PL2768919T3 - Masa klejąca, w szczególności do hermetyzacji układu elektronicznego - Google Patents
Masa klejąca, w szczególności do hermetyzacji układu elektronicznegoInfo
- Publication number
- PL2768919T3 PL2768919T3 PL12775254T PL12775254T PL2768919T3 PL 2768919 T3 PL2768919 T3 PL 2768919T3 PL 12775254 T PL12775254 T PL 12775254T PL 12775254 T PL12775254 T PL 12775254T PL 2768919 T3 PL2768919 T3 PL 2768919T3
- Authority
- PL
- Poland
- Prior art keywords
- encapsulating
- electronic assembly
- adhesive substance
- substance
- adhesive
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title 1
- 230000001070 adhesive effect Effects 0.000 title 1
- 239000000126 substance Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
- C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L93/00—Compositions of natural resins; Compositions of derivatives thereof
- C08L93/04—Rosin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J193/00—Adhesives based on natural resins; Adhesives based on derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J193/00—Adhesives based on natural resins; Adhesives based on derivatives thereof
- C09J193/04—Rosin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/387—Block-copolymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L93/00—Compositions of natural resins; Compositions of derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2453/00—Presence of block copolymer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/269—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension including synthetic resin or polymer layer or component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- Geochemistry & Mineralogy (AREA)
- Ceramic Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Sealing Material Composition (AREA)
- Adhesive Tapes (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011085030 | 2011-10-21 | ||
DE102012202377A DE102012202377A1 (de) | 2011-10-21 | 2012-02-16 | Klebemasse insbesondere zur Kapselung einer elektronischen Anordnung |
EP12775254.1A EP2768919B1 (de) | 2011-10-21 | 2012-10-19 | Klebemasse insbesondere zur kapselung einer elektronischen anordnung |
PCT/EP2012/070779 WO2013057265A1 (de) | 2011-10-21 | 2012-10-19 | Klebemasse insbesondere zur kapselung einer elektronischen anordnung |
Publications (1)
Publication Number | Publication Date |
---|---|
PL2768919T3 true PL2768919T3 (pl) | 2016-01-29 |
Family
ID=48051458
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL12775254T PL2768919T3 (pl) | 2011-10-21 | 2012-10-19 | Masa klejąca, w szczególności do hermetyzacji układu elektronicznego |
Country Status (11)
Country | Link |
---|---|
US (1) | US20140315016A1 (pl) |
EP (1) | EP2768919B1 (pl) |
JP (1) | JP6263122B2 (pl) |
KR (1) | KR101959973B1 (pl) |
CN (1) | CN104011161B (pl) |
BR (1) | BR112014009386A2 (pl) |
DE (1) | DE102012202377A1 (pl) |
MX (1) | MX2014004595A (pl) |
PL (1) | PL2768919T3 (pl) |
TW (1) | TWI572689B (pl) |
WO (1) | WO2013057265A1 (pl) |
Families Citing this family (56)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101353426B1 (ko) * | 2012-01-06 | 2014-01-21 | 주식회사 엘지화학 | 봉지용 필름 |
