KR20100053591A - 리소그래피 장치 및 디바이스 제조 방법 - Google Patents

리소그래피 장치 및 디바이스 제조 방법 Download PDF

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Publication number
KR20100053591A
KR20100053591A KR1020107004512A KR20107004512A KR20100053591A KR 20100053591 A KR20100053591 A KR 20100053591A KR 1020107004512 A KR1020107004512 A KR 1020107004512A KR 20107004512 A KR20107004512 A KR 20107004512A KR 20100053591 A KR20100053591 A KR 20100053591A
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KR
South Korea
Prior art keywords
substrate
substrate holder
housing
radicals
support surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020107004512A
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English (en)
Korean (ko)
Inventor
아르노 얀 블리커
아스빈 로데비크 헨드리쿠스 요한네스 반 미르
Original Assignee
에이에스엠엘 네델란즈 비.브이.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 에이에스엠엘 네델란즈 비.브이. filed Critical 에이에스엠엘 네델란즈 비.브이.
Publication of KR20100053591A publication Critical patent/KR20100053591A/ko
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2045—Electron beam lithography processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning

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  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Toxicology (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020107004512A 2007-07-30 2008-07-25 리소그래피 장치 및 디바이스 제조 방법 Withdrawn KR20100053591A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/882,081 2007-07-30
US11/882,081 US7894037B2 (en) 2007-07-30 2007-07-30 Lithographic apparatus and device manufacturing method

Publications (1)

Publication Number Publication Date
KR20100053591A true KR20100053591A (ko) 2010-05-20

Family

ID=39885050

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107004512A Withdrawn KR20100053591A (ko) 2007-07-30 2008-07-25 리소그래피 장치 및 디바이스 제조 방법

Country Status (7)

Country Link
US (1) US7894037B2 (enExample)
JP (1) JP5188576B2 (enExample)
KR (1) KR20100053591A (enExample)
CN (2) CN103543614B (enExample)
NL (1) NL1035732A1 (enExample)
TW (1) TW200916976A (enExample)
WO (1) WO2009015838A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190025011A (ko) * 2016-07-04 2019-03-08 가부시키가이샤 에바라 세이사꾸쇼 기판 홀더 검사 장치, 이를 구비한 도금 장치, 및 외관 검사 장치
KR20240176506A (ko) * 2023-06-16 2024-12-24 한국항공대학교산학협력단 Euv 광원에 의한 광학부품 오염 방지 장치 및 그 방법

