TW200820360A - Method for mounting electronic component on substrate and method for forming solder surface - Google Patents

Method for mounting electronic component on substrate and method for forming solder surface Download PDF

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Publication number
TW200820360A
TW200820360A TW096140205A TW96140205A TW200820360A TW 200820360 A TW200820360 A TW 200820360A TW 096140205 A TW096140205 A TW 096140205A TW 96140205 A TW96140205 A TW 96140205A TW 200820360 A TW200820360 A TW 200820360A
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TW
Taiwan
Prior art keywords
tin
gold
substrate
soldering
electronic component
Prior art date
Application number
TW096140205A
Other languages
English (en)
Inventor
Kei Murayama
Original Assignee
Shinko Electric Ind Co
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Filing date
Publication date
Application filed by Shinko Electric Ind Co filed Critical Shinko Electric Ind Co
Publication of TW200820360A publication Critical patent/TW200820360A/zh

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Description

200820360 九、發明說明： 【發明所屬之技術領域】 4=係有關於一種用以藉由焊接以在-基板上形成 之結構’以及更特別地’是有關於一種用以藉由 孟''錫共熔合金表面以在一基板上安裝電子零件之 :二發明亦有關於-種用以形成一適用以做為二上面 ^女衣二子零件之類的表面之焊接表面的方法。本發明可 上所敘述之電子零件’其中藉由焊接在-基板 【先例如：彻層、LED、光學零件等。 至今已使用含主要成分鉛或錫之焊料做為—用一 子零件之連接材料。亦❹-無錯焊料合 孟傳、，先上，虽猎由使用無鉛焊料將電子零件 板上時，以金（Au)或錫（s) 基 在另-情況中，至今已使用基 電極區域。 已使用一由金_錫合金 (solder pellet)。 衣攻之谇粒 圖1顯示藉由焊接將電子零件 之示範相關技藝技術；亦即，名„ . I扳上 t^Csubstrate stage e ΪΓ〇<^)上安裝—半導體曰ti 之情況。在圖1中’元件符號1表示-具有-二之^ 矩形矽基板。