CN104937059B (zh) * | 2013-02-12 | 2017-09-22 | 三菱化学株式会社 | 透明双面粘接片、使用该透明双面粘接片的用于构成图像显示装置的叠层体、该叠层体的制造方法、以及使用该叠层体而形成的图像显示装置 |
TWI479464B (zh) * | 2013-05-09 | 2015-04-01 | Au Optronics Corp | 顯示面板及其封裝方法 |
US10403850B2 (en) * | 2013-05-21 | 2019-09-03 | Lg Chem, Ltd. | Encapsulation film and method for encapsulating organic electronic device using same |
DE102013224773A1 (de) | 2013-12-03 | 2015-06-03 | Tesa Se | Mehrphasige Polymerzusammensetzung |
KR101762778B1 (ko) | 2014-03-04 | 2017-07-28 | 엘지이노텍 주식회사 | 무선 충전 및 통신 기판 그리고 무선 충전 및 통신 장치 |
DE102014207074A1 (de) | 2014-04-11 | 2015-10-15 | Tesa Se | Klebeband für die Kapselung einer organischen elektronischen Anordnung |
DE102014208109A1 (de) * | 2014-04-29 | 2015-10-29 | Tesa Se | Spaltbares Klebend mit dosierfähigen spaltbaren Flüssigklebstoff |
DE102014208111A1 (de) * | 2014-04-29 | 2015-10-29 | Tesa Se | Verfahren zur Herstellung einer Verklebung auf Permeat sensiblen Oberflächen |
JP6378985B2 (ja) * | 2014-09-10 | 2018-08-22 | 積水化学工業株式会社 | 有機エレクトロルミネッセンス表示素子用封止剤 |
JP7053261B2 (ja) * | 2014-10-15 | 2022-04-12 | メディア ラリオ エス.アール.エル. | 精密表面を有する物品を形成するプロセス |
US10280344B2 (en) | 2014-10-29 | 2019-05-07 | Tesa Se | Adhesive compounds comprising multi-functional siloxane water scavengers |
DE102014119453A1 (de) | 2014-12-22 | 2016-06-23 | Endress+Hauser Flowtec Ag | Verfahren zur Defekterkennung der Signalleitung zwischen einer Elektrode und einer Mess- und/oder Auswerteeinheit eines magnetisch-induktiven Durchflussmessgerätes |
US10351736B2 (en) | 2015-03-24 | 2019-07-16 | Lg Chem, Ltd. | Adhesive composition |
US10421887B2 (en) | 2015-03-24 | 2019-09-24 | Lg Chem, Ltd. | Adhesive composition |
WO2016153294A1 (ko) * | 2015-03-24 | 2016-09-29 | 주식회사 엘지화학 | 접착제 조성물 |
DE102015217860A1 (de) * | 2015-05-05 | 2016-11-10 | Tesa Se | Klebeband mit Klebemasse mit kontinuierlicher Polymerphase |
DE102015210346A1 (de) | 2015-06-04 | 2016-12-08 | Tesa Se | Verfahren zur Herstellung viskoser Epoxidsirupe und danach erhältliche Epoxidsirupe |
DE102015210345A1 (de) * | 2015-06-04 | 2016-12-08 | Tesa Se | Wasserdampfsperrende Klebemasse mit anpolymerisiertem Epoxidsirup |
CN104934519B (zh) * | 2015-06-23 | 2018-03-27 | 深圳市华星光电技术有限公司 | 一种有机发光二极管的封装方法及显示装置 |
DE102015212058A1 (de) * | 2015-06-29 | 2016-12-29 | Tesa Se | Klebemasse insbesondere zur Kapselung einer elektronischen Anordnung |
DE102015113505A1 (de) * | 2015-08-17 | 2017-02-23 | Endress+Hauser Flowtec Ag | Durchflussmessgerät und Verfahren zur Herstellung eines Messrohres |
DE102016207540A1 (de) * | 2016-05-02 | 2017-11-02 | Tesa Se | Wasserdampfsperrende Klebemasse mit hochfunktionalisiertem Poly(meth)acrylat |
DE102016213840A1 (de) * | 2016-07-27 | 2018-02-01 | Tesa Se | Klebeband zur Verkapselung elektronischer Aufbauten |
DE102016213911A1 (de) | 2016-07-28 | 2018-02-01 | Tesa Se | OLED kompatible Klebemassen mit cyclischen Azasilanwasserfängern |
TW201828505A (zh) * | 2017-01-20 | 2018-08-01 | 聯京光電股份有限公司 | 光電封裝體及其製造方法 |
US9960389B1 (en) | 2017-05-05 | 2018-05-01 | 3M Innovative Properties Company | Polymeric films and display devices containing such films |
