BR112014009386A2 - massa adesiva, especialmente, para a blindagem de um conjunto eletrônico - Google Patents
massa adesiva, especialmente, para a blindagem de um conjunto eletrônicoInfo
- Publication number
- BR112014009386A2 BR112014009386A2 BR112014009386A BR112014009386A BR112014009386A2 BR 112014009386 A2 BR112014009386 A2 BR 112014009386A2 BR 112014009386 A BR112014009386 A BR 112014009386A BR 112014009386 A BR112014009386 A BR 112014009386A BR 112014009386 A2 BR112014009386 A2 BR 112014009386A2
- Authority
- BR
- Brazil
- Prior art keywords
- adhesive
- type
- shielding
- electronic assembly
- softening temperature
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title abstract 3
- 230000001070 adhesive effect Effects 0.000 title abstract 3
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 abstract 1
- 239000004840 adhesive resin Substances 0.000 abstract 1
- 229920006223 adhesive resin Polymers 0.000 abstract 1
- 125000002091 cationic group Chemical group 0.000 abstract 1
- 229920001577 copolymer Polymers 0.000 abstract 1
- 150000004292 cyclic ethers Chemical class 0.000 abstract 1
- 229920001519 homopolymer Polymers 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 abstract 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
- C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L93/00—Compositions of natural resins; Compositions of derivatives thereof
- C08L93/04—Rosin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J193/00—Adhesives based on natural resins; Adhesives based on derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J193/00—Adhesives based on natural resins; Adhesives based on derivatives thereof
- C09J193/04—Rosin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/387—Block-copolymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L93/00—Compositions of natural resins; Compositions of derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2453/00—Presence of block copolymer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/269—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension including synthetic resin or polymer layer or component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
Abstract
resumo patente de invenção: "massa adesiva, especialmente, para a blindagem de um conjunto eletrônico". a presente invenção refere-se a massa adesiva especialmente para blindagem de um conjunto eletrônico contra permeantes, abrangendo (a) pelo menos, um copolímero contendo pelo menos isobutileno ou butileno como tipo de comonômero e pelo menos um tipo de comonômero, o qual - considerado como homopolímero hipotético - apresenta uma temperatura de amolecimento superior a 40°c; (b) pelo menos, um tipo de uma resina autoadesiva, pelo menos, parcialmente hidratada; (c) pelo menos, um tipo de uma resina reativa, na base de um éter cíclico com uma temperatura de amolecimento inferior a 40°c, preferencialmente, inferior a 20°c; (d) pelo menos, um tipo de um fotoiniciador para iniciar um endurecimento catiônico.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011085030 | 2011-10-21 | ||
DE102012202377A DE102012202377A1 (de) | 2011-10-21 | 2012-02-16 | Klebemasse insbesondere zur Kapselung einer elektronischen Anordnung |