該基板呈現使該只貝 2及沿著該凹洞區域之邊缘描徂W中:成為—凹洞區域 凹洞區域2之中心部；出物的形狀。該 區域中由銅形成-分段電極片安裝區域3。在此 冤極4。在該凹洞區域2中之半導 312XP/發明說明書(補件)/96-12/96140205 6 200820360 體晶片安裝部3周圍以一不百目一 ^ r , β ^ χ 預疋間隔形成複數個#由接人 線(未顯示)之類連接至 猶由接- 兮莖合山+ & > μ 士 卞今篮日日片5的端電極6。 該寻極之後表面係形成做為外部連接端。 為了在此一具有一凹洞之矽基板】上安 5’至今依據下列方式實施安纟。 电子夺件 在圖1A _，使該矽基板經歷 刻該如此處理過之美杯㈣ 的處理，以及蝕 处里過之基板，以致於在該基板之令心 一凹處之凹洞2的形业 杜、m / 兄，、有 的形狀。使洞經歷貫穿孔電鍍之類，因而 在该洞孔2之中心并；#八讲兩上 、而 奴加山 /成刀奴龟極4及在該電極周圍形成趨 數個h電極6。因為与r石々萁此σ曰 、+ t 為孩矽基板壬現一凹洞之形狀，所以盔 奸好地平滑化該凹處之㈣表面。如以誇大奸 述，該分段電極4之表面及該等 田 則形狀。 心衣面主現不規 之：:：：2段電極4的表面及位於該分段電極周圍 之知电極6的表面分別以金（Au)鍍層7塗佈。因此， • (ΑιΟ鍍層7塗佈該分段電極4之表面及該等端電極6之表 為了加強在該半導體晶片5與該分段電極4間之黏著 及在該等端電極6與接合線（未顯示）間之連接。 雜1Β中’將—金-錫焊粒8附加至塗佈有該金（Au) :运之分段電極4。此金-錫焊粒8意欲提高在該所要 安裝之半導體晶片5與該分段電極4間之連接。 在圖1C中，藉由該金-錫焊粒8在該矽基板丨之分段電 極4上安裝該半導體晶片5。藉由回流處理或藉由該半導 體晶片5與該電極4之同時加熱實施此半導體晶片5之安 312XP/發明麵書(補件)/96-12/96140205 η 200820360 裝。 隨後，藉由接合線（未顯示）將在該矽基板丨上 半導體晶片5的電極與該等端電極6連接在一起。之 在JP-A-2_-35310(專利文件υ中描述1於本㈣ •之相關技藝技術。此相關技藝技術意欲 : .金，其中甚至當使用具有相對高炼點之無錯㈣ 在-基板上安裝電子零件之焊料時，該無料料合 叉回流處理所造成之不利影響，以及在晶粒接合操 好使用該無錯焊料合金，以便接合該等電子零件之 該無錯焊料含10至24. 9質量百分比的銅、5或更大 3分比的銻及由錫所製成之殘餘物。該錫含量超過J : 量百分比。專利文件亦揭露使該焊料包含一預定量之^ 由銀、金及！巴所組成之群與銅的一種元素或更多種 以及碲加入該焊料及磷或鍺之加入亦是更好的。’、 [專利文件 HJP-A-2006 —3531〇 ^ 如同在圖1所示之相關技藝技術的情況中，關於在一且 有一凹洞之矽基板中的一凹洞的 ^ 一像研磨治具之類的工且。者在且遇很難插控 極上或在一具有端電極之基板分段電極上 :::面：：(广導體晶片)時，遭遇很難平滑化該分段電 二=寻：電極之表面。因此，該等表面之平滑化 在該等安裳電子零件與該分段電極 間务生不良黏者之問題。解決這些問題亦會產生需要昂貴 手段以平滑化一半導體晶片安裝表面的另-問題，例如、： 3UXP/^mmmmm/96-n/96i4〇2〇5 8 200820360 ^電鍍該分段電極或該f端電極或者將 於該分段電極。 场年粒用 二 =前述相闕技藝技術(專利文件”中所揭露之 ；：* 4合金，如时具有1狀前料基板之情、兄 中’在一具有报羞金承、、典π ·ν Φ 月况 著安裝電子零件、。1 的基板上無法以較好的黏 本發明所遭遇的挑戰係要提供—種焊接表面 該方法可適當地被提供於在—基板之烊 上 女^子零件的情況中，以及該方法能便宜地形成一由 -錫共熔合金所形成之平滑焊接表面。 - 此外，本發明所遭遇的挑戰係要提供—種電子 :基二之方法，該方法能藉由平滑化分段電極之‘面以ς =文裝電子零件’其中該等電子零件係要 等分段電極。 文衣主4 【發明内容】
