TW200916976A - Lithographic apparatus and device manufacturing method - Google Patents

Lithographic apparatus and device manufacturing method Download PDF

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Publication number
TW200916976A
TW200916976A TW097128648A TW97128648A TW200916976A TW 200916976 A TW200916976 A TW 200916976A TW 097128648 A TW097128648 A TW 097128648A TW 97128648 A TW97128648 A TW 97128648A TW 200916976 A TW200916976 A TW 200916976A
Authority
TW
Taiwan
Prior art keywords
substrate
hydrogen
substrate holder
cleaning unit
outer casing
Prior art date
Application number
TW097128648A
Other languages
English (en)
Chinese (zh)
Inventor
Arno Jan Bleeker
Meer Aschwin Lodewijk Hendricus Johannes Van
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of TW200916976A publication Critical patent/TW200916976A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2045—Electron beam lithography processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning

Landscapes

  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Toxicology (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW097128648A 2007-07-30 2008-07-29 Lithographic apparatus and device manufacturing method TW200916976A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/882,081 US7894037B2 (en) 2007-07-30 2007-07-30 Lithographic apparatus and device manufacturing method

Publications (1)

Publication Number Publication Date
TW200916976A true TW200916976A (en) 2009-04-16

Family

ID=39885050

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097128648A TW200916976A (en) 2007-07-30 2008-07-29 Lithographic apparatus and device manufacturing method

Country Status (7)

Country Link
US (1) US7894037B2 (enExample)
JP (1) JP5188576B2 (enExample)
KR (1) KR20100053591A (enExample)
CN (2) CN103543614B (enExample)
NL (1) NL1035732A1 (enExample)
TW (1) TW200916976A (enExample)
WO (1) WO2009015838A1 (enExample)

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US10416092B2 (en) 2013-02-15 2019-09-17 Lam Research Corporation Remote detection of plating on wafer holding apparatus
TWI708870B (zh) * 2013-02-15 2020-11-01 美商蘭姆研究公司 晶圓夾持設備上之鍍層的偵測
US11542630B2 (en) 2012-03-30 2023-01-03 Novellus Systems, Inc. Cleaning electroplating substrate holders using reverse current deplating
TWI933892B (zh) 2021-03-30 2026-08-01 荷蘭商Ａｓｍｌ荷蘭公司 用於調節微影裝置之組件的裝置、及相關之方法及微影裝置

