090566A1 (en) * 2003-10-01 2005-04-28 Nitzman Alan F. Synthetic resins in casein-stabilized rosin size emulsions
JP4206899B2 (ja) * 2003-10-27 2009-01-14 Ｊｓｒ株式会社 面実装型ｌｅｄ素子
DE10357321A1 (de) * 2003-12-05 2005-07-21 Tesa Ag Hochtackige Klebmasse, Verfahren zu deren Herstellung und deren Verwendung
JP4410055B2 (ja) * 2004-08-02 2010-02-03 日東電工株式会社 位相差粘着剤層、その製造方法、粘着型光学フィルム、その製造方法および画像表示装置
JP2005347204A (ja) * 2004-06-07 2005-12-15 Canon Inc 有機ｅｌ素子及びその製造方法
JP2006008761A (ja) * 2004-06-23 2006-01-12 Tosoh Corp ホットメルト接着剤組成物
US7316756B2 (en) * 2004-07-27 2008-01-08 Eastman Kodak Company Desiccant for top-emitting OLED
US7875686B2 (en) * 2004-08-18 2011-01-25 Promerus Llc Polycycloolefin polymeric compositions for semiconductor applications
US20060063015A1 (en) * 2004-09-23 2006-03-23 3M Innovative Properties Company Protected polymeric film
US7329465B2 (en) * 2004-10-29 2008-02-12 3M Innovative Properties Company Optical films incorporating cyclic olefin copolymers
WO2006049951A1 (en) * 2004-10-29 2006-05-11 3M Innovative Properties Company Optical films incorporating cyclic olefin copolymers
KR101270821B1 (ko) * 2004-11-09 2013-06-05 이데미쓰 고산 가부시키가이샤 광반도체 밀봉 재료
JPWO2006057218A1 (ja) * 2004-11-24 2008-06-05 株式会社カネカ 硬化性組成物およびその硬化性組成物により封止、被覆された半導体装置
WO2006067950A1 (ja) * 2004-12-22 2006-06-29 Jsr Corporation 環状オレフィン系付加共重合体の製造方法、環状オレフィン系付加共重合体およびその用途
JP2006186175A (ja) * 2004-12-28 2006-07-13 Nippon Zeon Co Ltd 電子部品用樹脂膜形成材料及びそれを用いた積層体
DE602005015766D1 (de) * 2005-01-04 2009-09-10 Dow Corning Organosiliciumfunktionelle bor-amin-katalysatorkomplexe und daraus hergestellte härtbare zusammensetzungen
JP2007065575A (ja) * 2005-09-02 2007-03-15 Jsr Corp 光学フィルム、偏光板および液晶表示装置
KR20080050503A (ko) * 2005-10-12 2008-06-05 시바 홀딩 인코포레이티드 캡슐화된 발광 안료
JP5213303B2 (ja) * 2006-01-17 2013-06-19 スリーエム イノベイティブ プロパティズ カンパニー 光硬化性吸湿性組成物及び有機ｅｌ素子
JP2007197517A (ja) * 2006-01-24 2007-08-09 Three M Innovative Properties Co 接着性封止組成物、封止フィルム及び有機ｅｌ素子
JP2009531516A (ja) * 2006-03-29 2009-09-03 ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレイション 放射線−硬化性ゴム系接着剤／シーラント
CN101454388B (zh) * 2006-05-23 2012-04-18 西巴控股有限公司 作为表面改性剂的n-取代的全氟烷基化的吡咯烷
JP5365891B2 (ja) * 2006-10-13 2013-12-11 日本ゼオン株式会社 発光素子用樹脂組成物、発光素子用積層体、発光素子
EP2177524A4 (en) * 2007-08-16 2011-12-14 Fujifilm Corp HETEROCYCLIC COMPOUND, ULTRAVIOLET RADIATION ABSORBER, AND COMPOSITION COMPRISING THE ULTRAVIOLET RADIATION ABSORBER
US8846169B2 (en) * 2007-12-28 2014-09-30 3M Innovative Properties Company Flexible encapsulating film systems
ES2436022T3 (es) * 2008-03-14 2013-12-26 Otsuka Pharmaceutical Factory, Inc. Ampolla de plástico

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102947949A (zh) * 2010-04-22 2013-02-27 株式会社大赛璐 光半导体保护材料及其前体以及光半导体保护材料的制造方法
US9007538B2 (en) 2012-10-31 2015-04-14 Industrial Technology Research Institute Barrier functional film and manufacturing thereof, environmental sensitive electronic device, and display apparatus
TWI557964B (zh) * 2013-08-05 2016-11-11 Ｌｇ化學股份有限公司 壓敏性黏著膜及使用彼製造有機電子裝置之方法
US9803112B2 (en) 2013-08-05 2017-10-31 Lg Chem, Ltd. Pressure sensitive adhesive film and method of manufacturing organic electronic device using the same
TWI701778B (zh) * 2015-07-22 2020-08-11 美商英特爾公司 多層封裝總成及具有多層封裝總成之系統
TWI851874B (zh) * 2020-02-14 2024-08-11 日商住友電木股份有限公司 光硬化性黏接劑組成物、薄膜、及光學零件

Also Published As

Publication number Publication date
EP2291479A2 (en) 2011-03-09
CN102076803B (zh) 2014-11-12
US20110073901A1 (en) 2011-03-31
JP5270755B2 (ja) 2013-08-21
WO2009148716A2 (en) 2009-12-10
JP2011526052A (ja) 2011-09-29
WO2009148716A3 (en) 2010-02-18
EP2291479B1 (en) 2013-05-22
EP2291479A4 (en) 2012-01-04
CN102076803A (zh) 2011-05-25
KR20110020862A (ko) 2011-03-03

Similar Documents

Publication Publication Date Title
TW201005063A (en) Adhesive encapsulating composition and electronic devices made therewith
TWI476258B (zh) 黏著性封裝組合物及以其製成之電子裝置
CN101370889B (zh) 粘合剂封装组合物膜以及有机电致发光器件
CN103998554B (zh) 特别用于封装电子组件的粘合剂物质
CN101677072B (zh) 封装电子装置的方法
TWI634148B (zh) Resin composition for electronic device sealing and electronic device
US11139449B2 (en) Resin composition for sealing organic electronic device element, resin sheet for sealing organic electronic device element, organic electroluminescent element, and image display apparatus
TWI568783B (zh) Resin composition and electronic device for sealing electronic device
TW201029077A (en) Method for encapsulating an electronic arrangement
TW201228841A (en) Adhesive and a method of encapsulating for an electric device
KR20170116232A (ko) 유기 전자 디바이스용 소자 밀봉용 수지 조성물, 유기 전자 디바이스용 소자 밀봉용 수지 시트, 유기 일렉트로루미네센스 소자 및 화상 표시 장치
JP2011231313A (ja) 粘着性組成物および該組成物から得られる粘着性シート