樣，提供一種 以形成一^金- 為了解決該等問題，依據本發明之第一態 焊接表面之形成方法，包括下列步驟： 形成一金凸塊於一基板之一電極的表面上 放置一錫基焊片於該金凸塊上，· 使該錫基焊片與該金凸塊經歷回流焊接， 錫共熔合金；以及 平滑化該共熔合金。 極的表面上已形成 形成一金-錫共熔 因此，依據本發明，在一基板之一電 一金凸塊後，由該金凸塊及一錫基焊片 312ΧΡ/發明說明書(補件)/96-12/96140205 9 200820360 ::面因為該合金被平滑化’所以可便宜地形成—平滑禪 200820360 依據本發明之第 其中 樣’提供該焊接表面之形成方法， ^基板上之複數個電極的個別表面上 數個金凸塊； ^ 4设 放置—錫基焊片，以便分別與該複數個金凸塊接觸；以 使該錫基焊片及該複數個金凸塊經歷回流烊接，以 一金-錫共熔合金。 ’ ^ =此情況中，在該複數個金凸塊與該單錫基焊片間 大里金-錫共料金。因此，將該金_錫共熔合金接合至該 專個別電極表面。再者，因為平滑化該聽合金，所以 便宜地形成一平滑焊接表面。 再者，依據本發明之第三態樣，提供—種焊接表面之形 成方法，包括下列步驟·· 形成一金凸塊於一基板之一電極的表面上； 施加複數個錫基焊球至該等金凸塊； 以形成一 使该專錫基烊球與該等金凸塊經歷回流焊接 金-錫共熔合金；以及 平滑化該共熔合金。 在此情況中’纟一基板之一電極的表面±已形成一全凸 塊後，由該金凸塊及一錫基焊片形成一金—錫共熔合金。 因為該合金被平滑化，所以可便宜地形成一平滑焊接表 312XP/發明說明書(補件)/9642/96140205 10 200820360 面0 依據本發明之第四態樣，提供該蟬接表面之形成方法， 其中 在該基板上之複數個電極的個別表面上形成一個或複 數個金凸塊；以及 、藉由使肖具有複數個尺寸能使該等個別錫基焊球通 過之細孔的佈置罩幕（plaeementmask)，將該等錫基焊球 經由該佈置罩幕之細孔施加至—形成該複數個金凸塊之 區域。 依據本發明之第五態樣，提供該蟬接表 其中 面之形成方法 ， 藉由一接合機形成該等金凸塊。 在此情況中…在普通打線操作中所使用之打線機可用 以做為該接合機。結果，可容易地且便宜地形成金凸塊。 依據本發明之第六態樣，提供一種電子零件安裝於基板 鲁之方法，包括下列步驟： 形成一金凸塊於一基板之一電極的表面上 放置一錫基焊片於該金凸塊上； 使該錫基焊片 錫共溶合金； 與該金凸塊經歷回流焊接，以形成一金一 平滑化該共溶合金；以及 接合一電子零件於該平滑共熔合金之表面上。 在此情況中’在一基板之一電極的表面上已形成一金凸 塊後，由該金凸塊及-錫基焊片形成—金—錫共溶合金。 312XP/發明說明書(補件)/96_12/9614〇2()5 11 200820360 在已平滑化該共熔合金後，在該平滑表面上安裝該電子零 件，以及因此，可使在該等電極表面與該電子零件間之黏 著較好。 依據本發明之第七態樣，提供該電子零件安裝於基板之 - 方法，其中 - 由複數個電極之表面形成一用以安裝一電子零件之分 段電極， 在該等個別電極表面上形成一個或複數個金凸塊； 放置一錫基焊片，以便分別與該複數個金凸塊接觸；以 及 使該錫基焊片與該複數個金凸塊經歷回流焊接，以形成 一金-錫共溶合金。 