US11522025B2 (en) * | 2017-05-05 | 2022-12-06 | 3M Innovative Properties Company | Polymeric films and display devices containing such films |
KR101962744B1 (ko) * | 2017-08-22 | 2019-03-27 | (주)이녹스첨단소재 | 유기전자장치 봉지재용 접착필름 및 이를 포함하는 유기전자장치용 봉지재 |
DE102017219310A1 (de) | 2017-10-27 | 2019-05-02 | Tesa Se | Plasmarandverkapselung von Klebebändern |
KR20200081371A (ko) * | 2017-11-02 | 2020-07-07 | 커먼웰쓰 사이언티픽 앤 인더스트리알 리서치 오거니제이션 | 전해질 조성물 |
JP2019137721A (ja) * | 2018-02-06 | 2019-08-22 | スリーエム イノベイティブ プロパティズ カンパニー | 樹脂組成物、隙間充填用接着剤、隙間充填用接着剤の製造方法及び隙間充填方法 |
DE102018202545A1 (de) | 2018-02-20 | 2019-08-22 | Tesa Se | Zusammensetzung zur Erzeugung einer Klebemasse insbesondere zur Kapselung einer elektronischen Anordnung |
DE102018204463A1 (de) * | 2018-03-23 | 2019-09-26 | Tesa Se | Witterungsbeständige Klebemasse mit gutem Auffließvermögen und darauf basierende Klebebänder |
TWI799557B (zh) | 2018-03-28 | 2023-04-21 | 日商琳得科股份有限公司 | 樹脂組合物、密封片及密封體 |
DE102018208168A1 (de) | 2018-05-24 | 2019-11-28 | Tesa Se | Kombination einer transparenten vollflächigen Verkapselung mit einer (intransparenten) Randverkapselung mit hohem Gettergehalt |
CN112424245A (zh) | 2018-07-12 | 2021-02-26 | 3M创新有限公司 | 包含苯乙烯-异丁烯嵌段共聚物和烯键式不饱和单体的组合物 |
WO2020020614A1 (de) * | 2018-07-26 | 2020-01-30 | Saint-Gobain Glass France | Verbundscheibe mit funktionselement mit elektrisch steuerbaren optischen eigenschaften mit verbesserter randversiegelung |
CN109266014A (zh) * | 2018-09-11 | 2019-01-25 | 安徽晨讯智能科技有限公司 | 一种用于晶体管封装的凝胶材料 |
US20200202192A1 (en) * | 2018-12-20 | 2020-06-25 | Shenzhen Leadercolor Smart Card Co., Ltd | Attached-type smart label |
TWI718463B (zh) | 2018-12-28 | 2021-02-11 | 友達光電股份有限公司 | 顯示裝置 |
CN109815838A (zh) | 2018-12-29 | 2019-05-28 | 武汉华星光电技术有限公司 | 高分子复合材料的制备方法及指纹识别的显示面板 |
WO2020203902A1 (ja) * | 2019-03-29 | 2020-10-08 | 三菱ケミカル株式会社 | 樹脂組成物、フィルム及び多層構造体 |
CN112310302A (zh) * | 2019-07-30 | 2021-02-02 | 陕西坤同半导体科技有限公司 | 一种有机发光器件 |
CN114502662A (zh) * | 2019-10-03 | 2022-05-13 | 3M创新有限公司 | 采用自由基介导固化的有机硅弹性体 |
DE102020207783A1 (de) | 2020-06-23 | 2021-12-23 | Tesa Se | Leitfähiger doppelseitiger Haftklebestreifen |
DE102020210893B4 (de) | 2020-08-28 | 2022-12-08 | Tesa Se | Verfahren zur Herstellung von versiegelten Klebebändern mit aushärtbaren Klebemassen, versiegeltes Klebeband und Verwendung |
DE102021201094A1 (de) | 2021-02-05 | 2022-08-11 | Tesa Se | Polyvinylaromat-Polydien-Blockcopolymer basierende Haftklebemassen mit gesteigerter Wärmescherfestigkeit |
CN113683865B (zh) * | 2021-08-25 | 2024-04-16 | 湖南国芯半导体科技有限公司 | 一种灌封用环氧组合物及灌封材料和应用 |
DE102022105737A1 (de) | 2022-03-11 | 2023-09-14 | Tesa Se | Aushärtbare Klebemasse mit verbesserter Stanzbarkeit und verbesserten Schockeigenschaften |
DE102022105738A1 (de) | 2022-03-11 | 2023-09-14 | Tesa Se | Aushärtbare Klebemasse mit verbesserter Stanzbarkeit |
DE102022111036A1 (de) | 2022-05-04 | 2023-11-09 | Tesa Se | Lichthärtende Klebemasse mit Iodonium Photoinitiatoren |
DE102022124903A1 (de) | 2022-09-28 | 2024-03-28 | Tesa Se | Kationisch härtbare Klebemasse mit definierter Färbung im ausgehärteten Zustand |
DE102022124904A1 (de) | 2022-09-28 | 2024-03-28 | Tesa Se | Aushärtbare Haftklebemasse mit verbesserten Klebeeigenschaften |