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NL1036618A1 (nl) * 2008-03-24 2009-09-25 Asml Netherlands Bv Encoder-type measurement system, lithograpic apparatus and method to detect an error on or in a grid or grating of an encoder-type measurement system.
KR20100126775A (ko) * 2008-04-03 2010-12-02 칼 짜이스 에스엠테 아게 세척 모듈 및 세척 모듈을 갖는 euv 리소그래피 장치
NL1036832A1 (nl) * 2008-04-15 2009-10-19 Asml Netherlands Bv Lithographic apparatus comprising an internal sensor and a mini-reactor, and method for treating a sensing surface of an internal sensor of a lithographic apparatus.
NL2005739A (en) * 2009-12-22 2011-06-23 Asml Netherlands Bv Object with an improved suitability for a plasma cleaning treatment.
DE102010044970A1 (de) * 2010-09-10 2011-12-22 Carl Zeiss Smt Gmbh Reinigungsmodul für Komponenten von Halbleiterlithographieanlagen und Halbleiterlithographieanlagen
JP5709546B2 (ja) * 2011-01-19 2015-04-30 キヤノン株式会社 エネルギービーム描画装置及びデバイス製造方法
JP5703841B2 (ja) * 2011-02-28 2015-04-22 凸版印刷株式会社 反射型マスク
US9221081B1 (en) 2011-08-01 2015-12-29 Novellus Systems, Inc. Automated cleaning of wafer plating assembly
US10066311B2 (en) 2011-08-15 2018-09-04 Lam Research Corporation Multi-contact lipseals and associated electroplating methods
US9988734B2 (en) 2011-08-15 2018-06-05 Lam Research Corporation Lipseals and contact elements for semiconductor electroplating apparatuses
US9228270B2 (en) 2011-08-15 2016-01-05 Novellus Systems, Inc. Lipseals and contact elements for semiconductor electroplating apparatuses
SG10201608038VA (en) 2012-03-28 2016-11-29 Novellus Systems Inc Methods and apparatuses for cleaning electroplating substrate holders
KR102092416B1 (ko) 2012-03-30 2020-03-24 노벨러스 시스템즈, 인코포레이티드 역전류 디플레이팅을 이용한 전기도금 기판 홀더의 클리닝
US10416092B2 (en) 2013-02-15 2019-09-17 Lam Research Corporation Remote detection of plating on wafer holding apparatus
US9746427B2 (en) * 2013-02-15 2017-08-29 Novellus Systems, Inc. Detection of plating on wafer holding apparatus
US8901523B1 (en) * 2013-09-04 2014-12-02 Asml Netherlands B.V. Apparatus for protecting EUV optical elements
US9539622B2 (en) * 2014-03-18 2017-01-10 Asml Netherlands B.V. Apparatus for and method of active cleaning of EUV optic with RF plasma field
WO2015154917A1 (en) * 2014-04-09 2015-10-15 Asml Netherlands B.V. Apparatus for cleaning an object
CN104226637B (zh) * 2014-07-18 2016-06-01 中国科学院长春光学精密机械与物理研究所 用于清洗受污染光学元件的氢原子收集装置与清洗方法
US10053793B2 (en) 2015-07-09 2018-08-21 Lam Research Corporation Integrated elastomeric lipseal and cup bottom for reducing wafer sticking
US9888554B2 (en) * 2016-01-21 2018-02-06 Asml Netherlands B.V. System, method and apparatus for target material debris cleaning of EUV vessel and EUV collector
CN110709776B (zh) * 2017-06-01 2022-11-18 Asml荷兰有限公司 颗粒去除设备及相关系统
WO2019006009A1 (en) * 2017-06-29 2019-01-03 Lam Research Corporation REMOTE DETECTION OF VENEER ON WAFER SUPPORT APPARATUS
EP3447581A1 (en) * 2017-08-23 2019-02-27 ASML Netherlands B.V. A clear-out tool, a lithographic apparatus and a device manufacturing method
NL2021755A (en) * 2017-10-27 2019-05-06 Asml Holding Nv Burls with altered surface topography for lithography applications
US11448955B2 (en) 2018-09-27 2022-09-20 Taiwan Semiconductor Manufacturing Co., Ltd. Mask for lithography process and method for manufacturing the same
US11360384B2 (en) * 2018-09-28 2022-06-14 Taiwan Semiconductor Manufacturing Co., Ltd. Method of fabricating and servicing a photomask
CN112955822B (zh) * 2018-11-09 2024-10-11 Asml控股股份有限公司 利用具有可控几何形状和组成的清洁衬底进行刻蚀支撑件清洁
DE102018221191A1 (de) * 2018-12-07 2020-06-10 Carl Zeiss Smt Gmbh Optisches Element zur Reflexion von VUV-Strahlung und optische Anordnung
TWI897405B (zh) 2019-03-25 2025-09-11 日商亞多納富有限公司 半導體製造系統、其控制方法及控制該系統的電腦程式
CN110161808B (zh) * 2019-05-09 2022-02-22 上海华力微电子有限公司 光栅尺清洁装置和方法、光刻机
US11638938B2 (en) 2019-06-10 2023-05-02 Kla Corporation In situ process chamber chuck cleaning by cleaning substrate
JP7401396B2 (ja) * 2020-06-04 2023-12-19 キヤノン株式会社 インプリント装置、物品の製造方法、及びインプリント装置のための測定方法
CN112139151A (zh) * 2020-09-11 2020-12-29 韩山师范学院 一种大型设备表面清理装置
US11392041B2 (en) * 2020-09-28 2022-07-19 Taiwan Semiconductor Manufacturing Company, Ltd. Particle removal device and method
CN114690570B (zh) * 2020-12-29 2025-04-25 上海微电子装备(集团)股份有限公司 光刻机、运动台定位测量系统及其工作方法
EP4068000A1 (en) * 2021-03-30 2022-10-05 ASML Netherlands B.V. Conditioning apparatus and method
CN114200778A (zh) * 2021-06-25 2022-03-18 四川大学 一种极紫外光刻机lpp光源收集镜的等离子体原位清洗结构
US11520246B1 (en) * 2021-08-30 2022-12-06 Taiwan Semiconductor Manufacturing Company, Ltd. Highly efficient automatic particle cleaner method for EUV systems
CN114454071A (zh) * 2022-02-21 2022-05-10 上海华力微电子有限公司 承载台清洁装置及光刻系统

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190025011A (ko) * 2016-07-04 2019-03-08 가부시키가이샤 에바라 세이사꾸쇼 기판 홀더 검사 장치, 이를 구비한 도금 장치, 및 외관 검사 장치
KR20240176506A (ko) * 2023-06-16 2024-12-24 한국항공대학교산학협력단 Euv 광원에 의한 광학부품 오염 방지 장치 및 그 방법

Also Published As

Publication number Publication date
NL1035732A1 (nl) 2009-02-02
CN103543614B (zh) 2016-03-09
TW200916976A (en) 2009-04-16
US20090033889A1 (en) 2009-02-05
WO2009015838A1 (en) 2009-02-05
CN101765811A (zh) 2010-06-30
US7894037B2 (en) 2011-02-22
JP2010534946A (ja) 2010-11-11
CN101765811B (zh) 2013-11-20
JP5188576B2 (ja) 2013-04-24
CN103543614A (zh) 2014-01-29

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