PCT/EP2012/070779 WO2013057265A1 (de) | 2011-10-21 | 2012-10-19 | Klebemasse insbesondere zur kapselung einer elektronischen anordnung |
Publications (1)
Publication Number | Publication Date |
---|---|
BR112014009386A2 true BR112014009386A2 (pt) | 2017-04-18 |
Family
ID=48051458
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112014009386A BR112014009386A2 (pt) | 2011-10-21 | 2012-10-19 | massa adesiva, especialmente, para a blindagem de um conjunto eletrônico |
Country Status (11)
Country | Link |
---|---|
US (1) | US20140315016A1 (pt) |
EP (1) | EP2768919B1 (pt) |
JP (1) | JP6263122B2 (pt) |
KR (1) | KR101959973B1 (pt) |
CN (1) | CN104011161B (pt) |
BR (1) | BR112014009386A2 (pt) |
DE (1) | DE102012202377A1 (pt) |
MX (1) | MX2014004595A (pt) |
PL (1) | PL2768919T3 (pt) |
TW (1) | TWI572689B (pt) |
WO (1) | WO2013057265A1 (pt) |
Families Citing this family (55)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI488740B (zh) * | 2012-01-06 | 2015-06-21 | Lg Chemical Ltd | 包封用膜 |
WO2014125961A1 (ja) * | 2013-02-12 | 2014-08-21 | 三菱樹脂株式会社 | 透明両面接着性シート、これを用いた画像表示装置構成用積層体、この積層体の製造方法、及びこの積層体を用いてなる画像表示装置 |
TWI479464B (zh) * | 2013-05-09 | 2015-04-01 | Au Optronics Corp | 顯示面板及其封裝方法 |
US10103352B2 (en) * | 2013-05-21 | 2018-10-16 | Lg Chem, Ltd. | Organic electronic device having dimension tolerance between encapsulating layer and metal-containing layer less than or equal to 200 microns |
DE102013224773A1 (de) | 2013-12-03 | 2015-06-03 | Tesa Se | Mehrphasige Polymerzusammensetzung |
KR101762778B1 (ko) | 2014-03-04 | 2017-07-28 | 엘지이노텍 주식회사 | 무선 충전 및 통신 기판 그리고 무선 충전 및 통신 장치 |
DE102014207074A1 (de) | 2014-04-11 | 2015-10-15 | Tesa Se | Klebeband für die Kapselung einer organischen elektronischen Anordnung |
DE102014208111A1 (de) * | 2014-04-29 | 2015-10-29 | Tesa Se | Verfahren zur Herstellung einer Verklebung auf Permeat sensiblen Oberflächen |
DE102014208109A1 (de) * | 2014-04-29 | 2015-10-29 | Tesa Se | Spaltbares Klebend mit dosierfähigen spaltbaren Flüssigklebstoff |
JP6378985B2 (ja) * | 2014-09-10 | 2018-08-22 | 積水化学工業株式会社 | 有機エレクトロルミネッセンス表示素子用封止剤 |
WO2016058975A2 (en) * | 2014-10-15 | 2016-04-21 | Media Lario | Process for forming an article with a precision surface |
US10280344B2 (en) | 2014-10-29 | 2019-05-07 | Tesa Se | Adhesive compounds comprising multi-functional siloxane water scavengers |
DE102014119453A1 (de) | 2014-12-22 | 2016-06-23 | Endress+Hauser Flowtec Ag | Verfahren zur Defekterkennung der Signalleitung zwischen einer Elektrode und einer Mess- und/oder Auswerteeinheit eines magnetisch-induktiven Durchflussmessgerätes |
TWI589688B (zh) * | 2015-03-24 | 2017-07-01 | Lg化學股份有限公司 | 黏合組成物 |
EP3275958B1 (en) * | 2015-03-24 | 2020-09-30 | LG Chem, Ltd. | Adhesive composition |
US10421887B2 (en) | 2015-03-24 | 2019-09-24 | Lg Chem, Ltd. | Adhesive composition |
DE102015217860A1 (de) * | 2015-05-05 | 2016-11-10 | Tesa Se | Klebeband mit Klebemasse mit kontinuierlicher Polymerphase |
DE102015210346A1 (de) | 2015-06-04 | 2016-12-08 | Tesa Se | Verfahren zur Herstellung viskoser Epoxidsirupe und danach erhältliche Epoxidsirupe |
DE102015210345A1 (de) * | 2015-06-04 | 2016-12-08 | Tesa Se | Wasserdampfsperrende Klebemasse mit anpolymerisiertem Epoxidsirup |
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DE102015212058A1 (de) * | 2015-06-29 | 2016-12-29 | Tesa Se | Klebemasse insbesondere zur Kapselung einer elektronischen Anordnung |