在此情況中，在該複數個金凸塊與該單錫基焊片間形成 大量金-錫共熔合金。 將該金-錫共熔合金接合至該等個別電極表面，以及平 ⑩滑化該共熔合金。因此，可便宜地形成一平滑焊接表面。 再者，依據本發明之第八態樣，提供一種電子零件安裝 _ 於基板之方法，包括下列步驟： • 形成一金凸塊於一基板之一電極的表面上； 施加複數個錫基焊球至該等金凸塊； 使該等錫基焊球與該等金凸塊經歷回流焊接，以形成一 金-錫共熔合金； 平滑化該共熔合金；以及 接合一電子零件至該平滑共熔合金之表面。 312XP/發明說明書(補件)/96-12/96140205 12 200820360 在本發明中，在一基板之一電極的表面上已形成一金凸 塊後，由該金凸塊及一鍚基焊片形成一金-錫共溶合金。 在已平滑化該共熔合金後，在該平滑表面上安裝該電子零 件，以及因此，可使該等電極表面與該電子零件間之黏著 較好。 再者，依據本發明之第九態樣，提供該電子零件安裝於 基板之方法，其中 由複數個電極之表面形成一用以安裝一電子零件之分 段電極； 在該等個別電極表面上形成一個或複數個金凸塊；以及 藉由使用一具有複數個尺寸能使該等個別錫基焊球通 過之細孔的佈置罩幕，將該等錫基焊球經由該佈置罩幕之 細孔施加至一形成該複數個金凸塊之區域。 依據本發明之第十態樣，提供該電子零件安裝於基板之 方法，其中 該基板係一具有一凹洞之矽基板，其中該基板之周圍部 分係形成為一框架（f rame)及其中在一中心凹處形成該電 極表面； 在該凹處内之中心形成該用以安裝一電子零件之分段 電極； 在該凹處内之分段電極周圍形成複數個電極；以及 在接合該電子零件至該共熔合金之表面上後，使該電子 零件及該複數個端電極經歷打線接合。 結果，如同在一具有一凹洞之矽基板的情況，甚至當在 312XP/發明說明書(補件)/96-12/96140205 13 200820360 很難使表面平滑化之電極上安裝—電子零件時，可藉由一 =法確保電極表面之平滑化，以及可使該等 與該電子零件間之黏著較好。 胃 【實施方式】 以下將芩考所附圖式以描述本發明之一具體例。 圖2及3係以製程順序描述一用以依據本發明之一具體 例安裝電子零件之方法的圖式。圖2A_2F顯 前: φ部，以及圖3A-3E顯示製程之後半部。 則+ 在圖2A中，一預定厚度之矽晶圓1〇係用以形成—具有 =凹洞之基板。在圖2B中，在該矽晶圓1〇上施加第二次 f阻12 ’以及圖案化該如此施加之光阻。藉纟此圖案化 操作’在該光阻上之要在下一製程中經歷鑽孔之區域切 成，:12a及12b。這些開口 12a及12b對應於要形成用 以安裝電子零件之分段電極的數個區域（l2a)及要形成經 歷打線接合之端電極的複數個區域（〗2b)。 _在圖2G中，實施第—:欠鑽孔。較佳储由乾式钱刻或 濕式蝕刻實施鑽孔操作。需要時，以使所產生之外形變成 錐形的方式實施用以調整鑽孔操作之起始點及結束點的 '非等向性蝕刻。因此，產生對應於該光阻12之開口 及12b的孔14及16。位於中心之複數個孔14對應於分 段電極所要形成之區域，以及位於周圍區域之複數個孔 16對應於端電極所要形成之區域。 在圖2D中’在該矽晶圓1〇上方施加第二次光阻12， 以及圖案化該如此施加之光阻。藉由此圖案化操作，在該 312XP/發明說明書(補件)/96-12/96140205 14 200820360 光阻上之要在下-製程中產生該基板之—凹洞的區域中 形成開Π 12c。該等開ϋ 12c包括在前述製程中已鑽孔之 區域’其中在該等區域中要形成該等分段電極及該等端電 極。再者，該等開口 12c對應於一在該基板之外周圍區域 或一屏障之内部區域周圍所留下之矩形框架。 