TW200916976A - Lithographic apparatus and device manufacturing method - Google Patents

Lithographic apparatus and device manufacturing method Download PDF

Info

Publication number
TW200916976A
TW200916976A TW097128648A TW97128648A TW200916976A TW 200916976 A TW200916976 A TW 200916976A TW 097128648 A TW097128648 A TW 097128648A TW 97128648 A TW97128648 A TW 97128648A TW 200916976 A TW200916976 A TW 200916976A
Authority
TW
Taiwan
Prior art keywords
substrate
hydrogen
substrate holder
cleaning unit
outer casing
Prior art date
Application number
TW097128648A
Other languages
English (en)
Chinese (zh)
Inventor
Arno Jan Bleeker
Meer Aschwin Lodewijk Hendricus Johannes Van
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of TW200916976A publication Critical patent/TW200916976A/zh

Links

Classifications

    • H10P76/2045—
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning

Landscapes

  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Toxicology (AREA)
  • Plasma & Fusion (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW097128648A 2007-07-30 2008-07-29 Lithographic apparatus and device manufacturing method TW200916976A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/882,081 US7894037B2 (en) 2007-07-30 2007-07-30 Lithographic apparatus and device manufacturing method

Publications (1)

Publication Number Publication Date
TW200916976A true TW200916976A (en) 2009-04-16

Family

ID=39885050

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097128648A TW200916976A (en) 2007-07-30 2008-07-29 Lithographic apparatus and device manufacturing method

Country Status (7)

Country Link
US (1) US7894037B2 (enExample)
JP (1) JP5188576B2 (enExample)
KR (1) KR20100053591A (enExample)
CN (2) CN103543614B (enExample)
NL (1) NL1035732A1 (enExample)
TW (1) TW200916976A (enExample)
WO (1) WO2009015838A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10416092B2 (en) 2013-02-15 2019-09-17 Lam Research Corporation Remote detection of plating on wafer holding apparatus
TWI708870B (zh) * 2013-02-15 2020-11-01 美商蘭姆研究公司 晶圓夾持設備上之鍍層的偵測
US11542630B2 (en) 2012-03-30 2023-01-03 Novellus Systems, Inc. Cleaning electroplating substrate holders using reverse current deplating