DE102015113505A1 (de) * | 2015-08-17 | 2017-02-23 | Endress+Hauser Flowtec Ag | Durchflussmessgerät und Verfahren zur Herstellung eines Messrohres |
DE102016207540A1 (de) * | 2016-05-02 | 2017-11-02 | Tesa Se | Wasserdampfsperrende Klebemasse mit hochfunktionalisiertem Poly(meth)acrylat |
DE102016213840A1 (de) * | 2016-07-27 | 2018-02-01 | Tesa Se | Klebeband zur Verkapselung elektronischer Aufbauten |
DE102016213911A1 (de) | 2016-07-28 | 2018-02-01 | Tesa Se | OLED kompatible Klebemassen mit cyclischen Azasilanwasserfängern |
TW201828505A (zh) * | 2017-01-20 | 2018-08-01 | 聯京光電股份有限公司 | 光電封裝體及其製造方法 |
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KR101962744B1 (ko) * | 2017-08-22 | 2019-03-27 | (주)이녹스첨단소재 | 유기전자장치 봉지재용 접착필름 및 이를 포함하는 유기전자장치용 봉지재 |
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AU2018361705B2 (en) * | 2017-11-02 | 2023-01-19 | Commonwealth Scientific And Industrial Research Organisation | Electrolyte composition |
JP2019137721A (ja) * | 2018-02-06 | 2019-08-22 | スリーエム イノベイティブ プロパティズ カンパニー | 樹脂組成物、隙間充填用接着剤、隙間充填用接着剤の製造方法及び隙間充填方法 |
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DE102018204463A1 (de) * | 2018-03-23 | 2019-09-26 | Tesa Se | Witterungsbeständige Klebemasse mit gutem Auffließvermögen und darauf basierende Klebebänder |
TWI799557B (zh) | 2018-03-28 | 2023-04-21 | 日商琳得科股份有限公司 | 樹脂組合物、密封片及密封體 |
DE102018208168A1 (de) * | 2018-05-24 | 2019-11-28 | Tesa Se | Kombination einer transparenten vollflächigen Verkapselung mit einer (intransparenten) Randverkapselung mit hohem Gettergehalt |
CN112424245A (zh) | 2018-07-12 | 2021-02-26 | 3M创新有限公司 | 包含苯乙烯-异丁烯嵌段共聚物和烯键式不饱和单体的组合物 |
US20210008842A1 (en) * | 2018-07-26 | 2021-01-14 | Saint-Gobain Glass France | Composite pane with a functional element having electrically controllable optical properties with improved edge sealing |
CN109266014A (zh) * | 2018-09-11 | 2019-01-25 | 安徽晨讯智能科技有限公司 | 一种用于晶体管封装的凝胶材料 |
US20200202192A1 (en) * | 2018-12-20 | 2020-06-25 | Shenzhen Leadercolor Smart Card Co., Ltd | Attached-type smart label |
TWI718463B (zh) | 2018-12-28 | 2021-02-11 | 友達光電股份有限公司 | 顯示裝置 |
CN109815838A (zh) * | 2018-12-29 | 2019-05-28 | 武汉华星光电技术有限公司 | 高分子复合材料的制备方法及指纹识别的显示面板 |
WO2020203903A1 (ja) * | 2019-03-29 | 2020-10-08 | 三菱ケミカル株式会社 | 樹脂組成物、フィルム及び多層構造体 |
CN112310302A (zh) * | 2019-07-30 | 2021-02-02 | 陕西坤同半导体科技有限公司 | 一种有机发光器件 |
EP4038143A2 (en) * | 2019-10-03 | 2022-08-10 | 3M Innovative Properties Company | Silicone elastomers by free radical mediated cure |
DE102020207783A1 (de) | 2020-06-23 | 2021-12-23 | Tesa Se | Leitfähiger doppelseitiger Haftklebestreifen |
DE102020210893B4 (de) | 2020-08-28 | 2022-12-08 | Tesa Se | Verfahren zur Herstellung von versiegelten Klebebändern mit aushärtbaren Klebemassen, versiegeltes Klebeband und Verwendung |
DE102021201094A1 (de) | 2021-02-05 | 2022-08-11 | Tesa Se | Polyvinylaromat-Polydien-Blockcopolymer basierende Haftklebemassen mit gesteigerter Wärmescherfestigkeit |
CN113683865B (zh) * | 2021-08-25 | 2024-04-16 | 湖南国芯半导体科技有限公司 | 一种灌封用环氧组合物及灌封材料和应用 |
DE102022105737A1 (de) | 2022-03-11 | 2023-09-14 | Tesa Se | Aushärtbare Klebemasse mit verbesserter Stanzbarkeit und verbesserten Schockeigenschaften |