在，2E中’實施用以產生—凹洞之第二次鑽孔操作。 =第-次鑽孔操作之情況，藉由乾式钱刻或濕式钱刻實 ，：e弟二次鑽孔操作。因而，在該基板之中心形成一凹洞 在該凹洞18之内部區域的中心中保留用以形成分段 =極=複數個孔14。在周圍區域中保留用以形成端電極 數個孔16。該凹洞18之内部係例如每邊約U随之 形’以及該基板之外部係例如每邊約2. 5龍之方形。 在移除殘留光阻後’在該矽基板10之表面 >、一乳化膜’以及在位於該凹洞18内之個別孔 二=貫穿電陶段電極)及22。這些貫穿電極 成刀又电極A 22可猎由貫穿孔電解電鐘之類 心之複數個貫穿電極2◦相當於在電子零= 數個貫二分段電極’以及位於周圍區域之複 極。 田於要猎由打線接合來連接之端電 上形：入α中、在°亥中心區域中之複數個個別分段電極2〇 合之接人彳ir夹π - h十等凸塊24可猎由一用於打線接 接口枝（未絲頁不）來形成。特別地，在一金㈤ 3l2m^mm(mm/96^2/96140205 5機之末端輸出及與該分段電極2G接觸後，該接合； 15 200820360 立即與該分段電極2。分離，因而切斷該金屬線。 如所述，與該分段電極 邻m❿』保持接觸之釘狀金凸塊24的底 =成政起，以及該金凸塊24之上端變失。該金凸塊2_ 電極2〇上。 （未顯不)之安裝區域内的所有分段 中，亦可以對—位於該中心之分段電極 成稷數個金凸塊24。在另一悴巧由 + 分^朽9n、，在另丨月况中，亦可以對該複數個 奴书極20刀別形成一個或複數個金凸塊24。 在圖3B中’在—電子零件安裝區域上放置一尺 該分段電極20之雷早雯氹史壯π❹, ，件女衣區域（例如：每邊約1· 〇mm ^方形）之板狀錫基焊片26。使用—桿基焊粒以 片26成為板狀。亦可以使用—錫_金基焊片、—錫—職 知片或一錫-銀-銅基焊片以取代該錫基焊片26。 土 在圖3C中’藉由一加熱爐實施回流痒接。結果，在該 %，令件安裝區域上形成一錫_金基焊料共溶合纟28，其 中該錫-金基焊料料合金28包括該錫基焊片26及該等 釘狀金凸塊24。 ' 在圖3D中，平滑化該共熔合金28之層。在平滑化操作 期間’通常藉由使用一具有一平滑表面之治具(未顯示） 以壓印方式在200至250°C之溫度下從上方打盧該共溶合 金28，藉此平滑化該共熔合金28之上表面。 在圖3E中，在该共熔合金28之上表面上安裝該電子零 件30，以及藉由接合線32使在該電子零件go之上表面 上的電極及在該矽基板上之端電極22電性連接在一起。 312XP/發明說明書(補件)/96-12/96140205 16 200820360 在本發明之具體例中，像上述方法，一用於該等金凸塊 24之形成的金線使用99·99(4Ν)至99·9999%(6Ν)成分的 金。一用於此情況中之錫基焊接材料係例如Sn3. 5Ag(96. 5 質量百分比之錫（Sn)及3.5質量百分比之銀（Ag))、 ， Sn3.0Ag0.5Cu(96.5質量百分比之錫（Sn)、3.0質量百分 ， 比之銀（Ag)及0 · 5質量百分比之銅（Cu))、Sn9Zn (91 · 0質 量百分比之錫及 9.0 質量百分比之鋅（Zn))、 Sn8ZnlBi(91.0質量百分比之鍚、8.0質量百分比之鋅（Zn) •及1.0質量百分比之鉍(Bi))等。 例如：當例如使用80mg之金線時，採用20. 73mg之 Sn3.5Ag。在此時，金對錫之比率接近一具有約80 : 20之 比率的共溶成分。此外，例如：當使用8 Omg之金線時， 採用20.73mg之Sn3.0Ag0.5Cu。金對錫之比率接近一具 有約80 : 20之比率的共熔成分。 