CN101827891B - 可固化的硅氧烷组合物及其固化产物 - Google Patents

可固化的硅氧烷组合物及其固化产物 Download PDF

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Publication number
CN101827891B
CN101827891B CN2008801117570A CN200880111757A CN101827891B CN 101827891 B CN101827891 B CN 101827891B CN 2008801117570 A CN2008801117570 A CN 2008801117570A CN 200880111757 A CN200880111757 A CN 200880111757A CN 101827891 B CN101827891 B CN 101827891B
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CN
China
Prior art keywords
component
curable silicone
silicone composition
groups
sio
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN2008801117570A
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English (en)
Chinese (zh)
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CN101827891A (zh
Inventor
森田好次
植木浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
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Dow Corning Toray Co Ltd
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Publication of CN101827891A publication Critical patent/CN101827891A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN2008801117570A 2007-10-16 2008-10-06 可固化的硅氧烷组合物及其固化产物 Expired - Fee Related CN101827891B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007269034A JP5422109B2 (ja) 2007-10-16 2007-10-16 硬化性シリコーン組成物およびその硬化物
JP2007-269034 2007-10-16
PCT/JP2008/068516 WO2009051084A2 (en) 2007-10-16 2008-10-06 Curable silicone composition and cured product thereof

Publications (2)

Publication Number Publication Date
CN101827891A CN101827891A (zh) 2010-09-08
CN101827891B true CN101827891B (zh) 2012-05-23

Family

ID=40567912

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008801117570A Expired - Fee Related CN101827891B (zh) 2007-10-16 2008-10-06 可固化的硅氧烷组合物及其固化产物

Country Status (8)

Country Link
US (1) US8563666B2 (enExample)
EP (1) EP2201068B1 (enExample)
JP (1) JP5422109B2 (enExample)
KR (1) KR20100083146A (enExample)
CN (1) CN101827891B (enExample)
AT (1) ATE514751T1 (enExample)
TW (1) TW200934826A (enExample)
WO (1) WO2009051084A2 (enExample)

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* Cited by examiner, † Cited by third party
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JP5547369B2 (ja) * 2007-09-28 2014-07-09 東レ・ダウコーニング株式会社 硬化性液状エポキシ樹脂組成物およびその硬化物
US20130146118A1 (en) * 2011-12-12 2013-06-13 Dow Corning Corporation Silicone Junction Box and Assemblies
CN104955905B (zh) 2013-02-27 2017-11-28 株式会社朝日橡胶 白色反射膜用油墨、粉体涂料、白色反射膜及其制造方法、光源支架及照明器具遮光罩
US9570718B2 (en) * 2013-03-25 2017-02-14 Dai Nippon Printing Co., Ltd. Packaging material for batteries
CN103333463A (zh) * 2013-06-26 2013-10-02 苏州天脉导热科技有限公司 一种导热母粒的制备方法
WO2016098305A1 (ja) * 2014-12-18 2016-06-23 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物、その硬化物、および硬化皮膜の形成方法
CN104774470B (zh) * 2015-03-25 2017-07-07 清华大学深圳研究生院 一种用于大功率led的密封剂及大功率led
JP6736844B2 (ja) * 2015-07-16 2020-08-05 凸版印刷株式会社 化粧シート及び化粧板
WO2017094703A1 (ja) * 2015-11-30 2017-06-08 住友理工株式会社 電子写真機器用弾性ロールおよびその製造方法
JP6847597B2 (ja) * 2016-06-22 2021-03-24 株式会社ダイセル シルセスキオキサン
JP6610491B2 (ja) * 2016-10-03 2019-11-27 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
WO2019023840A1 (en) * 2017-07-31 2019-02-07 Dow Global Technologies Llc GLACIOPHOBIC COATINGS
CN111094477B (zh) 2017-09-07 2022-06-03 陶氏环球技术有限责任公司 导热憎冰涂层
CN108276777A (zh) * 2018-01-23 2018-07-13 苏州矽美科导热科技有限公司 一种高弹力导热硅胶片及其制备方法
KR102450264B1 (ko) 2018-02-16 2022-10-04 쇼와덴코머티리얼즈가부시끼가이샤 열전도 시트 및 열전도 시트를 사용한 방열 장치
CN108727831A (zh) * 2018-05-23 2018-11-02 湖南博隽生物医药有限公司 一种医用抗菌硅胶材料及其制备方法
EP4249461A4 (en) * 2020-11-20 2024-11-20 Shin-Etsu Chemical Co., Ltd. Phenol compound, electroconductive paste composition, method for producing electroconductive paste composition, and electroconductive wiring line and production method therefor