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NL1036618A1 (nl) * 2008-03-24 2009-09-25 Asml Netherlands Bv Encoder-type measurement system, lithograpic apparatus and method to detect an error on or in a grid or grating of an encoder-type measurement system.
KR20100126775A (ko) * 2008-04-03 2010-12-02 칼 짜이스 에스엠테 아게 세척 모듈 및 세척 모듈을 갖는 ｅｕｖ 리소그래피 장치
NL1036832A1 (nl) * 2008-04-15 2009-10-19 Asml Netherlands Bv Lithographic apparatus comprising an internal sensor and a mini-reactor, and method for treating a sensing surface of an internal sensor of a lithographic apparatus.
NL2005739A (en) * 2009-12-22 2011-06-23 Asml Netherlands Bv Object with an improved suitability for a plasma cleaning treatment.
DE102010044970A1 (de) * 2010-09-10 2011-12-22 Carl Zeiss Smt Gmbh Reinigungsmodul für Komponenten von Halbleiterlithographieanlagen und Halbleiterlithographieanlagen
JP5709546B2 (ja) * 2011-01-19 2015-04-30 キヤノン株式会社 エネルギービーム描画装置及びデバイス製造方法
JP5703841B2 (ja) * 2011-02-28 2015-04-22 凸版印刷株式会社 反射型マスク
US9221081B1 (en) 2011-08-01 2015-12-29 Novellus Systems, Inc. Automated cleaning of wafer plating assembly
US10066311B2 (en) 2011-08-15 2018-09-04 Lam Research Corporation Multi-contact lipseals and associated electroplating methods
US9988734B2 (en) 2011-08-15 2018-06-05 Lam Research Corporation Lipseals and contact elements for semiconductor electroplating apparatuses
US9228270B2 (en) 2011-08-15 2016-01-05 Novellus Systems, Inc. Lipseals and contact elements for semiconductor electroplating apparatuses
SG10201608038VA (en) 2012-03-28 2016-11-29 Novellus Systems Inc Methods and apparatuses for cleaning electroplating substrate holders
US8901523B1 (en) * 2013-09-04 2014-12-02 Asml Netherlands B.V. Apparatus for protecting EUV optical elements
US9539622B2 (en) * 2014-03-18 2017-01-10 Asml Netherlands B.V. Apparatus for and method of active cleaning of EUV optic with RF plasma field
WO2015154917A1 (en) * 2014-04-09 2015-10-15 Asml Netherlands B.V. Apparatus for cleaning an object
CN104226637B (zh) * 2014-07-18 2016-06-01 中国科学院长春光学精密机械与物理研究所 用于清洗受污染光学元件的氢原子收集装置与清洗方法
US10053793B2 (en) 2015-07-09 2018-08-21 Lam Research Corporation Integrated elastomeric lipseal and cup bottom for reducing wafer sticking
US9888554B2 (en) * 2016-01-21 2018-02-06 Asml Netherlands B.V. System, method and apparatus for target material debris cleaning of EUV vessel and EUV collector
JP6695750B2 (ja) * 2016-07-04 2020-05-20 株式会社荏原製作所 基板ホルダの検査装置、これを備えためっき装置、及び外観検査装置
CN110709776B (zh) * 2017-06-01 2022-11-18 Asml荷兰有限公司 颗粒去除设备及相关系统
WO2019006009A1 (en) * 2017-06-29 2019-01-03 Lam Research Corporation REMOTE DETECTION OF VENEER ON WAFER SUPPORT APPARATUS
EP3447581A1 (en) * 2017-08-23 2019-02-27 ASML Netherlands B.V. A clear-out tool, a lithographic apparatus and a device manufacturing method
NL2021755A (en) * 2017-10-27 2019-05-06 Asml Holding Nv Burls with altered surface topography for lithography applications
US11448955B2 (en) 2018-09-27 2022-09-20 Taiwan Semiconductor Manufacturing Co., Ltd. Mask for lithography process and method for manufacturing the same
US11360384B2 (en) * 2018-09-28 2022-06-14 Taiwan Semiconductor Manufacturing Co., Ltd. Method of fabricating and servicing a photomask
CN112955822B (zh) * 2018-11-09 2024-10-11 Asml控股股份有限公司 利用具有可控几何形状和组成的清洁衬底进行刻蚀支撑件清洁
DE102018221191A1 (de) * 2018-12-07 2020-06-10 Carl Zeiss Smt Gmbh Optisches Element zur Reflexion von VUV-Strahlung und optische Anordnung
TWI897405B (zh) 2019-03-25 2025-09-11 日商亞多納富有限公司 半導體製造系統、其控制方法及控制該系統的電腦程式
CN110161808B (zh) * 2019-05-09 2022-02-22 上海华力微电子有限公司 光栅尺清洁装置和方法、光刻机
US11638938B2 (en) 2019-06-10 2023-05-02 Kla Corporation In situ process chamber chuck cleaning by cleaning substrate
JP7401396B2 (ja) * 2020-06-04 2023-12-19 キヤノン株式会社 インプリント装置、物品の製造方法、及びインプリント装置のための測定方法
CN112139151A (zh) * 2020-09-11 2020-12-29 韩山师范学院 一种大型设备表面清理装置
US11392041B2 (en) * 2020-09-28 2022-07-19 Taiwan Semiconductor Manufacturing Company, Ltd. Particle removal device and method
CN114690570B (zh) * 2020-12-29 2025-04-25 上海微电子装备（集团）股份有限公司 光刻机、运动台定位测量系统及其工作方法
EP4068000A1 (en) * 2021-03-30 2022-10-05 ASML Netherlands B.V. Conditioning apparatus and method
CN114200778A (zh) * 2021-06-25 2022-03-18 四川大学 一种极紫外光刻机lpp光源收集镜的等离子体原位清洗结构
US11520246B1 (en) * 2021-08-30 2022-12-06 Taiwan Semiconductor Manufacturing Company, Ltd. Highly efficient automatic particle cleaner method for EUV systems
CN114454071A (zh) * 2022-02-21 2022-05-10 上海华力微电子有限公司 承载台清洁装置及光刻系统
KR102864171B1 (ko) * 2023-06-16 2025-09-24 한국표준과학연구원 Euv 광원에 의한 광학부품 오염 방지 장치 및 그 방법

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11542630B2 (en) 2012-03-30 2023-01-03 Novellus Systems, Inc. Cleaning electroplating substrate holders using reverse current deplating
US10416092B2 (en) 2013-02-15 2019-09-17 Lam Research Corporation Remote detection of plating on wafer holding apparatus
TWI708870B (zh) * 2013-02-15 2020-11-01 美商蘭姆研究公司 晶圓夾持設備上之鍍層的偵測
TWI933892B (zh) 2021-03-30 2026-08-01 荷蘭商Ａｓｍｌ荷蘭公司 用於調節微影裝置之組件的裝置、及相關之方法及微影裝置

Also Published As

Publication number Publication date
KR20100053591A (ko) 2010-05-20
NL1035732A1 (nl) 2009-02-02
CN103543614B (zh) 2016-03-09
US20090033889A1 (en) 2009-02-05
WO2009015838A1 (en) 2009-02-05
CN101765811A (zh) 2010-06-30
US7894037B2 (en) 2011-02-22
JP2010534946A (ja) 2010-11-11
CN101765811B (zh) 2013-11-20
JP5188576B2 (ja) 2013-04-24
CN103543614A (zh) 2014-01-29

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