DE102022124902A1 (de) | 2022-09-28 | 2024-03-28 | Tesa Se | Kationisch härtbare Klebemasse mit Indikation der Haltefestigkeit |
DE102022129681A1 (de) | 2022-11-10 | 2024-05-16 | Tesa Se | Greifvorrichtung mit integrierter Strahlungsaktivierung |
Family Cites Families (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3729313A (en) | 1971-12-06 | 1973-04-24 | Minnesota Mining & Mfg | Novel photosensitive systems comprising diaryliodonium compounds and their use |
US3741769A (en) | 1972-10-24 | 1973-06-26 | Minnesota Mining & Mfg | Novel photosensitive polymerizable systems and their use |
AU497960B2 (en) | 1974-04-11 | 1979-01-25 | Minnesota Mining And Manufacturing Company | Photopolymerizable compositions |
US4058401A (en) | 1974-05-02 | 1977-11-15 | General Electric Company | Photocurable compositions containing group via aromatic onium salts |
US4256828A (en) | 1975-09-02 | 1981-03-17 | Minnesota Mining And Manufacturing Company | Photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials |
US4051195A (en) | 1975-12-15 | 1977-09-27 | Celanese Polymer Specialties Company | Polyepoxide-polyacrylate ester compositions |
GB1552046A (en) | 1977-02-02 | 1979-09-05 | Ciba Geigy Ag | Film adhesives |
US4138255A (en) | 1977-06-27 | 1979-02-06 | General Electric Company | Photo-curing method for epoxy resin using group VIa onium salt |
US4231951A (en) | 1978-02-08 | 1980-11-04 | Minnesota Mining And Manufacturing Company | Complex salt photoinitiator |
US4250053A (en) | 1979-05-21 | 1981-02-10 | Minnesota Mining And Manufacturing Company | Sensitized aromatic iodonium or aromatic sulfonium salt photoinitiator systems |
US5089536A (en) | 1982-11-22 | 1992-02-18 | Minnesota Mining And Manufacturing Company | Energy polmerizable compositions containing organometallic initiators |
US5128388A (en) * | 1987-11-30 | 1992-07-07 | Sunstar Giken Kabushiki Kaisha | Hot melt adhesive crosslinkable by ultraviolet irradiation, optical disc using the same and process for preparing thereof |
JPH1077038A (ja) * | 1996-08-30 | 1998-03-24 | Showa Denko Plast Prod Kk | 合成樹脂製パレットの滑り止め材 |
EP0938526B1 (en) | 1996-11-12 | 2003-04-23 | Minnesota Mining And Manufacturing Company | Thermosettable pressure sensitive adhesive |
JP2002534305A (ja) | 1999-01-11 | 2002-10-15 | ショット・ディスプレイ・グラース・ゲーエムベーハー | ポリマー被覆薄層ガラスフィルム基板 |
DE10048059A1 (de) | 2000-09-28 | 2002-04-18 | Henkel Kgaa | Klebstoff mit Barriereeigenschaften |
CN1276303C (zh) | 2001-06-29 | 2006-09-20 | Jsr株式会社 | 酸发生剂及辐射敏感树脂组合物 |
KR20040019098A (ko) | 2001-08-03 | 2004-03-04 | 디에스엠 엔.브이 | 표시 장치용 경화성 조성물 |
TW200402456A (en) | 2002-06-17 | 2004-02-16 | Sekisui Chemical Co Ltd | Adhesive, tape and a double side adhensive tape for sealing organic electroluminescent element; an organic electroluminescent element and method thereof |
AU2003261188A1 (en) * | 2002-07-24 | 2004-02-09 | Adhesives Research, Inc. | Transformable pressure sensitive adhesive tape and use thereof in display screens |
DE10234369A1 (de) * | 2002-07-27 | 2004-02-12 | Henkel Kgaa | Strahlungsvernetzbare Schmelzhaftklebstoffe |
