TW200934826A - Curable silicone composition and cured product thereof - Google Patents
Curable silicone composition and cured product thereof Download PDFInfo
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- TW200934826A TW200934826A TW097137993A TW97137993A TW200934826A TW 200934826 A TW200934826 A TW 200934826A TW 097137993 A TW097137993 A TW 097137993A TW 97137993 A TW97137993 A TW 97137993A TW 200934826 A TW200934826 A TW 200934826A
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- 239000000203 mixture Substances 0.000 title claims abstract description 103
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- 125000003700 epoxy group Chemical group 0.000 claims abstract description 32
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- 239000007788 liquid Substances 0.000 claims abstract description 7
- 239000011231 conductive filler Substances 0.000 claims abstract description 5
- RJGDLRCDCYRQOQ-UHFFFAOYSA-N anthrone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3CC2=C1 RJGDLRCDCYRQOQ-UHFFFAOYSA-N 0.000 claims description 31
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 16
- 239000002245 particle Substances 0.000 claims description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 14
- 125000000962 organic group Chemical group 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 10
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- 125000003118 aryl group Chemical group 0.000 claims description 8
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- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
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- 238000007650 screen-printing Methods 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L sodium carbonate Substances [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000001117 sulphuric acid Substances 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- 239000010455 vermiculite Substances 0.000 description 1
- 229910052902 vermiculite Inorganic materials 0.000 description 1
- 235000019354 vermiculite Nutrition 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007269034A JP5422109B2 (ja) | 2007-10-16 | 2007-10-16 | 硬化性シリコーン組成物およびその硬化物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200934826A true TW200934826A (en) | 2009-08-16 |
Family
ID=40567912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097137993A TW200934826A (en) | 2007-10-16 | 2008-10-02 | Curable silicone composition and cured product thereof |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8563666B2 (enExample) |
| EP (1) | EP2201068B1 (enExample) |
| JP (1) | JP5422109B2 (enExample) |
| KR (1) | KR20100083146A (enExample) |
| CN (1) | CN101827891B (enExample) |
| AT (1) | ATE514751T1 (enExample) |
| TW (1) | TW200934826A (enExample) |
| WO (1) | WO2009051084A2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11545413B2 (en) * | 2018-02-16 | 2023-01-03 | Showa Denko Materials Co., Ltd. | Thermal conduction sheet and heat dissipating device including thermal conduction sheet |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5547369B2 (ja) * | 2007-09-28 | 2014-07-09 | 東レ・ダウコーニング株式会社 | 硬化性液状エポキシ樹脂組成物およびその硬化物 |
| US20130146118A1 (en) * | 2011-12-12 | 2013-06-13 | Dow Corning Corporation | Silicone Junction Box and Assemblies |
| JP5996085B2 (ja) | 2013-02-27 | 2016-09-21 | 株式会社朝日ラバー | 白色反射膜用インク、白色反射膜用粉体塗料及び白色反射膜の製造方法 |
| KR102220457B1 (ko) * | 2013-03-25 | 2021-02-25 | 다이니폰 인사츠 가부시키가이샤 | 전지용 포장 재료 |
| CN103333463A (zh) * | 2013-06-26 | 2013-10-02 | 苏州天脉导热科技有限公司 | 一种导热母粒的制备方法 |
| KR102465006B1 (ko) | 2014-12-18 | 2022-11-10 | 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 | 경화성 유기폴리실록산 조성물, 이의 경화물, 및 경화 필름의 형성 방법 |
| CN104774470B (zh) * | 2015-03-25 | 2017-07-07 | 清华大学深圳研究生院 | 一种用于大功率led的密封剂及大功率led |
| JP6736844B2 (ja) * | 2015-07-16 | 2020-08-05 | 凸版印刷株式会社 | 化粧シート及び化粧板 |
| JP6714613B2 (ja) * | 2015-11-30 | 2020-06-24 | 住友理工株式会社 | 電子写真機器用弾性ロールおよびその製造方法 |