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100763532B1 (ko) * 2006-08-17 2007-10-05 삼성전자주식회사 웨이퍼 지지장치, 웨이퍼 노광 장치 및 웨이퍼 지지방법
NL1036618A1 (nl) * 2008-03-24 2009-09-25 Asml Netherlands Bv Encoder-type measurement system, lithograpic apparatus and method to detect an error on or in a grid or grating of an encoder-type measurement system.
WO2009121385A1 (en) * 2008-04-03 2009-10-08 Carl Zeiss Smt Ag Cleaning module and euv lithography device with cleaning module
NL1036832A1 (nl) * 2008-04-15 2009-10-19 Asml Netherlands Bv Lithographic apparatus comprising an internal sensor and a mini-reactor, and method for treating a sensing surface of an internal sensor of a lithographic apparatus.
NL2005739A (en) * 2009-12-22 2011-06-23 Asml Netherlands Bv Object with an improved suitability for a plasma cleaning treatment.
DE102010044970A1 (de) * 2010-09-10 2011-12-22 Carl Zeiss Smt Gmbh Reinigungsmodul für Komponenten von Halbleiterlithographieanlagen und Halbleiterlithographieanlagen
JP5709546B2 (ja) * 2011-01-19 2015-04-30 キヤノン株式会社 エネルギービーム描画装置及びデバイス製造方法
JP5703841B2 (ja) * 2011-02-28 2015-04-22 凸版印刷株式会社 反射型マスク
US9221081B1 (en) 2011-08-01 2015-12-29 Novellus Systems, Inc. Automated cleaning of wafer plating assembly
US9228270B2 (en) 2011-08-15 2016-01-05 Novellus Systems, Inc. Lipseals and contact elements for semiconductor electroplating apparatuses
US10066311B2 (en) 2011-08-15 2018-09-04 Lam Research Corporation Multi-contact lipseals and associated electroplating methods
US9988734B2 (en) 2011-08-15 2018-06-05 Lam Research Corporation Lipseals and contact elements for semiconductor electroplating apparatuses
KR102112881B1 (ko) 2012-03-28 2020-05-19 노벨러스 시스템즈, 인코포레이티드 전자도금 기판 홀더들을 세정하기 위한 방법들 및 장치들
US8901523B1 (en) * 2013-09-04 2014-12-02 Asml Netherlands B.V. Apparatus for protecting EUV optical elements
US9539622B2 (en) * 2014-03-18 2017-01-10 Asml Netherlands B.V. Apparatus for and method of active cleaning of EUV optic with RF plasma field
US10133196B2 (en) * 2014-04-09 2018-11-20 Asml Netherlands B.V. Apparatus for cleaning an object
CN104226637B (zh) * 2014-07-18 2016-06-01 中国科学院长春光学精密机械与物理研究所 用于清洗受污染光学元件的氢原子收集装置与清洗方法
US10053793B2 (en) 2015-07-09 2018-08-21 Lam Research Corporation Integrated elastomeric lipseal and cup bottom for reducing wafer sticking
US9888554B2 (en) * 2016-01-21 2018-02-06 Asml Netherlands B.V. System, method and apparatus for target material debris cleaning of EUV vessel and EUV collector
JP6695750B2 (ja) * 2016-07-04 2020-05-20 株式会社荏原製作所 基板ホルダの検査装置、これを備えためっき装置、及び外観検査装置
JP7001715B2 (ja) * 2017-06-01 2022-01-20 エーエスエムエル ネザーランズ ビー．ブイ． パーティクル除去装置および関連システム
TW201920946A (zh) * 2017-06-29 2019-06-01 美商蘭姆研究公司 晶圓固持設備上電鍍之遠程偵測
EP3447581A1 (en) * 2017-08-23 2019-02-27 ASML Netherlands B.V. A clear-out tool, a lithographic apparatus and a device manufacturing method
US11270906B2 (en) * 2017-10-27 2022-03-08 Asml Holding N.V. Burls with altered surface topography for holding an object in lithography applications
US11448955B2 (en) * 2018-09-27 2022-09-20 Taiwan Semiconductor Manufacturing Co., Ltd. Mask for lithography process and method for manufacturing the same
US11360384B2 (en) * 2018-09-28 2022-06-14 Taiwan Semiconductor Manufacturing Co., Ltd. Method of fabricating and servicing a photomask
CN112955822B (zh) * 2018-11-09 2024-10-11 Asml控股股份有限公司 利用具有可控几何形状和组成的清洁衬底进行刻蚀支撑件清洁
DE102018221191A1 (de) * 2018-12-07 2020-06-10 Carl Zeiss Smt Gmbh Optisches Element zur Reflexion von VUV-Strahlung und optische Anordnung
TWI897405B (zh) * 2019-03-25 2025-09-11 日商亞多納富有限公司 半導體製造系統、其控制方法及控制該系統的電腦程式
CN110161808B (zh) * 2019-05-09 2022-02-22 上海华力微电子有限公司 光栅尺清洁装置和方法、光刻机
US11638938B2 (en) * 2019-06-10 2023-05-02 Kla Corporation In situ process chamber chuck cleaning by cleaning substrate
JP7401396B2 (ja) * 2020-06-04 2023-12-19 キヤノン株式会社 インプリント装置、物品の製造方法、及びインプリント装置のための測定方法
CN112139151A (zh) * 2020-09-11 2020-12-29 韩山师范学院 一种大型设备表面清理装置
US11392041B2 (en) * 2020-09-28 2022-07-19 Taiwan Semiconductor Manufacturing Company, Ltd. Particle removal device and method
CN114690570B (zh) * 2020-12-29 2025-04-25 上海微电子装备（集团）股份有限公司 光刻机、运动台定位测量系统及其工作方法
EP4068000A1 (en) * 2021-03-30 2022-10-05 ASML Netherlands B.V. Conditioning apparatus and method
CN114200778A (zh) * 2021-06-25 2022-03-18 四川大学 一种极紫外光刻机lpp光源收集镜的等离子体原位清洗结构
US11520246B1 (en) 2021-08-30 2022-12-06 Taiwan Semiconductor Manufacturing Company, Ltd. Highly efficient automatic particle cleaner method for EUV systems
CN114454071A (zh) * 2022-02-21 2022-05-10 上海华力微电子有限公司 承载台清洁装置及光刻系统
KR102864171B1 (ko) * 2023-06-16 2025-09-24 한국표준과학연구원 Euv 광원에 의한 광학부품 오염 방지 장치 및 그 방법