US7449629B2 (en) * | 2002-08-21 | 2008-11-11 | Truseal Technologies, Inc. | Solar panel including a low moisture vapor transmission rate adhesive composition |
EP1473595A1 (en) * | 2003-04-29 | 2004-11-03 | KRATON Polymers Research B.V. | Photopolymerizable compositions and flexographic printing plates derived therefrom |
JP4475084B2 (ja) | 2003-10-03 | 2010-06-09 | Jsr株式会社 | 有機el素子用透明封止材 |
DE10357321A1 (de) * | 2003-12-05 | 2005-07-21 | Tesa Ag | Hochtackige Klebmasse, Verfahren zu deren Herstellung und deren Verwendung |
EP1743928A1 (en) | 2004-03-26 | 2007-01-17 | Kaneka Corporation | Sealing material composition |
JP4711171B2 (ja) | 2004-12-28 | 2011-06-29 | 日本電気硝子株式会社 | 板ガラス製造装置及び板ガラス製造方法 |
US20070135552A1 (en) | 2005-12-09 | 2007-06-14 | General Atomics | Gas barrier |
JP2007197517A (ja) | 2006-01-24 | 2007-08-09 | Three M Innovative Properties Co | 接着性封止組成物、封止フィルム及び有機el素子 |
JP5670616B2 (ja) | 2006-12-01 | 2015-02-18 | 株式会社カネカ | ポリシロキサン系組成物 |
WO2008144080A1 (en) | 2007-05-18 | 2008-11-27 | Henkel Ag & Co. Kgaa | Organic electronic devices protected by elastomeric laminating adhesive |
JP5890177B2 (ja) * | 2008-06-02 | 2016-03-22 | スリーエム イノベイティブ プロパティズ カンパニー | 接着剤封入組成物及びそれを用いて作製される電子デバイス |
JP2010018797A (ja) * | 2008-06-11 | 2010-01-28 | Sekisui Chem Co Ltd | 光学部品用硬化性組成物、光学部品用接着剤及び有機エレクトロルミネッセンス素子用封止剤 |
JP5201347B2 (ja) | 2008-11-28 | 2013-06-05 | 株式会社スリーボンド | 有機el素子封止用光硬化性樹脂組成物 |
DE102008060113A1 (de) * | 2008-12-03 | 2010-07-29 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
DE102008062130A1 (de) * | 2008-12-16 | 2010-06-17 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
TW201111463A (en) * | 2009-08-04 | 2011-04-01 | 3M Innovative Properties Co | Non-halogentaed polyisobutylene-thermoplastic elastomer blend pressure sensitive adhesives |
-
2012
- 2012-02-16 DE DE102012202377A patent/DE102012202377A1/de not_active Withdrawn
- 2012-10-19 EP EP12775254.1A patent/EP2768919B1/de active Active
- 2012-10-19 TW TW101138854A patent/TWI572689B/zh active
- 2012-10-19 PL PL12775254T patent/PL2768919T3/pl unknown
- 2012-10-19 JP JP2014536260A patent/JP6263122B2/ja active Active
- 2012-10-19 BR BR112014009386A patent/BR112014009386A2/pt not_active Application Discontinuation
- 2012-10-19 KR KR1020147013553A patent/KR101959973B1/ko active IP Right Grant
- 2012-10-19 MX MX2014004595A patent/MX2014004595A/es active IP Right Grant
- 2012-10-19 US US14/351,800 patent/US20140315016A1/en not_active Abandoned
- 2012-10-19 CN CN201280063692.3A patent/CN104011161B/zh active Active
- 2012-10-19 WO PCT/EP2012/070779 patent/WO2013057265A1/de active Application Filing
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WO2013057265A1 (de) | 2013-04-25 |
JP2014534309A (ja) | 2014-12-18 |
MX2014004595A (es) | 2014-05-27 |
JP6263122B2 (ja) | 2018-01-17 |
DE102012202377A1 (de) | 2013-04-25 |
KR20140090636A (ko) | 2014-07-17 |
TW201345996A (zh) | 2013-11-16 |
CN104011161B (zh) | 2016-08-31 |
EP2768919B1 (de) | 2015-08-05 |
EP2768919A1 (de) | 2014-08-27 |
CN104011161A (zh) | 2014-08-27 |
TWI572689B (zh) | 2017-03-01 |
US20140315016A1 (en) | 2014-10-23 |
KR101959973B1 (ko) | 2019-03-19 |
BR112014009386A2 (pt) | 2017-04-18 |
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