DE102022105738A1 (de) | 2022-03-11 | 2023-09-14 | Tesa Se | Aushärtbare Klebemasse mit verbesserter Stanzbarkeit |
DE102022111036A1 (de) | 2022-05-04 | 2023-11-09 | Tesa Se | Lichthärtende Klebemasse mit Iodonium Photoinitiatoren |
DE102022124903A1 (de) | 2022-09-28 | 2024-03-28 | Tesa Se | Kationisch härtbare Klebemasse mit definierter Färbung im ausgehärteten Zustand |
DE102022124902A1 (de) | 2022-09-28 | 2024-03-28 | Tesa Se | Kationisch härtbare Klebemasse mit Indikation der Haltefestigkeit |
DE102022124904A1 (de) | 2022-09-28 | 2024-03-28 | Tesa Se | Aushärtbare Haftklebemasse mit verbesserten Klebeeigenschaften |
Family Cites Families (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3729313A (en) | 1971-12-06 | 1973-04-24 | Minnesota Mining & Mfg | Novel photosensitive systems comprising diaryliodonium compounds and their use |
US3741769A (en) | 1972-10-24 | 1973-06-26 | Minnesota Mining & Mfg | Novel photosensitive polymerizable systems and their use |
AU497960B2 (en) | 1974-04-11 | 1979-01-25 | Minnesota Mining And Manufacturing Company | Photopolymerizable compositions |
US4058401A (en) | 1974-05-02 | 1977-11-15 | General Electric Company | Photocurable compositions containing group via aromatic onium salts |
US4256828A (en) | 1975-09-02 | 1981-03-17 | Minnesota Mining And Manufacturing Company | Photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials |
US4051195A (en) | 1975-12-15 | 1977-09-27 | Celanese Polymer Specialties Company | Polyepoxide-polyacrylate ester compositions |
GB1552046A (en) | 1977-02-02 | 1979-09-05 | Ciba Geigy Ag | Film adhesives |
US4138255A (en) | 1977-06-27 | 1979-02-06 | General Electric Company | Photo-curing method for epoxy resin using group VIa onium salt |
US4231951A (en) | 1978-02-08 | 1980-11-04 | Minnesota Mining And Manufacturing Company | Complex salt photoinitiator |
US4250053A (en) | 1979-05-21 | 1981-02-10 | Minnesota Mining And Manufacturing Company | Sensitized aromatic iodonium or aromatic sulfonium salt photoinitiator systems |
US5089536A (en) | 1982-11-22 | 1992-02-18 | Minnesota Mining And Manufacturing Company | Energy polmerizable compositions containing organometallic initiators |
US5128388A (en) * | 1987-11-30 | 1992-07-07 | Sunstar Giken Kabushiki Kaisha | Hot melt adhesive crosslinkable by ultraviolet irradiation, optical disc using the same and process for preparing thereof |
JPH1077038A (ja) * | 1996-08-30 | 1998-03-24 | Showa Denko Plast Prod Kk | 合成樹脂製パレットの滑り止め材 |
WO1998021287A1 (en) | 1996-11-12 | 1998-05-22 | Minnesota Mining And Manufacturing Company | Thermosettable pressure sensitive adhesive |
WO2000041978A1 (de) | 1999-01-11 | 2000-07-20 | Schott Display Glas Gmbh | Polymerbeschichtete dünnglasfoliensubstrate |
DE10048059A1 (de) | 2000-09-28 | 2002-04-18 | Henkel Kgaa | Klebstoff mit Barriereeigenschaften |
EP1270553B1 (en) | 2001-06-29 | 2009-11-18 | JSR Corporation | Acid generator, sulfonic acid, sulfonic acid derivatives and radiation-sensitive resin composition |
CN1558921A (zh) | 2001-08-03 | 2004-12-29 | Dsm | 显示器件用可固化组合物 |
CN1320076C (zh) | 2002-06-17 | 2007-06-06 | 积水化学工业株式会社 | 有机电致发光元件密封用粘接剂及其应用 |
CN1678639A (zh) * | 2002-07-24 | 2005-10-05 | 粘合剂研究公司 | 可转换的压敏粘合剂胶带及其在显示屏上的用途 |
DE10234369A1 (de) * | 2002-07-27 | 2004-02-12 | Henkel Kgaa | Strahlungsvernetzbare Schmelzhaftklebstoffe |
