ATE514751T1 - Härtbare silikonzusammensetzung und gehärtetes produkt daraus - Google Patents

Härtbare silikonzusammensetzung und gehärtetes produkt daraus

Info

Publication number
ATE514751T1
ATE514751T1 AT08839384T AT08839384T ATE514751T1 AT E514751 T1 ATE514751 T1 AT E514751T1 AT 08839384 T AT08839384 T AT 08839384T AT 08839384 T AT08839384 T AT 08839384T AT E514751 T1 ATE514751 T1 AT E514751T1
Authority
AT
Austria
Prior art keywords
silicone composition
cured silicone
hardened product
epoxy
cured
Prior art date
Application number
AT08839384T
Other languages
German (de)
English (en)
Inventor
Yoshitsugu Morita
Hiroshi Ueki
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Application granted granted Critical
Publication of ATE514751T1 publication Critical patent/ATE514751T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
AT08839384T 2007-10-16 2008-10-06 Härtbare silikonzusammensetzung und gehärtetes produkt daraus ATE514751T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007269034A JP5422109B2 (ja) 2007-10-16 2007-10-16 硬化性シリコーン組成物およびその硬化物
PCT/JP2008/068516 WO2009051084A2 (en) 2007-10-16 2008-10-06 Curable silicone composition and cured product thereof

Publications (1)

Publication Number Publication Date
ATE514751T1 true ATE514751T1 (de) 2011-07-15

Family

ID=40567912

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08839384T ATE514751T1 (de) 2007-10-16 2008-10-06 Härtbare silikonzusammensetzung und gehärtetes produkt daraus

Country Status (8)

Country Link
US (1) US8563666B2 (enExample)
EP (1) EP2201068B1 (enExample)
JP (1) JP5422109B2 (enExample)
KR (1) KR20100083146A (enExample)
CN (1) CN101827891B (enExample)
AT (1) ATE514751T1 (enExample)
TW (1) TW200934826A (enExample)
WO (1) WO2009051084A2 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5547369B2 (ja) * 2007-09-28 2014-07-09 東レ・ダウコーニング株式会社 硬化性液状エポキシ樹脂組成物およびその硬化物
US20130146118A1 (en) * 2011-12-12 2013-06-13 Dow Corning Corporation Silicone Junction Box and Assemblies
JP5996085B2 (ja) 2013-02-27 2016-09-21 株式会社朝日ラバー 白色反射膜用インク、白色反射膜用粉体塗料及び白色反射膜の製造方法
KR102220457B1 (ko) * 2013-03-25 2021-02-25 다이니폰 인사츠 가부시키가이샤 전지용 포장 재료
CN103333463A (zh) * 2013-06-26 2013-10-02 苏州天脉导热科技有限公司 一种导热母粒的制备方法
KR102465006B1 (ko) 2014-12-18 2022-11-10 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 경화성 유기폴리실록산 조성물, 이의 경화물, 및 경화 필름의 형성 방법
CN104774470B (zh) * 2015-03-25 2017-07-07 清华大学深圳研究生院 一种用于大功率led的密封剂及大功率led
JP6736844B2 (ja) * 2015-07-16 2020-08-05 凸版印刷株式会社 化粧シート及び化粧板
JP6714613B2 (ja) * 2015-11-30 2020-06-24 住友理工株式会社 電子写真機器用弾性ロールおよびその製造方法
JP6847597B2 (ja) * 2016-06-22 2021-03-24 株式会社ダイセル シルセスキオキサン
JP6610491B2 (ja) * 2016-10-03 2019-11-27 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
US20200385609A1 (en) * 2017-07-31 2020-12-10 Dow Global Technologies Llc Ice-phobic coatings
KR102428503B1 (ko) 2017-09-07 2022-08-04 다우 글로벌 테크놀로지스 엘엘씨 열전도성 아이스-포빅 코팅
CN108276777A (zh) * 2018-01-23 2018-07-13 苏州矽美科导热科技有限公司 一种高弹力导热硅胶片及其制备方法
JP7067571B2 (ja) 2018-02-16 2022-05-16 昭和電工マテリアルズ株式会社 熱伝導シート及び熱伝導シートを用いた放熱装置
CN108727831A (zh) * 2018-05-23 2018-11-02 湖南博隽生物医药有限公司 一种医用抗菌硅胶材料及其制备方法
JP7267500B2 (ja) * 2020-11-20 2023-05-01 信越化学工業株式会社 導電性ペースト組成物、導電性ペースト組成物の製造方法、導電配線及びその製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3367964B2 (ja) 1992-04-21 2003-01-20 東レ・ダウコーニング・シリコーン株式会社 硬化性樹脂組成物
JP3786139B2 (ja) 1992-05-26 2006-06-14 東レ・ダウコーニング株式会社 硬化性シリコーン組成物
JP2705519B2 (ja) 1993-02-26 1998-01-28 松下電工株式会社 液状エポキシ樹脂組成物
EP0620242B1 (en) * 1993-04-15 1998-08-19 Dow Corning Toray Silicone Company, Limited Epoxy group-containing silicone resin and compositions based thereon
JP3466239B2 (ja) 1993-08-18 2003-11-10 東レ・ダウコーニング・シリコーン株式会社 硬化性樹脂組成物
US6140445A (en) * 1998-04-17 2000-10-31 Crompton Corporation Silane functional oligomer
JP3773022B2 (ja) 1999-02-12 2006-05-10 信越化学工業株式会社 フリップチップ型半導体装置
US6225704B1 (en) * 1999-02-12 2001-05-01 Shin-Etsu Chemical Co., Ltd. Flip-chip type semiconductor device
JP4019254B2 (ja) * 2002-04-24 2007-12-12 信越化学工業株式会社 導電性樹脂組成物
JP2004352947A (ja) * 2003-05-30 2004-12-16 Shin Etsu Chem Co Ltd 室温硬化型熱伝導性シリコーンゴム組成物
TWI345576B (en) * 2003-11-07 2011-07-21 Dow Corning Toray Silicone Curable silicone composition and cured product thereof
JP5166677B2 (ja) * 2005-03-15 2013-03-21 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5004433B2 (ja) * 2005-04-27 2012-08-22 東レ・ダウコーニング株式会社 硬化性シリコーン組成物およびその硬化物
JP5217119B2 (ja) * 2005-06-15 2013-06-19 日立化成株式会社 封止用液状エポキシ樹脂組成物、電子部品装置及びウエハーレベルチップサイズパッケージ
JP5207591B2 (ja) 2006-02-23 2013-06-12 東レ・ダウコーニング株式会社 半導体装置の製造方法および半導体装置
JP5285846B2 (ja) * 2006-09-11 2013-09-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5248012B2 (ja) 2006-12-25 2013-07-31 東レ・ダウコーニング株式会社 硬化性シリコーン組成物

Also Published As

Publication number Publication date
TW200934826A (en) 2009-08-16
JP2009096865A (ja) 2009-05-07
WO2009051084A2 (en) 2009-04-23
CN101827891B (zh) 2012-05-23
EP2201068A2 (en) 2010-06-30
EP2201068B1 (en) 2011-06-29
JP5422109B2 (ja) 2014-02-19
US8563666B2 (en) 2013-10-22
US20100213404A1 (en) 2010-08-26
WO2009051084A3 (en) 2009-06-25
CN101827891A (zh) 2010-09-08
KR20100083146A (ko) 2010-07-21

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