| JP6847597B2 (ja) * | 2016-06-22 | 2021-03-24 | 株式会社ダイセル | シルセスキオキサン |
| JP6610491B2 (ja) * | 2016-10-03 | 2019-11-27 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及び半導体装置 |
| US20200385609A1 (en) * | 2017-07-31 | 2020-12-10 | Dow Global Technologies Llc | Ice-phobic coatings |
| KR102428503B1 (ko) | 2017-09-07 | 2022-08-04 | 다우 글로벌 테크놀로지스 엘엘씨 | 열전도성 아이스-포빅 코팅 |
| CN108276777A (zh) * | 2018-01-23 | 2018-07-13 | 苏州矽美科导热科技有限公司 | 一种高弹力导热硅胶片及其制备方法 |
| CN108727831A (zh) * | 2018-05-23 | 2018-11-02 | 湖南博隽生物医药有限公司 | 一种医用抗菌硅胶材料及其制备方法 |
| JP7267500B2 (ja) * | 2020-11-20 | 2023-05-01 | 信越化学工業株式会社 | 導電性ペースト組成物、導電性ペースト組成物の製造方法、導電配線及びその製造方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3367964B2 (ja) | 1992-04-21 | 2003-01-20 | 東レ・ダウコーニング・シリコーン株式会社 | 硬化性樹脂組成物 |
| JP3786139B2 (ja) | 1992-05-26 | 2006-06-14 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物 |
| JP2705519B2 (ja) | 1993-02-26 | 1998-01-28 | 松下電工株式会社 | 液状エポキシ樹脂組成物 |
| EP0620242B1 (en) * | 1993-04-15 | 1998-08-19 | Dow Corning Toray Silicone Company, Limited | Epoxy group-containing silicone resin and compositions based thereon |
| JP3466239B2 (ja) | 1993-08-18 | 2003-11-10 | 東レ・ダウコーニング・シリコーン株式会社 | 硬化性樹脂組成物 |
| US6140445A (en) * | 1998-04-17 | 2000-10-31 | Crompton Corporation | Silane functional oligomer |
| JP3773022B2 (ja) | 1999-02-12 | 2006-05-10 | 信越化学工業株式会社 | フリップチップ型半導体装置 |
| US6225704B1 (en) * | 1999-02-12 | 2001-05-01 | Shin-Etsu Chemical Co., Ltd. | Flip-chip type semiconductor device |
| JP4019254B2 (ja) * | 2002-04-24 | 2007-12-12 | 信越化学工業株式会社 | 導電性樹脂組成物 |
| JP2004352947A (ja) * | 2003-05-30 | 2004-12-16 | Shin Etsu Chem Co Ltd | 室温硬化型熱伝導性シリコーンゴム組成物 |
| TWI345576B (en) * | 2003-11-07 | 2011-07-21 | Dow Corning Toray Silicone | Curable silicone composition and cured product thereof |
| JP5166677B2 (ja) * | 2005-03-15 | 2013-03-21 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物および電子部品 |
| JP5004433B2 (ja) * | 2005-04-27 | 2012-08-22 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物およびその硬化物 |
| JP5217119B2 (ja) * | 2005-06-15 | 2013-06-19 | 日立化成株式会社 | 封止用液状エポキシ樹脂組成物、電子部品装置及びウエハーレベルチップサイズパッケージ |
| JP5207591B2 (ja) | 2006-02-23 | 2013-06-12 | 東レ・ダウコーニング株式会社 | 半導体装置の製造方法および半導体装置 |
| JP5285846B2 (ja) * | 2006-09-11 | 2013-09-11 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物および電子部品 |
| JP5248012B2 (ja) | 2006-12-25 | 2013-07-31 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物 |
-
2007
- 2007-10-16 JP JP2007269034A patent/JP5422109B2/ja not_active Expired - Fee Related
-
2008
- 2008-10-02 TW TW097137993A patent/TW200934826A/zh unknown
- 2008-10-06 US US12/738,463 patent/US8563666B2/en not_active Expired - Fee Related
- 2008-10-06 WO PCT/JP2008/068516 patent/WO2009051084A2/en not_active Ceased
- 2008-10-06 AT AT08839384T patent/ATE514751T1/de not_active IP Right Cessation
- 2008-10-06 KR KR1020107008091A patent/KR20100083146A/ko not_active Abandoned
- 2008-10-06 EP EP08839384A patent/EP2201068B1/en not_active Not-in-force
- 2008-10-06 CN CN2008801117570A patent/CN101827891B/zh not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11545413B2 (en) * | 2018-02-16 | 2023-01-03 | Showa Denko Materials Co., Ltd. | Thermal conduction sheet and heat dissipating device including thermal conduction sheet |
| US11810834B2 (en) | 2018-02-16 | 2023-11-07 | Resonac Corporation | Thermal conduction sheet and heat dissipating device including thermal conduction sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009096865A (ja) | 2009-05-07 |
| WO2009051084A2 (en) | 2009-04-23 |
| CN101827891B (zh) | 2012-05-23 |
| EP2201068A2 (en) | 2010-06-30 |
| EP2201068B1 (en) | 2011-06-29 |
| JP5422109B2 (ja) | 2014-02-19 |
| US8563666B2 (en) | 2013-10-22 |
| US20100213404A1 (en) | 2010-08-26 |
| WO2009051084A3 (en) | 2009-06-25 |
| ATE514751T1 (de) | 2011-07-15 |
| CN101827891A (zh) | 2010-09-08 |
| KR20100083146A (ko) | 2010-07-21 |
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