如以上所述，調整金對錫之比率，以便在3 0質量百分 φ 比至90質量百分比之範圍内。 圖4顯示只使用該錫-金基焊片26之範例。特別地，如 • 圖4A所示，在圖2A-2F所示之製程後，在該分段電極20 - 之電子零件安裝區域上安裝該矩形錫-金基焊片26。在圖 4B中，藉由回流焊接以熔合方式將該焊片接合至該分段 電極20。此外，在圖4C中，藉由壓印之類平滑化該焊片 26之表面，以及在該焊片26上安裝該電子零件30。藉由 接合線32將在該電子零件30之上表面上的電極電性連接 至該矽基板10之端電極22。 312XP/發明說明書(補件)/96-12/96140205 17 200820360 圖5顯示將該雷早费生 々件3〇直接安裝至該分段電極20而 示之製程後的製程中在t Γ中’在圖2A—找所 焊料&塊34。在另4=數個分段電極2°上安裝該等 的下表面之對應於該分段電極的位 板段電極上已安裝該電子零件後，使該基 板、、工[口桃知接，藉此葬 9n b猎由邊荨凸塊34使該電子零件3〇 14 4刀#又電極20附著在一起。 圖δ顯示使用焊球以 之另一且邮Mn、 戈®3所不之具體例所述的焊片 之另具脰例。僅說明本具體例盥9 a Q & 一 間之不同處。 过、圖2及3所不之具體例 圖6Α所示之製程相同 考 J於圖3Α所不之製程及顯示在中心 處=數心段電極2G上形成該等金（Au)凸塊& ;6B及6C中’藉由使用一具有複數個細孔之佈置
幕40 ’從上方經由該佈置罩幕利之細孔將錫基焊球U :加=在該分段電㈣2G之電子零件安裝區域（形成有複 之凸二之區，’亦即，一對應於該電子零件安裝區域 =如:母邊約一形)的區域之全部)的金 在一罩幕板上方提供複數個該佈線罩幕4G之細孔；亦 即’一對應於形成複數個金凸塊之區域的全部。每一孔之 直=次能使-焊球42通過。以使該等焊球42所要形成 m與金凸塊所要形成之區域一致的方式，將該佈置罩 疋位地放置在該矽基板10周圍之框架上。在該佈置 312XP/發明說明書(補件)/96-12/96140205 18 200820360 罩幕40之上表面上填入複數個焊球42，以便完全達到一 預定數量之焊球。該等個別焊球42向下掉落以穿過該佈 置罩幕40之複數個細孔。在該矽基板10上之形成金凸塊 的全部區域上方已施加該等焊球42後，移除該佈置罩幕 _ 40，以及進行下一製程。 ， 在圖6D中，藉由該加熱爐實施回流焊接。結果，在該 電子零件安裝區域上形成一錫-金基焊料共熔合金44，其 中該錫-金基焊料共熔合金44包括該等焊球42及該等釘 狀金凸塊24。在此情況中，因為在遭遇回流焊接前已將 該等釘狀金凸塊24固定至該分段電極20，所以當由該等 焊球42及該等釘狀金凸塊24形成該焊料共熔合金44 時，該共熔合金不會偏離一預定位置。 在圖6E中，以相同於圖3D所示之製程的方式平滑化該 共熔合金44之層。在平滑化操作期間，通常藉由使用一 具有一平滑表面之治具（未顯示）以壓印方式在200至 ⑩ 250°C之溫度下從上方打壓該共熔合金44，藉此平滑化該 共熔合金44之上表面。 ~ 在圖6F中，如同圖3E所示之製程的情況，在該共熔金 - 合44之上表面上安裝該電子零件30，以及藉由接合線32 使在該電子零件3 0之上表面的電極與在該石夕基板上之端 電極22電性連接在一起。 雖然已參考所附圖式來描述本發明之具體例，但是本發 明並非侷限於上述具體例，而是在本發明之精神及範圍内 可容許各種模式、變更及修改。 312XP/發明說明書(補件)/96-12/96140205 19 200820360 如以上所述’依據本發明’可便宜地形成—平 面，其中該平滑焊接表面可適用於在—基板之:表 =裝電子零件之情況及該平料接表面由_金:錫= &金所形成。