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1272858A (zh) * 1998-04-17 2000-11-08 Ck韦特科公司 有机硅低聚物及含该低聚物的可固化组合物
WO2006098493A1 (en) * 2005-03-15 2006-09-21 Dow Corning Toray Co., Ltd. Curable silicone composition and electronic device produced therefrom
WO2006118334A1 (en) * 2005-04-27 2006-11-09 Dow Corning Toray Co., Ltd. Curable silicone composition and cured product therefrom

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3367964B2 (ja) 1992-04-21 2003-01-20 東レ・ダウコーニング・シリコーン株式会社 硬化性樹脂組成物
JP3786139B2 (ja) 1992-05-26 2006-06-14 東レ・ダウコーニング株式会社 硬化性シリコーン組成物
JP2705519B2 (ja) 1993-02-26 1998-01-28 松下電工株式会社 液状エポキシ樹脂組成物
EP0620242B1 (en) * 1993-04-15 1998-08-19 Dow Corning Toray Silicone Company, Limited Epoxy group-containing silicone resin and compositions based thereon
JP3466239B2 (ja) 1993-08-18 2003-11-10 東レ・ダウコーニング・シリコーン株式会社 硬化性樹脂組成物
US6225704B1 (en) 1999-02-12 2001-05-01 Shin-Etsu Chemical Co., Ltd. Flip-chip type semiconductor device
JP3773022B2 (ja) 1999-02-12 2006-05-10 信越化学工業株式会社 フリップチップ型半導体装置
JP4019254B2 (ja) * 2002-04-24 2007-12-12 信越化学工業株式会社 導電性樹脂組成物
JP2004352947A (ja) * 2003-05-30 2004-12-16 Shin Etsu Chem Co Ltd 室温硬化型熱伝導性シリコーンゴム組成物
TWI345576B (en) * 2003-11-07 2011-07-21 Dow Corning Toray Silicone Curable silicone composition and cured product thereof
JP5217119B2 (ja) * 2005-06-15 2013-06-19 日立化成株式会社 封止用液状エポキシ樹脂組成物、電子部品装置及びウエハーレベルチップサイズパッケージ
JP5207591B2 (ja) 2006-02-23 2013-06-12 東レ・ダウコーニング株式会社 半導体装置の製造方法および半導体装置
JP5285846B2 (ja) * 2006-09-11 2013-09-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5248012B2 (ja) 2006-12-25 2013-07-31 東レ・ダウコーニング株式会社 硬化性シリコーン組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1272858A (zh) * 1998-04-17 2000-11-08 Ck韦特科公司 有机硅低聚物及含该低聚物的可固化组合物
WO2006098493A1 (en) * 2005-03-15 2006-09-21 Dow Corning Toray Co., Ltd. Curable silicone composition and electronic device produced therefrom
WO2006118334A1 (en) * 2005-04-27 2006-11-09 Dow Corning Toray Co., Ltd. Curable silicone composition and cured product therefrom

Also Published As

Publication number Publication date
KR20100083146A (ko) 2010-07-21
WO2009051084A2 (en) 2009-04-23
EP2201068A2 (en) 2010-06-30
US8563666B2 (en) 2013-10-22
JP5422109B2 (ja) 2014-02-19
WO2009051084A3 (en) 2009-06-25
ATE514751T1 (de) 2011-07-15
JP2009096865A (ja) 2009-05-07
CN101827891A (zh) 2010-09-08
US20100213404A1 (en) 2010-08-26
TW200934826A (en) 2009-08-16
EP2201068B1 (en) 2011-06-29

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