TW200938498A - Scribing apparatus and method for cutting substrate using the scribing apparatus - Google Patents

Scribing apparatus and method for cutting substrate using the scribing apparatus Download PDF

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Publication number
TW200938498A
TW200938498A TW097145059A TW97145059A TW200938498A TW 200938498 A TW200938498 A TW 200938498A TW 097145059 A TW097145059 A TW 097145059A TW 97145059 A TW97145059 A TW 97145059A TW 200938498 A TW200938498 A TW 200938498A
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TW
Taiwan
Prior art keywords
line
unit
substrate
mother substrate
scribe
Prior art date
Application number
TW097145059A
Other languages
English (en)
Chinese (zh)
Other versions
TWI364404B (ja
Inventor
Min-Woong Kim
Jun-Woo Park
Original Assignee
Semes Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Semes Co Ltd filed Critical Semes Co Ltd
Publication of TW200938498A publication Critical patent/TW200938498A/zh
Application granted granted Critical
Publication of TWI364404B publication Critical patent/TWI364404B/zh

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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates
TW097145059A 2008-03-05 2008-11-21 Scribing apparatus and method for cutting substrate using the scribing apparatus TW200938498A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080020530A KR100924083B1 (ko) 2008-03-05 2008-03-05 스크라이빙 장치 및 이를 이용한 기판 절단 장치 및 방법

Publications (2)

Publication Number Publication Date
TW200938498A true TW200938498A (en) 2009-09-16
TWI364404B TWI364404B (ja) 2012-05-21

Family

ID=41093310

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097145059A TW200938498A (en) 2008-03-05 2008-11-21 Scribing apparatus and method for cutting substrate using the scribing apparatus

Country Status (4)

Country Link
JP (1) JP2009209033A (ja)
KR (1) KR100924083B1 (ja)
CN (1) CN101525211B (ja)
TW (1) TW200938498A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI471277B (zh) * 2011-07-20 2015-02-01 Mitsuboshi Diamond Ind Co Ltd 刻劃痕線裝置

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2477262A4 (en) 2009-09-10 2017-07-12 Panasonic Corporation Gas diffusion layer and process for production thereof, and fuel cell
JP5091961B2 (ja) * 2010-02-15 2012-12-05 三星ダイヤモンド工業株式会社 スクライブ装置
JP2013023401A (ja) * 2011-07-20 2013-02-04 Mitsuboshi Diamond Industrial Co Ltd 分断装置
CN102390923A (zh) * 2011-08-05 2012-03-28 深圳市华星光电技术有限公司 面板基板切割方法及基板切割装置
JP5981795B2 (ja) * 2012-07-24 2016-08-31 三星ダイヤモンド工業株式会社 基板の溝加工方法及び溝加工装置
KR102028913B1 (ko) * 2013-05-31 2019-11-08 엘지디스플레이 주식회사 기판 탈착 장치 및 이를 이용한 평판표시장치의 제조방법
JP5566511B2 (ja) * 2013-08-07 2014-08-06 三星ダイヤモンド工業株式会社 分断装置
JP6268805B2 (ja) * 2013-08-13 2018-01-31 日本電気硝子株式会社 ガラス板の製造方法
CN104786378B (zh) * 2015-03-30 2017-07-25 重庆四联光电科技有限公司 蓝宝石及其加工方法
CN106277733A (zh) * 2015-06-03 2017-01-04 三星钻石工业股份有限公司 切割方法及切割设备
KR101863580B1 (ko) * 2017-04-11 2018-06-01 권정봉 다중형 스크라이빙 수단이 구비된 기판절단 시스템
KR101863579B1 (ko) * 2017-04-11 2018-06-01 권정봉 기판 절단 시스템
CN107092109A (zh) * 2017-07-05 2017-08-25 深圳市华星光电技术有限公司 一种用于分解液晶面板半成品的装置及方法
KR101808005B1 (ko) 2017-09-05 2017-12-13 김영재 태양광 모듈 및 이를 이용한 기판가공 유닛
KR101991269B1 (ko) * 2017-09-29 2019-06-20 주식회사 탑 엔지니어링 스크라이빙 장치
CN108746859B (zh) * 2018-06-07 2019-08-06 浙江科恩电器有限公司 一种用于集成灶不锈钢台面加工的切割线设置装置及方法
CN109650733B (zh) * 2019-02-25 2021-12-28 江苏曲科光电科技有限公司 一种玻璃基板划线装置上的划针调节座
CN109650732B (zh) * 2019-02-25 2021-09-07 东莞法克泰光电科技有限公司 一种应用于真空镀膜设备上玻璃基板的划线装置
CN110040949B (zh) * 2019-05-28 2021-08-10 晶智(上海)光学仪器设备有限公司 一种等间距的玻璃切割装置
CN110153980B (zh) * 2019-06-24 2021-03-30 南京银雷精密机械制造有限公司 一种板材划线装置及划线方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0718737Y2 (ja) * 1989-10-26 1995-05-01 株式会社小坂研究所 パネル割断装置
JPH11343133A (ja) * 1998-03-31 1999-12-14 Shirai Tekkosho:Kk 板ガラスの切断装置
JP4189992B2 (ja) * 2002-10-22 2008-12-03 株式会社シライテック ガラス基板の切断装置
KR100863438B1 (ko) * 2006-05-08 2008-10-16 주식회사 탑 엔지니어링 다축 동기 제어를 이용한 스크라이브 장치 및 그 방법
KR100769429B1 (ko) * 2006-05-09 2007-10-22 삼성에스디아이 주식회사 기판 절단장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI471277B (zh) * 2011-07-20 2015-02-01 Mitsuboshi Diamond Ind Co Ltd 刻劃痕線裝置

Also Published As

Publication number Publication date
CN101525211A (zh) 2009-09-09
TWI364404B (ja) 2012-05-21
CN101525211B (zh) 2012-11-07
KR20090095281A (ko) 2009-09-09
KR100924083B1 (ko) 2009-11-02
JP2009209033A (ja) 2009-09-17

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