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3613288B2 (ja) 1994-10-18 2005-01-26 株式会社ニコン 露光装置用のクリーニング装置
US5825470A (en) * 1995-03-14 1998-10-20 Nikon Corporation Exposure apparatus
JP3585606B2 (ja) * 1995-09-19 2004-11-04 アネルバ株式会社 Ｃｖｄ装置の電極装置
US5746928A (en) * 1996-06-03 1998-05-05 Taiwan Semiconductor Manufacturing Company Ltd Process for cleaning an electrostatic chuck of a plasma etching apparatus
US5834371A (en) * 1997-01-31 1998-11-10 Tokyo Electron Limited Method and apparatus for preparing and metallizing high aspect ratio silicon semiconductor device contacts to reduce the resistivity thereof
TW484039B (en) * 1999-10-12 2002-04-21 Asm Lithography Bv Lithographic projection apparatus and method
JP2001203135A (ja) * 2000-01-20 2001-07-27 Semiconductor Leading Edge Technologies Inc 露光装置のクリーニング方法および露光装置
JP2002280365A (ja) * 2001-03-19 2002-09-27 Applied Materials Inc 静電チャックのクリーニング方法
EP1329773A3 (en) 2002-01-18 2006-08-30 ASML Netherlands B.V. Lithographic apparatus, apparatus cleaning method, and device manufacturing method
EP1329770A1 (en) * 2002-01-18 2003-07-23 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2003234265A (ja) * 2002-02-06 2003-08-22 Canon Inc 露光装置
TWI254839B (en) * 2002-09-30 2006-05-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
DE60323927D1 (de) * 2002-12-13 2008-11-20 Asml Netherlands Bv Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung
EP1939690A1 (en) 2002-12-13 2008-07-02 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
SG115621A1 (en) * 2003-02-24 2005-10-28 Asml Netherlands Bv Method and device for measuring contamination of a surface of a component of a lithographic apparatus
US6919573B2 (en) * 2003-03-20 2005-07-19 Asml Holding N.V Method and apparatus for recycling gases used in a lithography tool
JP4613167B2 (ja) * 2003-05-22 2011-01-12 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 少なくとも一つの光学要素を洗浄する方法および装置
KR101193432B1 (ko) * 2005-01-24 2012-10-24 가부시키가이샤 니콘 계측 방법, 계측 시스템, 검사 방법, 검사 시스템, 노광방법 및 노광 시스템
US7502095B2 (en) * 2005-03-29 2009-03-10 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, and device manufactured thereby
JP5033126B2 (ja) * 2005-06-21 2012-09-26 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 照射ユニット内の光学表面の洗浄化処理および後処理の方法
US8317929B2 (en) * 2005-09-16 2012-11-27 Asml Netherlands B.V. Lithographic apparatus comprising an electrical discharge generator and method for cleaning an element of a lithographic apparatus
JP2007173344A (ja) * 2005-12-20 2007-07-05 Canon Inc 洗浄方法及び装置、露光装置、並びに、デバイス製造方法
US7504643B2 (en) * 2005-12-22 2009-03-17 Asml Netherlands B.V. Method for cleaning a lithographic apparatus module, a cleaning arrangement and a lithographic apparatus comprising the cleaning arrangement
US7522263B2 (en) * 2005-12-27 2009-04-21 Asml Netherlands B.V. Lithographic apparatus and method
US20070146658A1 (en) * 2005-12-27 2007-06-28 Asml Netherlands B.V. Lithographic apparatus and method
US7491951B2 (en) * 2005-12-28 2009-02-17 Asml Netherlands B.V. Lithographic apparatus, system and device manufacturing method
US7473908B2 (en) 2006-07-14 2009-01-06 Asml Netherlands B.V. Getter and cleaning arrangement for a lithographic apparatus and method for cleaning a surface