當安裝該電子零件時，—要接合 〇 平坦的二3在該電子零件與電極間之黏著變得I好面係 【圖式簡單說明】 圖mu;顯示用以在―⑪基板上安裝 關技藝方法； 书卞γ件之相 圖2A至2F顯示本發明之—用以在矽 + 件之方法的前半部製程； 女衣包子零 圖3AU請*本發明之該心切基板上 件之方法的隨後製程； 千令 圖4A至4D顯不一用以葬由祐田 人 焊接表面之方法；切由使用-金-錫焊片以形成- 圖5顯示一用以藉由焊料凸塊以安 法；以及 乃 3所不之具體例的 曰圖6A至6F顯示一使用焊球以取代圖 焊片之情況的具體例。 【主要元件符號說明】 實質矩形矽基板 凹洞區域 半導體晶片安裝區域 分段電極 安裝半導體晶片 312XP/發明說明書(補件)/96-12/96140205 20 200820360 6 端電極 7 金（Au)鍍層 8 金-錫焊粒 10 碎晶圓 12 光阻 12a 開口 12b 開口 12c 開口 14 子L 16 孔 18 凹洞 20 分段電極 22 端電極 24 凸塊 26 焊片 28 錫-金基焊料共熔合金 28a 上表面 30 電子零件 32 接合線 34 焊料凸塊 40 佈置罩幕 42 錫基焊球 44 錫-金基焊料共熔合金 44a 上表面 312XP/發明說明書(補件)/96-12/96140205 21

Claims (1)

  1. 200820360 十、申請專利範圍： 1::種焊接表面之形成方法，包括下列步驟： 形成一金凸塊於一基板之一電極的表面上； 放置一錫基焊片於該金凸塊上； 使~錫基知片與该金凸塊經歷回流焊接，以形成一金一 、 錫共熔合金；以及 平滑化該共熔合金。 • 2.如申請專利範圍第1項之焊接表面之形成方法，其中 在該基板上之複數個電極的個別表面上形成一個或複 數個金凸塊； 放置一錫基焊片，以便分別與該複數個金凸塊接觸；以 及 使該錫基焊片及該複數個金凸塊經歷回流焊接’以形成 一金-錫共熔合金。 3·—種焊接表面之形成方法，包括下列步驟： • 形成一金凸塊於一基板之一電極的表面上； 施加複數個錫基焊球至該等金凸塊； 使该等錫基焊球與該等金凸塊經歷回流焊接，以形成一 ^ 金—錫共熔合金；以及 平滑化該共熔合金。 4·如申請專利範圍第3項之焊接表面之形成方法，其中 在該基板上之複數個電極的個別表面上形成一個或複 數個金凸塊；以及 藉由使用一具有複數個尺寸能使該等個別錫基焊球通 312XP/發明說明書(補件)/9642/96140205 22 200820360 k之、、、田孔的佈置罩幕，將該等錫基焊球經由該佈置罩幕之 細孔施加至一形成該複數個金凸塊之區域。 5」如申請專利範圍帛1項之焊接表面之形成方法，其中 藉由一接合機形成該等金凸塊。 6.—種電子零件安裝於基板之方法，包括下列步驟： 形成一金凸塊於一基板之一電極的表面上； 放置一錫基焊片於該金凸塊上； 使X錫基焊片與该金凸塊經歷回流焊接，以形成一金一 錫共溶合金； 平滑化該共、熔合金；以及 接合一電子零件於該平滑共熔合金之表面上。 7·如申請專利範圍第6項之電子零件 方 法，其中 由複數個電極之表面形成一用以安裝一電子零件之分 段電極； 在《亥等個別電極表面上形成—個或複數個金凸塊； 放置-錫基焊片’以便分別與該複數個金凸塊接觸；以 及 =該錫基烊片與該複數個金凸塊經歷回流焊接，以形成 一金-錫共熔合金。 i種電子零件安裝於基板之方法，包括下列步驟： 形成一金凸塊於一基板之一電極的表面 施加複數個錫基焊球至該等金凸塊； ， 使該等錫基焊球與該等金凸塊經細流焊接，以形成- 312XP/發明翻書(補件)/96-12/96140205 23 200820360 金-錫共熔合金； 面 平滑化該共熔合金；以及 接合-電子零件至該平滑共炫合金之表 法9.