US7449629B2 (en) * | 2002-08-21 | 2008-11-11 | Truseal Technologies, Inc. | Solar panel including a low moisture vapor transmission rate adhesive composition |
EP1473595A1 (en) * | 2003-04-29 | 2004-11-03 | KRATON Polymers Research B.V. | Photopolymerizable compositions and flexographic printing plates derived therefrom |
JP4475084B2 (ja) | 2003-10-03 | 2010-06-09 | Jsr株式会社 | 有機el素子用透明封止材 |
DE10357321A1 (de) * | 2003-12-05 | 2005-07-21 | Tesa Ag | Hochtackige Klebmasse, Verfahren zu deren Herstellung und deren Verwendung |
US20080139734A1 (en) | 2004-03-26 | 2008-06-12 | Tohru Nakashima | Sealing Material Composition |
JP4711171B2 (ja) | 2004-12-28 | 2011-06-29 | 日本電気硝子株式会社 | 板ガラス製造装置及び板ガラス製造方法 |
US20070135552A1 (en) | 2005-12-09 | 2007-06-14 | General Atomics | Gas barrier |
JP2007197517A (ja) * | 2006-01-24 | 2007-08-09 | Three M Innovative Properties Co | 接着性封止組成物、封止フィルム及び有機el素子 |
US8809458B2 (en) | 2006-12-01 | 2014-08-19 | Kaneka Corporation | Polysiloxane composition |
CN101743779B (zh) | 2007-05-18 | 2012-07-11 | 汉高股份两合公司 | 通过弹性体层压粘合剂保护的有机电子器件 |
US8232350B2 (en) * | 2008-06-02 | 2012-07-31 | 3M Innovative Properties Company | Adhesive encapsulating composition and electronic devices made therewith |
JP2010018797A (ja) * | 2008-06-11 | 2010-01-28 | Sekisui Chem Co Ltd | 光学部品用硬化性組成物、光学部品用接着剤及び有機エレクトロルミネッセンス素子用封止剤 |
JP5201347B2 (ja) | 2008-11-28 | 2013-06-05 | 株式会社スリーボンド | 有機el素子封止用光硬化性樹脂組成物 |
DE102008060113A1 (de) * | 2008-12-03 | 2010-07-29 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
DE102008062130A1 (de) * | 2008-12-16 | 2010-06-17 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
TW201111463A (en) * | 2009-08-04 | 2011-04-01 | 3M Innovative Properties Co | Non-halogentaed polyisobutylene-thermoplastic elastomer blend pressure sensitive adhesives |
-
2012
- 2012-02-16 DE DE102012202377A patent/DE102012202377A1/de not_active Withdrawn
- 2012-10-19 JP JP2014536260A patent/JP6263122B2/ja active Active
- 2012-10-19 EP EP12775254.1A patent/EP2768919B1/de active Active
- 2012-10-19 US US14/351,800 patent/US20140315016A1/en not_active Abandoned
- 2012-10-19 CN CN201280063692.3A patent/CN104011161B/zh active Active
- 2012-10-19 MX MX2014004595A patent/MX2014004595A/es active IP Right Grant
- 2012-10-19 KR KR1020147013553A patent/KR101959973B1/ko active IP Right Grant
- 2012-10-19 TW TW101138854A patent/TWI572689B/zh active
- 2012-10-19 PL PL12775254T patent/PL2768919T3/pl unknown
- 2012-10-19 BR BR112014009386A patent/BR112014009386A2/pt not_active Application Discontinuation
- 2012-10-19 WO PCT/EP2012/070779 patent/WO2013057265A1/de active Application Filing
Also Published As
Publication number | Publication date |
---|---|
KR20140090636A (ko) | 2014-07-17 |
JP6263122B2 (ja) | 2018-01-17 |
DE102012202377A1 (de) | 2013-04-25 |
CN104011161B (zh) | 2016-08-31 |
EP2768919A1 (de) | 2014-08-27 |
MX2014004595A (es) | 2014-05-27 |
TW201345996A (zh) | 2013-11-16 |
WO2013057265A1 (de) | 2013-04-25 |
US20140315016A1 (en) | 2014-10-23 |
JP2014534309A (ja) | 2014-12-18 |
KR101959973B1 (ko) | 2019-03-19 |
PL2768919T3 (pl) | 2016-01-29 |
CN104011161A (zh) | 2014-08-27 |
EP2768919B1 (de) | 2015-08-05 |
TWI572689B (zh) | 2017-03-01 |
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