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11542630B2 (en) 2012-03-30 2023-01-03 Novellus Systems, Inc. Cleaning electroplating substrate holders using reverse current deplating
US10416092B2 (en) 2013-02-15 2019-09-17 Lam Research Corporation Remote detection of plating on wafer holding apparatus
TWI708870B (zh) * 2013-02-15 2020-11-01 美商蘭姆研究公司 晶圓夾持設備上之鍍層的偵測

Also Published As

Publication number Publication date
JP5188576B2 (ja) 2013-04-24
WO2009015838A1 (en) 2009-02-05
NL1035732A1 (nl) 2009-02-02
KR20100053591A (ko) 2010-05-20
CN103543614A (zh) 2014-01-29
JP2010534946A (ja) 2010-11-11
US7894037B2 (en) 2011-02-22
CN101765811A (zh) 2010-06-30
US20090033889A1 (en) 2009-02-05
CN103543614B (zh) 2016-03-09
CN101765811B (zh) 2013-11-20

Similar Documents

Publication Publication Date Title
TW200916976A (en) Lithographic apparatus and device manufacturing method
CN100568103C (zh) 光刻装置和器件制造方法
TWI446482B (zh) 靜電鉗微影裝置及製造靜電鉗之方法
JP2007251156A (ja) リソグラフィ装置およびデバイス製造方法
CN101226341A (zh) 衬底支撑件和光刻工艺
KR100883610B1 (ko) 리소그래피 장치 및 리소그래피 장치용 정전기 클램프를제조하는 방법
US20100151394A1 (en) System for Contactless Cleaning, Lithographic Apparatus and Device Manufacturing Method
JP2005183973A (ja) リソグラフィ装置、及びデバイス製造方法
US9195150B2 (en) Lithographic apparatus comprising a support for holding an object, and a support for use therein
CN100476589C (zh) 用于给反射镜提供动态保护层的方法和设备
JP4564019B2 (ja) 酸化物の量を減らす方法および酸化物の量を減らすための調整システム
KR20100102682A (ko) 극자외 방사선 소스 및 극자외 방사선을 생성하는 방법
CN110832402A (zh) 清除方法、显露装置、光刻设备和器件制造方法
JP5220835B2 (ja) プラズマクリーニング処理への改良された適合性を有するオブジェクト
JP2006148126A (ja) リソグラフィ装置及びデバイス製造方法
US20150343461A1 (en) Deposition Method and Apparatus
CN114174928A (zh) 具有改进的污染物颗粒捕获的光刻设备和方法
EP1843205A1 (en) Local treatment device, lithographic apparatus and device manufacturing method
JP2005347749A (ja) リソグラフィ装置、デバイス製造方法、及びパターン形成装置形成方法
TW202307584A (zh) 微影裝置、基板台、及製造方法
CN120344913A (zh) 用于光刻设备的原位清洁
CN113614642A (zh) 显微操纵器装置和量测系统
WO2021001092A1 (en) Surface treatment apparatus and method for surface treatment of patterning devices and other substrates
JP2006013528A (ja) 基板上にマーカを生成する方法、リソグラフィ装置およびデバイス製造方法
JP2019529970A (ja) リソグラフィ装置及びサポート構造背景