=請專利範圍第8項之電子零件安-裝於基板之方 段電極； =數個電極之表面形成-用以安裝-電子零件之分 籲iin㈣極表面上形成—個或複數個金凸塊；以及 過“孔的：复數個尺寸能使該等個別錫基焊球通 孔的佈置罩幕’將該等錫基焊球經由該佈置罩幕之 細孔施加至一形成該複數個金凸塊之區域。 Η).如申請專利範圍f 6項之電子零件安裝於基板之方 該基板係-具有一凹洞之石夕基板，其中該基板之周圍部 刀係形成為一框架及其中在一中心凹處形成該電極表面; 在°亥凹處内之中心开）成該用以安裝-電子零件之分段 電極； 在该凹處内之分段電極周圍形成複數個電極；以及 兩在接合該電子零件至該共熔合金之表面上後，使該電子 令件及该複數個端電極經歷打線接合。 11.如申請專利範圍第3項之烊接表面之形成方法，豆 中 ，、 藉由一接合機形成該等金凸塊。 12·如申請專利範圍第8項之電子零件安裝於基板之方 312ΧΡ/發明說明書(補件)/96-12/96140205 24 200820360 法，其中 該基板係一具有一凹、、π * y V w . . , / U之矽基板，其中該基板之周圍部 /刀係形成為一框架及其中 1 h ^ τ在一中心凹處形成該電極表面； 電極· 形成该用以安裝一電子零件之分段 '在該凹處内之分段電極周圍形成複數個電極；以及 +在接口 4¾子令件至該共溶合金之表面上後，使該電子 馨夺件及該複數個端電極經歷打線接合。 13·如申明專利範圍帛丨項之焊接表面之形成方法，其 、使用錫（Sn) 一金（Au)基焊片、一錫（sn) 一銀（Ag)基焊片 或一錫（Sn)-銀（Ag)-銅（Cu)基焊片以取代一錫基焊片。 14·如申請專利範圍第2項之焊接表面之形成方法，豆 中 ^ 使用一錫-金基焊片、一錫-銀基焊片或一錫-銀一銅基焊 _片以取代一錫基焊片。 15·如申請專利範圍第6項之電子零件安裝於基板之方 法，其中 使用一錫-金基焊片、一錫-銀基焊片或一錫—銀一銅基焊 片以取代一錫基焊片。 16·如申請專利範圍第7項之電子零件安裝於基板之方 法，其中 使用一錫-金基焊片、一錫-銀基焊片或一錫—銀一銅基焊 片以取代一錫基焊片。 312XP/發明說明書(補件)/96-12/96140205 25 200820360 17. 如申請專利範圍第1項之焊接表面之形成方法，其 中 該錫基焊料之材料係Sn3. OAgO. 5Cu。 18. 如申請專利範圍第3項之焊接表面之形成方法，其 中 該錫基焊料之材料係Sn3、OAgO. 5Cu。 19. 如申請專利範圍第6項之電子零件安裝於基板之方 法，其中 該錫基焊料之材料係Sn3. OAgO. 5Cu。 20. 如申請專利範圍第8項之電子零件安裝於基板之方 法，其中 該錫基焊料之材料係Sn3. OAgO. 5Cu。
    312XP/發明說明書(補件)/9642/96140205 26
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CN113272943A (zh) * 2019-01-15 2021-08-17 佳能机械株式会社 焊料平坦化装置、芯片接合机、焊料平坦化方法、以及接合方法
CN113272943B (zh) * 2019-01-15 2022-04-26 佳能机械株式会社 焊料平坦化方法及装置、芯片接合机、以及接合方法

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